AMI Semiconductor
XPressArray
®
-II 0.15μm Structured ASIC
Key Features
• Next-generation 0.15µm structured ASIC platform for high-
performance 1.5V ASICs and FPGA-to-ASIC conversions
• NRE and production cost savings
• Significant time-to-market advantages
• Drop-in replacement for cost-reducing Xilinx® Virtex™-II
and Virtex-II Pro and Altera® APEX-II and Stratix designs
• 511K to 4.8M ASIC gates
• 210MHz system, 500MHz local clock speeds
• Low power consumption
· 0.055µW/MHz/gate @ 1.575V
• 258Kbits to 4.8Mbits of block RAM memory
• 18Kbit initializable dual-port RAM blocks at speeds up
to 330MHz
• Up to 6.1Mbits of memory when 50 percent of the logic
sites are used for distributed memory
• Initializable distributed memory at speeds up to 210MHz
• Flexible I/O technology, any I/O standard assigned to any I/O pin
• Configurable signal, core and I/O power supply pin locations
• Supports LVTTL, LVCMOS, PCI33, PCI66, PCI-X 133, PCI-X 2.0, GTL/+, HSTL class 1, 2, 3, and 4, SSTL2 class 1 and 2,
LVPECL (input), and LVDS I/O standards
• 1.5V, 1.8V, 2.5V, and 3.3V capable I/O
• True 3.3V tolerance with no external resistor necessary
• Digital controlled impedance (DCI)
• Built-in dual data rate (DDR) support
• LVDS data rates to 1Gbps
• Up to 1360 user I/Os
• Comprehensive clock management circuitry
• Up to eight delay-locked loops (DLLs) and eight phase-locked loops (PLLs)
• Variety of package options
• Integrated high-fault coverage scan-test, memory BIST and JTAG
XPressArray-II
-
Feature Sheet
Product Description
Targeted at medium-density, high-speed, 1.5V ASIC
applications and high-density FPGA-to-ASIC conversions,
the XPressArray-II (XPA-II) 0.15µm structured ASIC is an
innovative next-generation technology platform that
reduces time-to-market for system-on-chip (SoC)
applications while delivering significant NRE and unit
cost savings.
XPA-II offers a true drop-in replacement for Xilinx
Virtex-II and Virtex-II Pro and Altera APEX-II and Stratix
FPGAs, making it the industry's lowest cost ASIC
conversion solution. The result is a simplified route to
cost reductions for OEMs looking to combine the
flexibility of FPGA prototyping with a path to ASICs for
final production.
Operating with system clock speeds up to 210MHz for
18x18 soft multipliers and local clocks up to 500MHz
and available in a variety of package options, XPA-II
0.15µm devices deliver high-performance, low power
ASIC solutions with densities to 4.8M ASIC gates.
Configurable memory ranges from 258Kbits to
4.8Mbits, which increases up to 6.1Mbits of memory
with the addition of distributed configurable memory,
assuming 50 percent of the logic sites are used for
memory.
Flexible I/O technology includes support for a
comprehensive array of common standards and
compatibility with 1.5V, 1.8V, 2.5V, and 3.3V I/O
Product Description continued
schemes. I/Os support DCI on-chip termination. DDR
support for high-speed memory interface is built-in. High
fault coverage is provided through integrated scan-test,
memory BIST and JTAG support.
For FPGA conversions, rapid access to XPressArray (XPA)
technology can be achieved via AMI Semiconductor's
NETRANS® FPGA-to-ASIC design flow. Alternatively, the
availability of XPA synthesis libraries for leading
commercial synthesizers allows conversion of FPGA
designs to ASICs by simply re-targeting from an FPGA
library to an XPA library.
For a data sheet with complete technical specifications,
please visit AMI Semiconductor's Technical Resources at
www.amis.com.
XPressArray-II -
Feature Sheet
XPressArray-II -
Feature Sheet
Technology
XPA-II technology is ideal for medium density ASIC
applications requiring high performance and low
power, with 1.5V operation. XPA-II devices are
fabricated using a hybrid technology that
integrates an established 0.15µm front-end
process with a proven AMIS metal finishing
technology, which is used to produce a
customized back-end. The 0.15µm processing
steps are common to multiple applications,
reducing costs by allowing existing tooling to be
utilized. At the same time, tooling and
manufacturing costs are significantly lower for the
metal finishing process than for traditional
0.15µm cell-based processes. The result is that
XPA-II delivers reduced cycle times and
significant reductions in terms of both NRE and
unit cost through manufacturing utilizing
structured ASIC technology.
There are nine bases in the AMIS XPA-II family.
These bases offer between 511K and 4.8M gates
and up to 4.8Mbits of block RAM. RAM may be
configured as single or dual port with
asymmetrical port widths. The architecture also
supports RAM
initialization. Flexible I/O
technology includes fully configurable core and
I/O power supply pads and support for one of the
industry's widest ranges of I/O standards including
LVTTL, LVCMOS, PCI33, PCI66, PCI-X 133, PCI-X
2.0, GTL/+, HSTL class 1, 2, 3, and 4, SSTL2 class
1 and 2, LVPECL input, and LVDS. Comprehensive
clock management circuitry features up to eight
all digital DLLs and a maximum of eight PLLs.
Compared to equivalent FPGAs operating at the
same voltage levels, XPA-II devices offer higher
densities, better performance and lower power
consumption. Low power consumption further
contributes to cost savings as lower cost plastic
packaging can be used in many cases. XPA-II
products are designed for pin-for-pin replacement
of Xilinx and Altera FPGAs and offer integration of
multiple FPGAs into one ASIC. Package options
include a wide range of Flip Chip BGAs in 1.00mm
and 1.27mm pitches.
XPA-II Base User I/Os DLLs PLLs 18K Memory
X2P360
360
2
4
14
X2P560
560
4
4
40
X2P640
640
4
4
48
X2P720
720
4
4
57
X2P846
846
4
4
101
X2P880
880
4
4
101
X2P1040
1040
4
4
145
X2P1200
1200
8
8
189
X2P1360
1360
8
8
264
(1) Usable 2RW RAM bits
(2) Usable 2-NAND equivalent logic gates
No Distributed RAM
50% Distributed RAM
1
2
Blocks Memory Bits (K) Logic Gates (K) Memory Bits (K)
1
Logic Gates (K)
2
258
511
389
256
737
912
972
456
884
1219
1198
609
1056
1589
1459
725
1862
1854
2338
927
1862
2127
2408
1063
2673
2889
3414
1445
3484
4085
4532
2042
4866
4868
6116
2434
AMI Semiconductor
www.amis.com
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied
or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of
merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI
Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high
reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such
applications. Copyright ©2006 AMI Semiconductor, Inc. M-20623-003 KO
