W25Q32FW
1.8V 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
Publication Release Date: April 24, 2018
- Revision J
W25Q32FW
Table of Contents
1.
2.
3.
GENERAL DESCRIPTIONS ............................................................................................................. 4
FEATURES ....................................................................................................................................... 4
PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5
3.1
Pin Configuration SOIC / VSOP 208-mil .............................................................................. 5
3.2
Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............................................ 5
3.3
Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............ 5
3.4
Pin Configuration SOIC 300-mil ........................................................................................... 6
3.5
Pin Description SOIC 300-mil ............................................................................................... 6
3.6
Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7
3.7
Ball Description TFBGA 8x6-mm ......................................................................................... 7
3.8
Ball Configuration WLCSP ................................................................................................... 8
3.9
Ball Description WLCSP12 ................................................................................................... 8
PIN DESCRIPTIONS ........................................................................................................................ 9
4.1
Chip Select (/CS) .................................................................................................................. 9
4.2
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9
4.3
Write Protect (/WP)............................................................................................................... 9
4.4
HOLD (/HOLD) ..................................................................................................................... 9
4.5
Serial Clock (CLK) ................................................................................................................ 9
4.6
Reset (/RESET) .................................................................................................................... 9
BLOCK DIAGRAM .......................................................................................................................... 10
FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11
6.1
SPI / QPI Operations .......................................................................................................... 11
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
Standard SPI Instructions ..................................................................................................... 11
Dual SPI Instructions ............................................................................................................ 11
Quad SPI Instructions ........................................................................................................... 12
QPI Instructions .................................................................................................................... 12
Hold Function........................................................................................................................ 12
Software Reset & Hardware /RESET pin .............................................................................. 13
4.
5.
6.
7.
6.2
Write Protection .................................................................................................................. 14
STATUS AND CONFIGURATION REGISTERS ............................................................................ 15
7.1
Status Registers ................................................................................................................. 15
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
Erase/Write In Progress (BUSY)
–
Status Only
................................................................. 15
Write Enable Latch (WEL)
–
Status Only
........................................................................... 15
Block Protect Bits (BP2, BP1, BP0)
–
Volatile/Non-Volatile Writable
................................. 15
Top/Bottom Block Protect (TB)
–
Volatile/Non-Volatile Writable
........................................ 16
Sector/Block Protect Bit (SEC)
–
Volatile/Non-Volatile Writable
........................................ 16
Complement Protect (CMP)
–
Volatile/Non-Volatile Writable
............................................ 16
Status Register Protect (SRP1, SRP0)
–
Volatile/Non-Volatile Writable............................
16
Erase/Program Suspend Status (SUS)
–
Status Only
....................................................... 17
Security Register Lock Bits (LB[3:1])
–
Volatile/Non-Volatile OTP Writable.......................
17
-1-
W25Q32FW
7.1.10
7.1.11
7.1.12
7.1.13
7.1.14
7.1.15
7.1.16
7.1.17
Quad Enable (QE)
–
Volatile/Non-Volatile Writable
......................................................... 17
Write Protect Selection (WPS)
–
Volatile/Non-Volatile Writable
...................................... 18
Output Driver Strength (DRV1, DRV0)
–
Volatile/Non-Volatile Writable
.......................... 18
/HOLD or /RESET Pin Function (HOLD/RST)
–
Volatile/Non-Volatile Writable
............... 18
Reserved Bits
–
Non Functional
...................................................................................... 18
W25Q32FW Status Register Memory Protection (WPS = 0, CMP = 0) .............................. 19
W25Q32FW Status Register Memory Protection (WPS = 0, CMP = 1) .............................. 20
W25Q32FW Individual Block Memory Protection (WPS=1) ................................................ 21
8.
INSTRUCTIONS ............................................................................................................................. 22
8.1
Device ID and Instruction Set Tables ................................................................................. 22
8.1.1
8.1.2
8.1.3
8.1.4
Manufacturer and Device Identification ................................................................................. 22
Instruction Set Table 1 (Standard SPI Instructions)
(1)
........................................................... 23
Instruction Set Table 2 (Dual/Quad SPI Instructions)
(1)
......................................................... 24
Instruction Set Table 3 (QPI Instructions)
(14)
......................................................................... 25
Write Enable (06h) ................................................................................................................ 27
Write Enable for Volatile Status Register (50h)..................................................................... 27
Write Disable (04h) ............................................................................................................... 28
Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) ............... 28
Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) ............... 29
Read Data (03h) ................................................................................................................... 32
Fast Read (0Bh) ................................................................................................................... 33
Fast Read Dual Output (3Bh) ............................................................................................... 35
Fast Read Quad Output (6Bh) .............................................................................................. 36
Fast Read Dual I/O (BBh) ................................................................................................... 37
Fast Read Quad I/O (EBh).................................................................................................. 39
Set Burst with Wrap (77h) ................................................................................................... 42
Page Program (02h) ........................................................................................................... 43
Quad Input Page Program (32h)......................................................................................... 45
Sector Erase (20h) .............................................................................................................. 46
32KB Block Erase (52h)...................................................................................................... 47
64KB Block Erase (D8h) ..................................................................................................... 48
Chip Erase (C7h / 60h) ....................................................................................................... 49
Erase / Program Suspend (75h) ......................................................................................... 50
Erase / Program Resume (7Ah) .......................................................................................... 52
Power-down (B9h) .............................................................................................................. 53
Release Power-down / Device ID (ABh) ............................................................................. 54
Read Manufacturer / Device ID (90h) ................................................................................. 56
Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 57
Read Manufacturer / Device ID Quad I/O (94h) .................................................................. 58
Read Unique ID Number (4Bh) ........................................................................................... 59
Read JEDEC ID (9Fh) ........................................................................................................ 60
Read SFDP Register (5Ah)................................................................................................. 61
8.2
Instruction Descriptions ...................................................................................................... 27
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.8
8.2.9
8.2.10
8.2.11
8.2.12
8.2.13
8.2.14
8.2.15
8.2.16
8.2.17
8.2.18
8.2.19
8.2.20
8.2.21
8.2.22
8.2.23
8.2.24
8.2.25
8.2.26
8.2.27
8.2.28
-2-
Publication Release Date: April 24, 2018
- Revision J
W25Q32FW
8.2.29
8.2.30
8.2.31
8.2.32
8.2.33
8.2.34
8.2.35
8.2.36
8.2.37
8.2.38
8.2.39
8.2.40
8.2.41
Erase Security Registers (44h) ........................................................................................... 62
Program Security Registers (42h) ....................................................................................... 63
Read Security Registers (48h) ............................................................................................ 64
Set Read Parameters (C0h) ............................................................................................... 65
Burst Read with Wrap (0Ch) ............................................................................................... 66
Enter QPI Mode (38h) ......................................................................................................... 67
Exit QPI Mode (FFh) ........................................................................................................... 68
Individual Block/Sector Lock (36h) ...................................................................................... 69
Individual Block/Sector Unlock (39h) .................................................................................. 70
Read Block/Sector Lock (3Dh)............................................................................................ 71
Global Block/Sector Lock (7Eh) .......................................................................................... 72
Global Block/Sector Unlock (98h) ....................................................................................... 72
Enable Reset (66h) and Reset Device (99h) ...................................................................... 73
9.
ELECTRICAL CHARACTERISTICS............................................................................................... 74
9.1
Absolute Maximum Ratings (1) .......................................................................................... 74
9.2
Operating Ranges .............................................................................................................. 74
9.3
Power-up Power-down Timing and Requirements ............................................................. 75
9.4
DC Electrical Characteristics .............................................................................................. 76
9.5
AC Measurement Conditions ............................................................................................. 77
9.6
AC Electrical Characteristics
(6)
........................................................................................... 78
9.7
Serial Output Timing ........................................................................................................... 80
9.8
Serial Input Timing.............................................................................................................. 80
9.9
/HOLD Timing ..................................................................................................................... 80
9.10 /WP Timing ......................................................................................................................... 80
PACKAGE SPECIFICATIONS ....................................................................................................... 81
10.1 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 81
10.2 8-Pin VSOP 208-mil (Package Code ST)........................................................................... 82
10.3 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 83
10.4 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 84
10.5 Pad XSON 4x4x0.45-mm (Package Code XG) .................................................................. 85
10.6 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 86
10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 87
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 88
10.9 12-Ball WLCSP (Package Code BYIC) .............................................................................. 89
10.10 12-Ball WLCSP (Package Code BYIG) ............................................................................ 90
10.11 Ordering Information ......................................................................................................... 91
10.12 Valid Part Numbers and Top Side Marking ...................................................................... 92
REVISION HISTORY ...................................................................................................................... 93
10.
11.
-3-
W25Q32FW
1. GENERAL DESCRIPTIONS
The W25Q32FW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space,
pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing
voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption
as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages.
The W25Q32FW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes
can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32FW has
1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater
flexibility in applications that require data and parameter storage. (See Figure 2.)
The W25Q32FW support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2-
clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI),
I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing
equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when
using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard
Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient
memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP
(execute in place) operation.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide
further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID, a
64-bit Unique Serial Number and three 256-bytes Security Registers.
2. FEATURES
New Family of SpiFlash Memories
– W25Q32FW: 32M-bit / 4M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP,
/Hold
– Dual SPI: CLK, /CS, IO
0
, IO
1
, /WP, /Hold
– Quad SPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
– QPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
– Software & Hardware Reset
Highest Performance Serial Flash
– 104MHz Single, Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– Min 100K Program-Erase cycles per sector
– More than 20-year data retention
Efficient “Continuous Read” and QPI
Mode
– Continuous Read with 8/16/32/64-Byte
Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces
instruction overhead
– Allows true XIP (execute in place)
operation
– Outperforms X16 Parallel Flash
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP
locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC/VSOP 208-mil, XSON 4x4-mm
– 8-pad WSON 6x5-mm / 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET)
– 24-ball TFBGA 8x6-mm(additional /RESET)
– 12-ball WLCSP
– Contact Winbond for KGD and other options
-4-
Publication Release Date: April 24, 2018
- Revision J
stm32/stm8
