型号
- 型号
- 关键词
Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -40 to 85
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | TMS320C5532AZHHA05 | TMX320C5535AZHH10 | TMS320C5532AZHH10 | TMS320C5535AZHH10 |
|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -40 to 85 | Digital Signal Processors & Controllers - DSP, DSC C5515 Value Line | Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -10 to 70 | Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -10 to 70 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | BGA-144 | 12 X 12 MM, PLASTIC, BGA-144 | BGA-144 | BGA-144 |
| 针数 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | compliant | unknow | compli | compliant |
| 桶式移位器 | NO | NO | NO | NO |
| 位大小 | 16 | 16 | 16 | 16 |
| 边界扫描 | YES | YES | YES | YES |
| 最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 |
| 长度 | 12 mm | 12 mm | 12 mm | 12 mm |
| 低功率模式 | YES | YES | YES | YES |
| 端子数量 | 144 | 144 | 144 | 144 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA144,14X14,32 | BGA144,14X14,32 | BGA144,14X14,32 | BGA144,14X14,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 电源 | 1.05,1.8/3.3 V | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 32768 | 163840 | 32768 | 163840 |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 | 1.15 V | 1.43 V | 1.43 V | 1.43 V |
| 最小供电电压 | 0.998 V | 1.24 V | 1.24 V | 1.24 V |
| 标称供电电压 | 1.05 V | 1.3 V | 1.3 V | 1.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 12 mm | 12 mm | 12 mm | 12 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 |
| ECCN代码 | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 6 weeks | - | 1 week | 12 weeks |
| 集成缓存 | NO | - | NO | NO |
| JESD-609代码 | e1 | - | e1 | e1 |
| 湿度敏感等级 | 3 | - | 3 | 3 |
| DMA 通道数量 | 16 | - | 16 | 16 |
| 外部中断装置数量 | 2 | - | 2 | 2 |
| 计时器数量 | 4 | - | 4 | 4 |
| 片上数据RAM宽度 | 8 | - | 8 | 8 |
| 片上程序ROM宽度 | 8 | - | 8 | 8 |
| 最高工作温度 | 85 °C | - | 70 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -10 °C | -10 °C |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 |
| ROM可编程性 | MROM | - | MROM | MROM |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 其他特性 | - | IT ALSO OPERATES AT 1.05 V AT 50 MHZ | IT ALSO OPERATES AT 1.05 V AT 50 MHZ | IT ALSO OPERATES AT 1.05 V AT 50 MHZ |
