Express-IBR
Ampro by ADLINK™ Extreme Rugged™
Extreme Rugged™ COM Express
®
Type 6 Computer-on-Module
with 3rd Generation Intel
®
Core™ i7 Processor
Features
Quad/dual core 3rd Generation Intel
®
Core™
Processor
Mobile Intel
®
QM77 Express Chipset
Up to 16GB ECC 1600MHz DDR3 memory in two
SODIMM sockets
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for
graphics (or general purpose x8/4/1)
Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit
Ethernet, eight USB 2.0, 4 USB 3.0
COM Express
®
COM.0 R2.1 Type 6 Pinout
Extended Temperature: -40°C to +85°C
50% Thicker PCB for high vibration environments
Choose Ampro by ADLINK™ Express-IBR for…
A modular and power efficient solution for extreme rugged
and mobile environments.
Description
The Ampro by ADLINK™ Express-IBR is a COM Express
Type 6 module with quad/dual-core 3rd Generation Intel
®
Core™ i7 Processor. The Express-IBR is designed Extreme
Rugged to support the extremes of shock, vibration,
humidity, and temperature.
®
Audio
Chipset
Audio Codec
Integrated on Mobile Intel
®
QM77 Express chipset
Implemented on carrier board
LAN
Chipset
Speed
Intel
®
Gigabit LAN PHY WG82579LM
10/100/1000 Mbps Ethernet
Multi I/O
Chipset
USB
SATA
Integrated on Mobile Intel
®
QM77 Express chipset
Supports up to eight ports USB 2.0, 4 USB 3.0
Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID
0,1,5,10
Specifications
Core System
CPU
3rd Generation Intel
®
Core™ i7/i3, 22nm process, BGA type
Intel
®
Core™ i7-3615QE 2.3GHz (up to 3.3GHz Turbo), 6MB
L3 cache, 45W, quad core
Intel
®
Core™ i7-3612QE 2.1GHz (up to 3.1GHz Turbo), 6MB
L3 cache, 35W, quad core
Intel
®
Core™ i7-3555LE 2.5GHz (up to 3.2GHz Turbo), 4MB
L3 cache, 25W, dual core
Intel
®
Core™ i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB
L3 cache, 17W, dual core
Intel
®
Core™ i3-3217UE 1.6GHz, 3MB
L3 cache, 17W, dual core
Dual channel ECC 1600 MHz DDR3 memory up to 16 GB in
dual SODIMM sockets
AMI EFI with CMOS backup in 16 Mb SPI flash
Supply voltages and CPU temperature
XDP SFF-26 extension for ICE debug
Programmable timer range to generate RESET
PCI Express x16 (Gen3) bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
7 PCI Express x1: Lanes 0/1/2/3/4/5/6
LPC bus, SMBus (system), I
2
C (user)
PAVP 3.0, Intel
®
AMT 8.0, Intel
®
VT, Intel
®
AES-NI, Intel
®
HT,
Intel
®
HD Graphics with Dynamic Frequency, Intel
®
Turbo
Boost , Dynamic Turbo, Intel
®
AVX 1.0, Intel
®
Quick Sync Video
Intel
®
HD Graphics 4000 at 650-1300 MHz
DirectX 11.0, OpenGL 3.1, and OCL 1.1
Decode (HW JPEG & MJPEG decode), encode (full HW MPEG2
encode), transcode
Intel
®
Clear Video HD Technology + enhanced media processing
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug
Dual channel 18/24-bit LVDS
Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO
Super I/O
Connected to LPC bus on carrier if needed (BIOS supports
W83627DHG)
TPM
Chipset
Type
Atmel AT97SC3204
TPM 1.2
Power Specifications
Input Power
Power States
Power Consumption
AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Supports S0, S1, S3, S4, S5
12W typical (i7-36xxQE)
8W typical (i7-3555LE/i7-3517UE/i3-3217UE)
S3: 0.85W
S5: 0.55W
Yes (BIOS supports LTC4100 and LTC1760)
Memory
BIOS
Hardware Monitor
Debug Interface
Watchdog Timer
Expansion Busses
Smart Battery Support
Mechanical and Environmental
Size
Board Thickness
Operating Temp. Standard
Operating Temp. Extended
Storage Temp.
Humidity
Shock
Vibration
Compatibility
Certifications
COM Express Basic, 125 mm x 95 mm
0.093” (2.3mm)
-20°C to 70°C
-40°C to 85°C
-55°C to 85°C
90% at 60°C non-condensing
50G peak-to-peak, 11ms duration, MIL-STD-202G Method
213B
Operating: 11.96 Grms, 50-20,000 Hz, each axis,
MIL-STD-202G Method 214A
PICMG COM Express COM.0 R2.1 Type 6
CE, FCC, HALT
Technologies
Video
Integrated in Processor
Integrated Video
Media Processing
Operating Systems
Standard Support
Windows 7
Linux
Extended Support (BSP) WES 2009/7, WEC 7
Linux, VxWorks 6.9, QNX 6.5
AIDI Library
VGA Interface
LVDS Interface
Digital Display Interface
http://www.adlinktech.com/ampro/
Functional Diagram
SODIMM 1
Processor
SFF26
1600 MHz
1~8 GB ECC DDR3
XDP
3rd Gen
Intel
®
Core™
i7 Processor
Quad & Dual Core
SODIMM 2
1600 MHz
1~8 GB ECC DDR3
PCI Express x16 (Gen2)
2 x8 or 1x8 + 2x4
VGA
Dual channel 18/24-bit LVDS
6x PCIe x1
(port 0~5)
GbE LAN
82579
HDA Audio
2x SATA 6 Gb/s + 2x SATA 3 Gb/s
8x USB 2.0 (channel 0/7)
TPM
AT97SC3204
DMI
FDI
DDI 1
DP / HDMI / DVI / SDVO
DDI 2
DP / HDMI / DVI
PCIe x1
(port 7)
PCH
Mobile Intel QM77
Express Chipset
®
DDI 3
DP / HDMI / DVI / eDP
4x USB 3.0
PCIe x1
(port 6)
Debug
header
LPC bus
4x GPI
4x GP0
SMBus
I
2
C
LVDS DDC I
2
C
WDT
SPI
BC
GPIO
PCA9535
Monitor
ADT7490
SPI 0
BIOS
SPI 1
Ordering Information
Modules
Model Number
Express-IBR-i7-R-3615QE
Accessories
Description/Configuration
Extreme Rugged COM Express Type 6 module with Intel
®
Core™ i7-3615QE 2.3GHz 45W Quad Core CPU, two
DDR3 ECC SODIMMs supported
Model Number
HTS-IBR-BTF
HTS-IBR-B
Description/Configuration
Heat spreader for Express-IBR with through-hole standoffs
for top-mounting
Heat spreader for Express-IBR with threaded standoffs for
bottom-mounting
Heatsink for Express-IBR with through-hole standoffs for
top-mounting
Heatsink with FAN for Express-IBR with through-hole
standoffs for top-mounting
Heat Spreaders
(for use with customer supplied thermal solution)
Express-IBR- i7-R-3612QE
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i7-3612QE 2.1GHz 35W Quad Core CPU ,
two DDR3 ECC SODIMMs supported
Express-IBR-i7-R-3555LE
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i7-3555LE 2.5GHz 25W Dual Core CPU,
two DDR3 ECC SODIMMs supported
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i7-3517UE 1.7GHz 17W Dual Core CPU,
two DDR3 ECC SODIMMs supported
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i3-3217UE 1.6GHz 17W Dual Core CPU,
two DDR3 ECC SODIMMs supported
Starterkit with 2x2GB DDR3 ECC SODIMM, non-ETT,
Cables, BSP/driver in USB stick and manuals
Passive Heatsinks
(for use with 17 and 25W CPUs)
THSH-IBR-BTL
Express-IBR-i7-R-3517UE
Active Heatsinks
(recommended for 35 and 45W CPUs)
THSF-IBR-BTL-CU
Express-IBR-i3-R-3217UE
Express-IBR-L
