8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
厂商名称:White Electronic Designs Corporation
厂商官网:http://www.wedc.com/
下载文档型号 | WEDPNF8M722V-1215BI | WEDPNF8M722V-1012BM | WEDPNF8M722V-1015BM | WEDPNF8M722V-1010BM | WEDPNF8M722V-XBX | WEDPNF8M722V-1215BM | WEDPNF8M722V-1212BI | WEDPNF8M722V-1210BC | WEDPNF8M722V-1012BC | WEDPNF8M722V-1010BC |
---|---|---|---|---|---|---|---|---|---|---|
描述 | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package | 8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
包装说明 | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 | - | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 | 32 X 25 MM, PLASTIC, BGA-275 |
Reach Compliance Code | unknow | unknow | unknow | unknow | - | unknow | unknow | unknow | unknow | unknow |
其他特性 | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | - | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH | USER CONFIGURABLE 2M X 8 OR 1M X 16 OR 512K X 32 FLASH |
JESD-30 代码 | R-PBGA-B275 | R-PBGA-B275 | R-PBGA-B275 | R-PBGA-B275 | - | R-PBGA-B275 | R-PBGA-B275 | R-PBGA-B275 | R-PBGA-B275 | R-PBGA-B275 |
长度 | 32 mm | 32 mm | 32 mm | 32 mm | - | 32 mm | 32 mm | 32 mm | 32 mm | 32 mm |
内存密度 | 603979776 bi | 603979776 bi | 603979776 bi | 603979776 bi | - | 603979776 bi | 603979776 bi | 603979776 bi | 603979776 bi | 603979776 bi |
内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
内存宽度 | 72 | 72 | 72 | 72 | - | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | 275 | 275 | 275 | 275 | - | 275 | 275 | 275 | 275 | 275 |
字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | - | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | - | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | - | 125 °C | 85 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | - | -55 °C | -40 °C | - | - | - |
组织 | 8MX72 | 8MX72 | 8MX72 | 8MX72 | - | 8MX72 | 8MX72 | 8MX72 | 8MX72 | 8MX72 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | - | BGA | BGA | BGA | BGA | BGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | - | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | - | MILITARY | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | BALL | BALL | BALL | BALL | - | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 25 mm | 25 mm | 25 mm | 25 mm | - | 25 mm | 25 mm | 25 mm | 25 mm | 25 mm |