型号
- 型号
- 关键词
DDR DRAM, 32MX64, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
厂商名称：White Electronic Designs Corporation
厂商官网：http://www.wedc.com/
下载文档| 型号 | W3H32M64E-400SBM | W3H32M64E-400SBC | W3H32M64E-533SBI | W3H32M64E-533SBM | W3H32M64E-533SBC |
|---|---|---|---|---|---|
| 描述 | DDR DRAM, 32MX64, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 0.6 ns | 0.6 ns | 0.65 ns | 0.65 ns | 0.65 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PBGA-B208 | R-PBGA-B208 | R-PBGA-B208 | R-PBGA-B208 | R-PBGA-B208 |
| 内存密度 | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit |
| 内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 208 | 208 | 208 | 208 | 208 |
| 字数 | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
| 字数代码 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 85 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | - | -40 °C | -55 °C | - |
| 组织 | 32MX64 | 32MX64 | 32MX64 | 32MX64 | 32MX64 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.06 mm | 3.06 mm | 3.06 mm | 3.06 mm | 3.06 mm |
| 自我刷新 | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | INDUSTRIAL | MILITARY | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
ARM技术
嵌入式系统
嵌入式系统
stm32/stm8
无线连接
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