型号
- 型号
- 关键词
Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24
| 型号 | THA-05203-310 | THA-05203-100 | THA-05203-110 | THA-05203-120 | THA-05203-300 | THA-05203-320 |
|---|---|---|---|---|---|---|
| 描述 | Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, Hybrid, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, Hybrid, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, Hybrid, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, Hybrid, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 | Sample and Hold Circuit, 1 Func, Track, 0.15us Acquisition Time, CDIP24, 1.400 X 0.800 INCH, 0.200 INCH HEIGHT, DOUBLE DIP HERMETIC SEALED, DIP-24 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长采集时间 | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs | 0.2 µs |
| 标称采集时间 | 0.15 µs | 0.15 µs | 0.15 µs | 0.15 µs | 0.15 µs | 0.15 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V |
| 最小模拟输入电压 | -11.5 V | -11.5 V | -11.5 V | -11.5 V | -11.5 V | -11.5 V |
| 最大下降率 | 5 V/s | 5 V/s | 5 V/s | 5 V/s | 5 V/s | 5 V/s |
| JESD-30 代码 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 | R-CDIP-P24 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - |
| 封装等效代码 | - | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | - |
| 电源 | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | - |
| 技术 | - | HYBRID | HYBRID | HYBRID | HYBRID | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
