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TLC393

TLC393 Dual, Micropower, LinCMOS™ Voltage Comparator

器件类别:半导体    模拟混合信号IC   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

器件标准:

敬请期待
器件参数
参数名称
属性值
Propagation delay time(uS)
1
Package Group
PDIP|8,SOIC|8,SO|8,TSSOP|8
Approx. price(US$)
0.40 | 1ku
Features
N/A
Vs(Min)(V)
3
Rating
Catalog
Rail-to-rail
Out
Input bias current (+/-)(Max)(nA)
0.002
Vs(Max)(V)
16
Iq per channel(Max)(mA)
0.02
Vos (offset voltage @ 25 C)(Max)(mV)
5
Output type
Open Collector
Iq per channel(Typ)(mA)
0.011
VICR(Max)(V)
15
Number of channels(#)
2
Operating temperature range(C)
-40 to 125,-40 to 85,0 to 70
VICR(Min)(V)
0
参数对比
与TLC393相近的元器件有:TLC393QDRG4、TLC393IPWG4、TLC393CPSG4、5962-9555101NXDR、5962-9555101QPA、TLC193MJGB、TLC193。描述及对比如下:
型号 TLC393 TLC393QDRG4 TLC393IPWG4 TLC393CPSG4 5962-9555101NXDR 5962-9555101QPA TLC193MJGB TLC193
描述 TLC393 Dual, Micropower, LinCMOS™ Voltage Comparator Dual, Micropower, LinCMOS™ Voltage Comparator 8-SOIC Dual, Micropower, LinCMOS™ Voltage Comparator 8-TSSOP -40 to 85 Analog Comparators Dual,Micropower,Lin CMOS Vltg Comparator Dual Micropower LinCMOS™ Comparator 8-SOIC Dual Micropower LinCMOS™ Comparator 8-CDIP -55 to 125 Dual Micropower LinCMOS™ Comparator 8-CDIP -55 to 125 TLC193 Dual Micropower LinCMOS™ Comparator
Brand Name - Texas Instruments Texas Instruments - Texas Instruments Texas Instruments Texas Instruments -
零件包装代码 - SOIC SOIC - SOIC DIP DIP -
包装说明 - SOIC-8 TSSOP, TSSOP8,.25 - SOP, DIP, DIP8,.3 DIP, DIP8,.3 -
针数 - 8 8 - 8 8 8 -
Reach Compliance Code - compliant compliant - compliant not_compliant not_compliant -
ECCN代码 - EAR99 EAR99 - EAR99 EAR99 EAR99 -
Factory Lead Time - 6 weeks 6 weeks - 6 weeks 6 weeks 1 week -
放大器类型 - COMPARATOR COMPARATOR - COMPARATOR COMPARATOR COMPARATOR -
最大平均偏置电流 (IIB) - 0.000002 µA 0.002 µA - 0.00003 µA 0.00003 µA 0.03 µA -
最大输入失调电压 - 10000 µV 7000 µV - 10000 µV 10000 µV 10000 µV -
JESD-30 代码 - R-PDSO-G8 R-PDSO-G8 - R-PDSO-G8 R-GDIP-T8 R-GDIP-T8 -
长度 - 4.9 mm 4.4 mm - 4.9 mm 9.58 mm 9.58 mm -
功能数量 - 2 2 - 2 2 2 -
端子数量 - 8 8 - 8 8 8 -
最高工作温度 - 125 °C 85 °C - 125 °C 125 °C 125 °C -
最低工作温度 - -40 °C -40 °C - -55 °C -55 °C -55 °C -
输出类型 - OPEN-DRAIN OPEN-DRAIN - OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN -
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED -
封装代码 - SOP TSSOP - SOP DIP DIP -
封装形状 - RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE IN-LINE IN-LINE -
峰值回流温度(摄氏度) - 260 260 - 260 NOT SPECIFIED NOT SPECIFIED -
认证状态 - Not Qualified Not Qualified - Not Qualified Qualified Not Qualified -
标称响应时间 - 2500 ns 2500 ns - 2500 ns 2500 ns 2500 ns -
座面最大高度 - 1.75 mm 1.2 mm - 1.75 mm 5.08 mm 5.08 mm -
最大压摆率 - 0.02 mA 0.02 mA - 0.04 mA 0.02 mA 0.02 mA -
供电电压上限 - 18 V 18 V - 18 V 18 V 18 V -
标称供电电压 (Vsup) - 5 V 5 V - 5 V 5 V 5 V -
表面贴装 - YES YES - YES NO NO -
技术 - CMOS CMOS - CMOS CMOS CMOS -
温度等级 - AUTOMOTIVE INDUSTRIAL - MILITARY MILITARY MILITARY -
端子形式 - GULL WING GULL WING - GULL WING THROUGH-HOLE THROUGH-HOLE -
端子节距 - 1.27 mm 0.65 mm - 1.27 mm 2.54 mm 2.54 mm -
端子位置 - DUAL DUAL - DUAL DUAL DUAL -
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
宽度 - 3.9 mm 3 mm - 3.9 mm 7.62 mm 7.62 mm -
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