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TM497FBK32I-70

4MX32 EDO DRAM MODULE, 70ns, QMA72, SIMM-72

器件类别:存储    存储   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

敬请期待
器件参数
参数名称
属性值
厂商名称
Texas Instruments(德州仪器)
零件包装代码
QMA
包装说明
SIMM, SSIM72
针数
72
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE WITH EDO
最长访问时间
70 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型
COMMON
JESD-30 代码
R-XQMA-N72
内存密度
134217728 bit
内存集成电路类型
EDO DRAM MODULE
内存宽度
32
功能数量
1
端口数量
1
端子数量
72
字数
4194304 words
字数代码
4000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
4MX32
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装代码
SIMM
封装等效代码
SSIM72
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
电源
5 V
认证状态
Not Qualified
刷新周期
2048
座面最大高度
25.4 mm
自我刷新
NO
最大待机电流
0.008 A
最大压摆率
0.8 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
QUAD
参数对比
与TM497FBK32I-70相近的元器件有:TM497FBK32H-70、TM497FBK32R-50、TM497FBK32G-60、TM497FBK32I-50、TM497FBK32H-50、TM893GBK32I-70、TM893GBK32I-50、TM893GBK32H-70。描述及对比如下:
型号 TM497FBK32I-70 TM497FBK32H-70 TM497FBK32R-50 TM497FBK32G-60 TM497FBK32I-50 TM497FBK32H-50 TM893GBK32I-70 TM893GBK32I-50 TM893GBK32H-70
描述 4MX32 EDO DRAM MODULE, 70ns, QMA72, SIMM-72 4MX32 EDO DRAM MODULE, 70ns, QMA72, SIMM-72 4MX32 EDO DRAM MODULE, 50ns, SMA72, SIMM-72 4MX32 EDO DRAM MODULE, 60ns, SMA72, SIMM-72 4MX32 EDO DRAM MODULE, 50ns, QMA72, SIMM-72 4MX32 EDO DRAM MODULE, 50ns, QMA72, SIMM-72 8MX32 EDO DRAM MODULE, 70ns, QMA72, SIMM-72 4MX32 EDO DRAM MODULE, 50ns, QMA72, SIMM-72 4MX32 EDO DRAM MODULE, 70ns, QMA72, SIMM-72
厂商名称 Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器) Texas Instruments(德州仪器)
零件包装代码 QMA QMA SIMM SIMM QMA QMA QMA QMA QMA
包装说明 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM-72 SIMM-72 SIMM-72
针数 72 72 72 72 72 72 72 72 72
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
最长访问时间 70 ns 70 ns 50 ns 60 ns 50 ns 50 ns 70 ns 50 ns 70 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY, CAS BEFORE RAS, HIDDEN REFRESH RAS ONLY, CAS BEFORE RAS, HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-XQMA-N72 R-XQMA-N72 R-XSMA-N72 R-XSMA-N72 R-XQMA-N72 R-XQMA-N72 R-XQMA-N72 R-XQMA-N72 R-XQMA-N72
内存密度 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit 268435456 bit 134217728 bit 134217728 bit
内存集成电路类型 EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE
内存宽度 32 32 32 32 32 32 32 32 32
功能数量 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1
端子数量 72 72 72 72 72 72 72 72 72
字数 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 4194304 words 8388608 words 4194304 words 4194304 words
字数代码 4000000 4000000 4000000 4000000 4000000 4000000 8000000 4000000 4000000
工作模式 SYNCHRONOUS SYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 4MX32 4MX32 4MX32 4MX32 4MX32 4MX32 8MX32 4MX32 4MX32
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
封装等效代码 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 2048 2048 2048 2048 2048 2048 2048 2048 2048
座面最大高度 25.4 mm 25.4 mm 25.527 mm 25.527 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm
自我刷新 NO NO NO NO NO NO NO NO NO
最大待机电流 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.016 A 0.016 A 0.016 A
最大压摆率 0.8 mA 0.8 mA 0.96 mA 0.88 mA 1.04 mA 1.04 mA 1.6 mA 2.08 mA 1.6 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES NO NO YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 QUAD QUAD SINGLE SINGLE QUAD QUAD QUAD QUAD QUAD
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