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TSI350A-66CQ

PCI Bus Controller, CMOS, PBGA208, PLASTIC, QFP-208

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Tundra Semiconductor Corp

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器件参数
参数名称
属性值
厂商名称
Tundra Semiconductor Corp
包装说明
FQFP,
Reach Compliance Code
unknown
地址总线宽度
32
总线兼容性
PCI
最大时钟频率
66 MHz
驱动器接口标准
IEEE 1149.1
外部数据总线宽度
32
JESD-30 代码
R-PBGA-B208
长度
28 mm
端子数量
208
最高工作温度
85 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
FQFP
封装形状
RECTANGULAR
封装形式
GRID ARRAY
认证状态
Not Qualified
座面最大高度
4.1 mm
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
BALL
端子节距
0.5 mm
端子位置
BOTTOM
宽度
28 mm
uPs/uCs/外围集成电路类型
BUS CONTROLLER, PCI
文档预览
Title
Tsi350A PCI-to-PCI Bridge
User Manual
Formal
January 2008
80D5000_MA001_06
Trademarks
TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S., and U.K.). TUNDRA,
the Tundra logo, Tsi350A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor
Corporation. All other registered and unregistered marks (including trademarks, service marks and logos) are the
property of their respective owners. The absence of a mark identifier is not a representation that a particular
product name is not a mark.
Copyright
Copyright © January 2008 Tundra Semiconductor Corporation. All rights reserved.
Published in Canada
This document contains information that is proprietary to Tundra and may be used for non-commercial purposes
within your organization in support of Tundra products. No other use or transmission of all or any part of this
document is permitted without written permission from Tundra, and must include all copyright and other
proprietary notices. Use or transmission of all or any part of this document in violation of any applicable
Canadian or other legislation is hereby expressly prohibited.
User obtains no rights in the information or in any product, process, technology or trademark which it includes or
describes, and is expressly prohibited from modifying the information or creating derivative works without the
express written consent of Tundra.
Disclaimer
Tundra assumes no responsibility for the accuracy or completeness of the information presented, which is subject
to change without notice. Tundra products may contain design defects or errors known as errata which may cause
the product to deviate from published specifications. Current characterized errata are available on request. In no
event will Tundra be liable for any direct, indirect, special, incidental or consequential damages, including lost
profits, lost business or lost data, resulting from the use of or reliance upon the information, whether or not
Tundra has been advised of the possibility of such damages. The information contained in this document does
not affect or change Tundra’s product warranties.
Mention of non-Tundra products or services is for information purposes only and constitutes neither an
endorsement nor a recommendation.
As this information will change over time, please ensure you have the most recent version by contacting a
member of the Tundra technical support team, or by checking the Support section of www.tundra.com.
®
3
Corporate Profile
About Tundra
Tundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications,
computing and storage companies with smart System Interconnect products, intellectual property (IP)
and design services backed by world-class customer service and technical support. Tundra’s track
record of product leadership includes over a decade of bridges and switches enabling key industry
standards: RapidIO®, PCI, PCI-X, PCI Express®, PowerPC®, VME, HyperTransport™, Interlaken,
and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout,
with specific focus on system level signal integrity. Tundra's design services division, Silicon Logic
Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual
property and product development consulting. Tundra’s smart technology connects critical components
in high performance embedded systems around the world.
Tundra System Interconnect
Tundra uses the term
System Interconnect
to refer to the technology used to connect all the components
and sub-systems in almost any embedded system. This concept applies to the interfacing of functional
elements (CPU, memory, I/O complexes) within a single-board system, and the interconnection of
multiple boards in a larger system.
Advanced communications networks need advanced System Interconnect. It is a vital enabling
technology for the networked world. Tundra System Interconnect provides the latest interface and
throughput features, which enable communications infrastructure vendors to design and build more
powerful, faster equipment in shorter timeframes.
Tundra System Interconnect — vital to building the communications systems of the future:
Tundra System Interconnect products enable customers to get the performance, scalability, and
reliability from their systems to meet today's and tomorrow's bandwidth demands.
Tundra System Interconnect products are standards-based, off-the-shelf products that help
customers speed their time to market.
Tundra System Interconnect products meet the growing customer demand for outsourced
standards-based interconnect products.
Partnerships
Fundamental to the success of Tundra is its partnerships with leading technology companies, including
IBM, Intel, and Freescale. As a result of these alliances, Tundra devices complement our partners’
products, and greatly influence the design of customers’ architecture. Customers are changing their
designs to incorporate Tundra products. This is evidence of our commitment to be a significant part of
its customers’ success.
Tundra Semiconductor Corporation
www.tundra.com
Tsi350A User Manual
80D5000_MA001_06
4
Corporate Profile
Customers
Tundra Semiconductor products are used by the world’s leading communications infrastructure and
storage vendors, including Cisco Systems, Freescale, Siemens, Nortel Networks, Lucent Technologies,
Nokia, Ericsson, Alcatel, and Hewlett-Packard.
The Tundra design philosophy is one in which a number of strategic customers are invited to
participate in the definition, design, test, and early silicon phases of product development. Close
working relationships with customers and clear product roadmaps ensure that Tundra can anticipate
and meet the future directions and needs of communications systems designers and manufacturers.
Support
Tundra is respected throughout the industry for its outstanding commitment to customer support.
Tundra ensures that its customers can take immediate advantage of the company’s products through its
in-house Applications Engineering Group, unmatched design support tools, and full documentation
accessible through the Web.
Design. Connect. Go
Tsi350A User Manual
80D5000_MA001_06
Tundra Semiconductor Corporation
www.tundra.com
®
5
Contact Information
Tundra is dedicated to providing superior technical documentation and design support to its customers.
The following support options are available:
Web Resources
Product information
www.tundra.com/Tsi350A contains the features, benefits,
typical applications, and block diagram for the Tsi350A. This
webpage also provides links to other product information
located on the Tundra website.
www.tundra.com/support contains an extensive list of technical
resources to assist with your design needs. Some of the key
support resources include:
Technical support FAQ
User documentation
Schematic design checklists and debug guidelines
Technical support resources
You can also opt to receive email notification when a support
resource is added or changed.
Technical support request
To contact Tundra support personnel about a technical
question, fill out the Technical Support Request Form in the
Support section of the website.
www.tundra.com/sales contains information that will help you
locate a Tundra sales representative nearest you.
Sales support
Other Resources
Email
docfeedback@tundra.com can be used to provide feedback
on a Tsi350A customer document.
Tundra Semiconductor Corporation
603 March Road
Ottawa, ON, Canada
K2K 2M5
613-592-1320
Mail
Fax
Tundra Semiconductor Corporation
www.tundra.com
Tsi350A User Manual
80D5000_MA001_06
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参数对比
与TSI350A-66CQ相近的元器件有:TSI350A-66CQY、TSI350A-66CLV。描述及对比如下:
型号 TSI350A-66CQ TSI350A-66CQY TSI350A-66CLV
描述 PCI Bus Controller, CMOS, PBGA208, PLASTIC, QFP-208 PCI Bus Controller, CMOS, PBGA208, ROHS COMPLIANT, PLASTIC, QFP-208 PCI Bus Controller, CMOS, PBGA256, ROHS COMPLIANT, PLASTIC, BGA-256
厂商名称 Tundra Semiconductor Corp Tundra Semiconductor Corp Tundra Semiconductor Corp
包装说明 FQFP, FQFP, ROHS COMPLIANT, PLASTIC, BGA-256
Reach Compliance Code unknown unknown unknown
地址总线宽度 32 32 32
总线兼容性 PCI PCI PCI
最大时钟频率 66 MHz 66 MHz 66 MHz
驱动器接口标准 IEEE 1149.1 IEEE 1149.1 IEEE 1149.1
外部数据总线宽度 32 32 32
JESD-30 代码 R-PBGA-B208 R-PBGA-B208 R-PBGA-B256
长度 28 mm 28 mm 17 mm
端子数量 208 208 256
最高工作温度 85 °C 85 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FQFP FQFP BGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 4.1 mm 4.1 mm 1.8 mm
最大供电电压 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER
端子形式 BALL BALL BALL
端子节距 0.5 mm 0.5 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM
宽度 28 mm 28 mm 17 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
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