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WP7113SF6C-P22

T-1 3/4 (5mm) Infrared Emitting Diode

DESCRIPTION

SF6 Made with Gallium Aluminum Arsenide Infrared

Emitting diodes

PACKAGE DIMENSIONS

FEATURES

Mechanically and spectrally matched to the

phototransistor

RoHS compliant

SELECTION GUIDE

Part Number

Emitting Color

(Material)

Lens Type

Po (mW/sr) [2]

@ 20mA

Min.

Typ.

Po (mW/sr) [2]

@ 50mA

Min.

Typ.

Viewing Angle

[1]

2θ1/2

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Water Clear

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Lead spacing is measured where the leads emerge from the package.

4. The specifications, characteristics and technical data described in the datasheet are subject to change

without prior notice.

Infrared Illumination for cameras

Machine vision systems

Surveillance systems

Industrial electronics

IR data transmission

Remote control

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Infrared (GaAlAs)

100

20°

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WP7113SF6C-P22

Notes:

θ1/2

is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.

2. Radiant Intensity / luminous flux: +/-15%.

3. Radiant intensity value is traceable to CIE127-2007 standards.

APPLICATIONS

WP7113SF6C-P22

ELECTRICAL / OPTICAL CHARACTERISTICS at T

=25°C

Parameter

Symbol

Emitting Color

Value

Typ.

860

Max.

Unit

Wavelength at Peak Emission I

= 20mA

Spectral Bandwidth at 50%

REL MAX

= 20mA

Capacitance

peak

Infrared

Δλ

Infrared

Forward Voltage I

= 20mA

F [1]

Infrared

1.35

1.6

Reverse Current (V

= 5V)

Infrared

Value

120

-40 to +85

1000

8000

260°C For 3 Seconds

260°C For 5 Seconds

Notes:

1. Forward voltage: ±0.1V.

2. Wavelength value is traceable to CIE127-2007 standards.

3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at T

=25°C

Parameter

Power Dissipation

Reverse Voltage

Junction Temperature

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Symbol

Unit

°C

Operating Temperature

Storage Temperature

DC Forward Current

Peak Forward Current

Electrostatic Discharge Threshold (HBM)

Lead Solder Temperature

[2]

Lead Solder Temperature

[3]

stg

FM [1]

Notes:

1. 1/100 Duty Cycle, 10μs Pulse Width.

2. 2mm below package base.

3. 5mm below package base.

4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

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WP7113SF6C-P22

TECHNICAL DATA

RELATIVE INTENSITY vs. WAVELENGTH

100%

Relative Intensity (a. u.)

80%

60%

40%

20%

750

-60°

= 25 °C

SF6

= 25 °C

-45°

-15°

-30°

SPATIAL DISTRIBUTION

0°

15°

30°

45°

60°

-75°

800

850

900

Wavelength (nm)

950

1000

1050

75°

-90°

1.0

0.5

0.0

0.5

90°

1.0

INFRARED

Radiant intensity normalised

at 20 mA

Forward current (mA)

0.8

= 25 °C

2.0

1.5

1.0

0.5

0.0

Radiant intensity normalised

at T

= 25 °C

Permissible forward current (mA)

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-40 -20 0 20 40 60 80 100

Ambient temperature (°C)

2.5

1.0

1.2

1.4

1.6

Forward voltage (V)

1.8

Forward current (mA)

RECOMMENDED WAVE SOLDERING PROFILE

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Notes:

1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple

attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath

temperature of 260°C

2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).

3. Do not apply stress to the epoxy resin while the temperature is above 85°C.

4. Fixtures should not incur stress on the component when mounting and during soldering process.

5. SAC 305 solder alloy is recommended.

6. No more than one wave soldering pass.

PACKING & LABEL SPECIFICATIONS

2.5

2.0

1.5

1.0

0.5

0.0

Forward Current vs.

Forward Voltage

Radiant Intensity vs.

Forward Current

Forward Current Derating Curve

Radiant Intensity vs.

Ambient Temperature

-40 -20 0 20 40 60 80 100

Ambient temperature (°C)

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WP7113SF6C-P22

PRECAUTIONS

Storage conditions

1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient

temperature.

2. LEDs should be stored with temperature

≤

30°C and relative humidity < 60%.

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.

Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

LED Mounting Method

1. The lead pitch of the LED must match the

pitch of the mounting holes on the PCB

during component placement.

Lead-forming may be required to insure

the lead pitch matches the hole pitch.

Refer to the figure below for proper lead

forming procedures.

Note 1-3: Do not route PCB trace in the contact area between the

leadframe and the PCB to prevent short-circuits.

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○

Correct mounting method

Incorrect mounting method

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the

internal structures and cause failure.

3. Use stand-offs

(Fig.1)

or spacers

(Fig.2)

to securely position the LED above the PCB.

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead

bend

(Fig. 3 ,Fig. 4)

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force

will not be transmitted to the LED lens and its internal structures. Do not perform lead

forming once the component has been mounted onto the PCB.

(Fig. 5 )

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WP7113SF6C-P22

Lead Forming Procedures

1. Do not bend the leads more than twice.

(Fig. 6 )

2. During soldering, component covers and holders should leave

clearance to avoid placing damaging stress on the LED during

soldering.

(Fig. 7)

3. The tip of the soldering iron should never touch the lens epoxy.

4. Through-hole LEDs are incompatible with reflow soldering.

5. If the LED will undergo multiple soldering passes or face other

processes where the part may be subjected to intense heat,

please check with Kingbright for compatibility.

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbright application notes available at

http://www.KingbrightUSA.com/ApplicationNotes

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