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TDF8599TD/N2,512

TDF8599 - I2C-bus controlled dual channel 43 W/2 Ohm single channel85 W/1 Ohm class-D power amplifier with load diagnostics SOIC 36-Pin

器件类别：模拟混合信号IC    消费电路   

厂商名称：NXP(恩智浦)

厂商官网：https://www.nxp.com

器件标准：

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参数 预览 参数对比
器件参数
参数名称
属性值
Brand Name
NXP Semiconductor
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
SOIC
包装说明
PLASTIC, SOT851-2, HSOP-36
针数
36
制造商包装代码
SOT938-1
Reach Compliance Code
unknown
标称带宽
20 kHz
商用集成电路类型
AUDIO AMPLIFIER
增益
26 dB
谐波失真
10%
JESD-30 代码
R-PDSO-G36
长度
15.9 mm
信道数量
2
功能数量
1
端子数量
36
最高工作温度
85 °C
最低工作温度
-40 °C
标称输出功率
70 W
封装主体材料
PLASTIC/EPOXY
封装代码
SSOP
封装等效代码
SSOP36,.56
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, SHRINK PITCH
电源
14.4 V
认证状态
Not Qualified
座面最大高度
3.6 mm
最大压摆率
120 mA
最大供电电压 (Vsup)
18 V
最小供电电压 (Vsup)
8 V
表面贴装
YES
技术
BCDMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
宽度
11 mm
文档预览
TDF8599
I
2
C-bus controlled dual channel 43 W/2
Ω
single channel
85 W/1
Ω
class-D power amplifier with load diagnostics
Rev. 02 — 30 July 2009
Product data sheet
1. General description
The TDF8599 is a dual Bridge-Tied Load (BTL) car audio amplifier comprising an
NDMOST-NDMOST output stage based on SOI BCDMOS technology. Low power
dissipation enables the TDF8599 high-efficiency, class-D amplifier to be used with a
smaller heat sink than those normally used with standard class-AB amplifiers.
The TDF8599 can operate in either non-I
2
C-bus mode or I
2
C-bus mode. When in I
2
C-bus
mode, DC load detection results and fault conditions can be easily read back from the
device. Up to five I
2
C-bus addresses can be selected depending on the value of the
external resistor connected to pins ADS and MOD.
When pin ADS is short circuited to pin AGND, the TDF8599 operates in non-I
2
C-bus
mode. Switching between Operating mode and Mute mode in non-I
2
C-bus mode is only
possible using pins EN and SEL_MUTE.
2. Features
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
High-efficiency
Low quiescent current
Operating voltage from 8 V to 18 V
Two 4
Ω/2 Ω
capable BTL channels or one 1
Ω
capable BTL channel
Differential inputs
Supports I
2
C-bus mode with five I
2
C-bus addresses or non-I
2
C-bus mode operation
Clip detect
Independent short circuit protection for each channel
Advanced short circuit protection for load, GND and supply
Load dump protection
Thermal foldback and thermal protection
DC offset protection
Selectable AD or BD modulation
Parallel channel mode for high current drive capability
Advanced clocking:
N
Switchable oscillator clock source: internal for Master mode or external for Slave
mode
N
Spread spectrum mode
N
Phase staggering
N
Frequency hopping
I
No ‘pop noise’ caused by DC output offset voltage
NXP Semiconductors
TDF8599
I
2
C-bus controlled dual channel class-D power amplifier
I
I
2
C-bus mode:
N
DC load detection
N
AC load detection
N
Thermal pre-warning diagnostic level setting
N
Identification of activated protections or warnings
N
Selectable diagnostic information available using pin DIAG and pin CLIP
I
Qualified in accordance with AEC-Q100
3. Applications
I
Car audio
4. Quick reference data
Table 1.
Quick reference data
V
P
= 14.4 V unless otherwise stated.
Symbol
V
P
I
stb
I
q(tot)
P
o
Parameter
supply voltage
standby current
total quiescent current
output power
voltage on pin EN < 0.8 V
Operating mode; no load, snubbers and
filter connected
Stereo mode
THD = 1 %; R
L
= 4
Ω
THD = 10 %; R
L
= 4
Ω
square wave (EIAJ); R
L
= 4
Ω
THD = 1 %; R
L
= 2
Ω
THD = 10 %; R
L
= 2
Ω
square wave (EIAJ); R
L
= 2
Ω
Parallel mode
THD = 10 %; R
L
= 1
Ω
[1]
[2]
In this data sheet, V
P1
, V
P2
and V
PA
are all described as V
P
.
Output power is measured indirectly based on R
DSon
measurement.
[2]
[2]
Conditions
[1]
Min
8
-
-
Typ
14.4
-
90
Max
18
10
120
Unit
V
µA
mA
18
24
-
29
39
-
-
20
26
40
32
43
70
85
-
-
-
-
-
-
-
W
W
W
W
W
W
W
5. Ordering information
Table 2.
Ordering information
Package
Name
TDF8599TH
TDF8599TD
HSOP36
HSOP36
Description
plastic, heatsink small outline package; 36 leads; low stand-off height
plastic, heatsink small outline package; 36 leads; low stand-off height
Version
SOT851-2
SOT938-1
Type number
TDF8599_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 30 July 2009
2 of 53
NXP Semiconductors
TDF8599
I
2
C-bus controlled dual channel class-D power amplifier
6. Block diagram
V
DDA
10
9
8
DRIVER
HIGH
PWM
CONTROL
IN1P
1
DRIVER
LOW
PGND1
V
P1
IN1N
2
PWM
CONTROL
DRIVER
LOW
ACGND
5
+
V
P1
31
V
P2
24
AGND
SVRR
STABI1
34
32
V
P1
VSTAB1
BOOT1N
TDF8599
33
OUT1N
29
BOOT1P
DRIVER
HIGH
28
OUT1P
PGND1
V
P2
DRIVER
HIGH
PWM
CONTROL
23
BOOT2N
22
DRIVER
LOW
PGND2
V
P2
26
OUT2N
IN2P
3
BOOT2P
IN2N
4
PWM
CONTROL
DRIVER
HIGH
27
DRIVER
LOW
OUT2P
OSCSET
OSCIO
SSM
MOD
V
DDD
EN
SEL_MUTE
SCL
SDA
ADS
18
19
17
12
35
6
7
16
15
11
36
GNDD/HW
14
DIAG
13
20
MODE
SELECT
+
I
2
C-BUS
DIAGNOSTICS
OSCILLATOR
PGND2
5 V STABI
STABI2
21
VSTAB2
PROTECTION
OVP, OCP, OTP,
UVP, TFP,
WP,DCP.
30
PGND1
25
PGND2
001aai766
CLIP DCP
Fig 1.
Block diagram
TDF8599_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 30 July 2009
3 of 53
NXP Semiconductors
TDF8599
I
2
C-bus controlled dual channel class-D power amplifier
7. Pinning information
7.1 Pinning
GNDD/HW 36
V
DDD
35
VSTAB1 34
OUT1N 33
BOOT1N 32
V
P1
31
PGND1 30
BOOT1P 29
OUT1P 28
OUT2P 27
BOOT2P 26
PGND2 25
V
P2
24
BOOT2N 23
OUT2N 22
VSTAB2 21
DCP 20
OSCIO 19
001aai767
1
2
3
4
5
6
7
8
IN1P
IN1N
IN2P
IN2N
ACGND
EN
SEL_MUTE
SVRR
AGND
TDF8599TH
9
10 V
DDA
11 ADS
12 MOD
13 CLIP
14 DIAG
15 SDA
16 SCL
17 SSM
18 OSCSET
Fig 2.
Heatsink up (top view) pin configuration TDF8599TH
TDF8599_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 30 July 2009
4 of 53
NXP Semiconductors
TDF8599
I
2
C-bus controlled dual channel class-D power amplifier
IN1P
IN1N
IN2P
IN2N
ACGND
EN
SEL_MUTE
SVRR
AGND
1
2
3
4
5
6
7
8
9
36 GNDD/HW
35 V
DDD
34 VSTAB1
33 OUT1N
32 BOOT1N
31 V
P1
30 PGND1
29 BOOT1P
TDF8599TD
28 OUT1P
27 OUT2P
26 BOOT2P
25 PGND2
24 V
P2
23 BOOT2N
22 OUT2N
21 VSTAB2
20 DCP
19 OSCIO
V
DDA
10
ADS 11
MOD 12
CLIP 13
DIAG 14
SDA 15
SCL 16
SSM 17
OSCSET 18
001aai768
Fig 3.
Heatsink down (top view) pin configuration TDF8599TD
7.2 Pin description
Table 3.
Symbol
IN1P
IN1N
IN2P
IN2N
ACGND
EN
Pin description
Pin
1
2
3
4
5
6
Type
[1]
I
I
I
I
I
I
Description
channel 1 positive audio input
channel 1 negative audio input
channel 2 positive audio input
channel 2 negative audio input
decoupling for input reference voltage
enable input:
non-I
2
C-bus mode: switch between off and Mute mode
I
2
C-bus mode: off and Standby mode
SEL_MUTE
SVRR
AGND
V
DDA
ADS
MOD
TDF8599_2
7
8
9
10
11
12
I
I
G
P
I
I
select mute or unmute
decoupling for internal half supply reference voltage
analog supply ground
analog supply voltage
non-I
2
C-bus mode: connected to pin AGND
I
2
C-bus mode: selection and address selection pin
modulation mode, phase shift and parallel mode select
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 30 July 2009
5 of 53
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参数对比
与TDF8599TD/N2,512相近的元器件有：TDF8599TH/N2,512、TDF8599TH/N2,518、TDF8599TD/N2,518、935282127518、935286782512、935287028518、935286782518、TDF8599TH/N2/S480。描述及对比如下：
型号 TDF8599TD/N2,512 TDF8599TH/N2,512 TDF8599TH/N2,518 TDF8599TD/N2,518 935282127518 935286782512 935287028518 935286782518 TDF8599TH/N2/S480
描述 TDF8599 - I2C-bus controlled dual channel 43 W/2 Ohm single channel85 W/1 Ohm class-D power amplifier with load diagnostics SOIC 36-Pin TDF8599 - I2C-bus controlled dual channel 43 W/2 Ohm single channel85 W/1 Ohm class-D power amplifier with load diagnostics SOIC 36-Pin TDF8599 - I2C-bus controlled dual channel 43 W/2 Ohm single channel85 W/1 Ohm class-D power amplifier with load diagnostics SOIC 36-Pin TDF8599 - I2C-bus controlled dual channel 43 W/2 Ohm single channel85 W/1 Ohm class-D power amplifier with load diagnostics SOIC 36-Pin 70W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36, PLASTIC, SOT851-2, HSOP-36 70W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36, PLASTIC, SOT851-2, HSOP-36 70W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36, PLASTIC, SOT851-2, HSOP-36 70W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36, PLASTIC, SOT851-2, HSOP-36 IC,AUDIO AMPLIFIER,DUAL,BCDMOS,SSOP,36PIN,PLASTIC
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36 PLASTIC, SOT851-2, HSOP-36
Reach Compliance Code unknown compliant compliant unknown unknown unknown unknown unknown compliant
标称带宽 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz
商用集成电路类型 AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER
增益 26 dB 26 dB 26 dB 26 dB 26 dB 26 dB 26 dB 26 dB 26 dB
谐波失真 10% 10% 10% 10% 10% 10% 10% 10% 10%
JESD-30 代码 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36 R-PDSO-G36
长度 15.9 mm 15.9 mm 15.9 mm 15.9 mm 15.9 mm 15.9 mm 15.9 mm 15.9 mm 15.9 mm
信道数量 2 2 2 2 2 2 2 2 2
功能数量 1 1 1 1 1 1 1 1 1
端子数量 36 36 36 36 36 36 36 36 36
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
标称输出功率 70 W 70 W 70 W 70 W 70 W 70 W 70 W 70 W 70 W
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SSOP SSOP SSOP HSSOP HSSOP HSSOP HSSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
座面最大高度 3.6 mm 3.5 mm 3.5 mm 3.6 mm 3.5 mm 3.5 mm 3.6 mm 3.5 mm 3.5 mm
最大供电电压 (Vsup) 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V
最小供电电压 (Vsup) 8 V 8 V 8 V 8 V 8 V 8 V 8 V 8 V 8 V
表面贴装 YES YES YES YES YES YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
宽度 11 mm 11 mm 11 mm 11 mm 11 mm 11 mm 11 mm 11 mm 11 mm
是否Rohs认证 符合 符合 符合 符合 - - - - 符合
封装等效代码 SSOP36,.56 SSOP36,.56 SSOP36,.56 SSOP36,.56 - - - - SSOP36,.56
电源 14.4 V 14.4 V 14.4 V 14.4 V - - - - 14.4 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - - - - Not Qualified
最大压摆率 120 mA 120 mA 120 mA 120 mA - - - - 120 mA
技术 BCDMOS BCDMOS BCDMOS BCDMOS - - - - BCDMOS
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器件捷径:
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