描述 |
Floating-Point Digital Signal Processor 272-BGA |
Floating-Point Digital Signal Processor 208-HLQFP |
Floating-Point Digital Signal Processor 272-BGA |
Floating-Point Digital Signal Processor 208-HLQFP |
Floating-Point Digital Signal Processor 208-HLQFP |
Floating-Point Digital Signal Processor 272-BGA |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
含铅 |
含铅 |
含铅 |
含铅 |
含铅 |
含铅 |
是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
零件包装代码 |
BGA |
QFP |
BGA |
QFP |
QFP |
BGA |
包装说明 |
BGA, BGA272,20X20,50 |
HLFQFP, QFP208,1.2SQ,20 |
27 X 27 MM, PLASTIC, BGA-272 |
HLFQFP, QFP208,1.2SQ,20 |
HLFQFP, QFP208,1.2SQ,20 |
BGA, BGA272,20X20,50 |
针数 |
272 |
208 |
272 |
208 |
208 |
272 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
_compli |
其他特性 |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 |
22 |
22 |
22 |
22 |
22 |
22 |
桶式移位器 |
NO |
NO |
NO |
NO |
NO |
NO |
位大小 |
32 |
32 |
32 |
32 |
32 |
32 |
边界扫描 |
YES |
YES |
YES |
YES |
YES |
YES |
外部数据总线宽度 |
32 |
32 |
32 |
32 |
32 |
32 |
格式 |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
内部总线架构 |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
JESD-30 代码 |
S-PBGA-B272 |
S-PQFP-G208 |
S-PBGA-B272 |
S-PQFP-G208 |
S-PQFP-G208 |
S-PBGA-B272 |
长度 |
27 mm |
28 mm |
27 mm |
28 mm |
28 mm |
27 mm |
低功率模式 |
YES |
YES |
YES |
YES |
YES |
YES |
端子数量 |
272 |
208 |
272 |
208 |
208 |
272 |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
BGA |
HLFQFP |
BGA |
HLFQFP |
HLFQFP |
BGA |
封装等效代码 |
BGA272,20X20,50 |
QFP208,1.2SQ,20 |
BGA272,20X20,50 |
QFP208,1.2SQ,20 |
QFP208,1.2SQ,20 |
BGA272,20X20,50 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
GRID ARRAY |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
GRID ARRAY |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
电源 |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM(字数) |
65536 |
65536 |
65536 |
65536 |
65536 |
65536 |
座面最大高度 |
2.32 mm |
1.6 mm |
2.57 mm |
1.6 mm |
1.6 mm |
2.57 mm |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
端子形式 |
BALL |
GULL WING |
BALL |
GULL WING |
GULL WING |
BALL |
端子节距 |
1.27 mm |
0.5 mm |
1.27 mm |
0.5 mm |
0.5 mm |
1.27 mm |
端子位置 |
BOTTOM |
QUAD |
BOTTOM |
QUAD |
QUAD |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
27 mm |
28 mm |
27 mm |
28 mm |
28 mm |
27 mm |
uPs/uCs/外围集成电路类型 |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
厂商名称 |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
最大供电电压 |
- |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
1.32 V |
最小供电电压 |
- |
1.14 V |
1.2 V |
1.14 V |
1.14 V |
1.2 V |
标称供电电压 |
- |
1.2 V |
1.26 V |
1.2 V |
1.2 V |
1.26 V |