XTREME-GUARD™ ESD Suppressors
Reference Dimensions:
Surface Mount Polymeric Electrostatic Discharge Suppressors
XGD Series
1.04
(0.041") REF
0.36 (0.014")
1.66 +/- 0.06
(0.066" +/- 0.003”)
0.15 +/- 0.08
(0.006" +/- 0.003”)
Description
XTREME-GUARD
TM
ESD Suppressors protect sensitive
electronic equipment against extreme ESD conditions, in
very small 0402 and 0603 footprints. This series product is
specifically designed to suppress fast-rising ESD transients
up to 30kV while adding virtually no capacitance to the
circuit, which helps preserve signal integrity and minimize
data loss. It is designed as RoHS compliant, halogen free,
and Pb free.
Features
• High ESD Rating up to
30kV Contact/Air
Discharge
• RoHS compliant, lead-free
and halogen-free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• Bi-directional
• Withstands multiple
ESD strikes
Applications
• Compatible with
pick-and-place processes
• Available in 1000, 5000,
and 10000 piece reels
(EIA-RS481)
• High rated voltage up to
32V maximum
• High operating
temperature at 125ºC
0.84 +/- 0.05
(0.033" +/- 0.002”)
0.43 +/- 0.18
(0.017" +/- 0.007”)
Reflow Solder
0.51 (0.020")
3.05
(0.120")
1.27 (0.050")
Wave Solder
0.76 (0.030")
3.30
(0.130")
1.27 (0.050")
0.76 (0.030")
0.76 (0.030")
Equivalent Circuits
0402 and 0603 Devices
Equivalent Circuit
1
2
Product Characteristics
Part Number
XGD10402
XGD10603
Lines
Protected
1
1
Component
Package
0402
0603
Available as
Halogen-Free
Yes
Yes
• Wearable Devices
• Notebooks/Laptops/PCs
• Gaming Consoles
• Smart TVs
• Smart Phones
• Tablets
• Set Top Boxes
• Networking and Wireless
Hardware
• Stationary and Portable
Medical Devices
Electrical Characteristics
Specification
ESD Capability:
IEC 61000-4-2 Contact Discharge (typical)
IEC 61000-4-2 Air Discharge (typical)
Trigger Voltage
Clamping Voltage (typical)
Trigger Voltage (typical)
Clamping Voltage (typical)
Rated Voltage (maximum)
Capacitance (typical)
Response Time
Leakage Current (typical)
ESD Pulse Withstand
Note:
1. Testing performed on Littelfuse test setup as described in Typical Test Setup Section on page 4 of this document.
XGD10402
30kV
30kV
250V
40V
150V
40V
24V max
0.04 pF
<1nS
<1nA @24V
1000
pulses min
XGD10603
30kV
30kV
400V
40V
300V
28V
32V max
0.09 pF
<1nS
<1nA @24V
1000
pulses min
Notes
The ESD capability measured by direct and air discharge
method is subject to testing equipment and conditions.
Numerous factors could affect the reliability and reproducibility
of the direct and air discharge test results.
Measured per IEC 61000-4-2
8kV Direct Discharge Method
Measured using 500V TLP Direct Discharge Method
Measured at 250MHz
Some shifting in characteristics may occur when tested over
multiple pulses at a very rapid rate
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/01/15
XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Signal Integrity: USB3.0 5Gbps
Signal Integrity : USB3.0 5Gbps
Without XGD Device
Signal Integrity : USB3.0 5Gbps
Without XGD
Without XGD
With XGD Device
With XGD Device
With XGD Device
Signal Integrity : USB3.0 5Gbps
Signal Integrity : USB3.0 5Gbps
Without XGD
Without XGD
With XGD Device
With XGD Device
Signal Integrity: USB3.1 10Gbps
Signal Integrity : USB3.1 10Gbps
Signal Integrity : USB3.1 10Gbps
Without XGD
Without XGD
With XGD Device
With XGD Device
Without XGD Device
10Gbps : USB3.1 10Gbps
Signal
Signal Integrity : USB3.1 Integrity
Without XGD
Without XGD
With XGD Device
With XGD Device
With XGD Device
Typical Device Capacitance
1.00
Typical ESD Response
Capacitance (pF)
XGD10603
0.10
XGD10603
XGD10402
XGD10402
0.01
100
1,000
10,000
Frequency (MHz)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/01/15
XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Physical Specifications
Materials
Solderability
Soldering
Parameters
Body: Glass Epoxy
Terminations: Copper/Nickel/Tin
MIL-STD-202, Method 208
Wave solder - 260°C, 10 seconds maximum
Reflow solder - 260°C, 30 seconds maximum
Environmental Specifications
Operating Temperature
Moisture Resistance
-65°C to +125°C
0402 and 0603 series:
85°C, 85% RH, 1000 hours
40°C, 95% RH, 1000 hours
MIL
-STD-202, Method 107
,
-65°C to 125°C, 30 min. cycle,
10 cycles
MIL
-STD-202, Method 201, (10
to 55 to 10 Hz, 1 min. cycle, 2
hrs each in X-Y-Z)
MIL
-STD-202, Method 215
IPC/EIA J-STD-002
Thermal Shock
Design Consideration
Because of the fast rise-time of the ESD transient, proper
placement of XTREME-GUARD™ suppressors are a key
design consideration to achieving optimal ESD suppression.
The devices should be placed on the circuit board as close to
the source of the ESD transient as possible. Install XTREME-
GUARD™ suppressors (connected from signal/data line
to ground) directly behind the connector so that they are
the first board-level circuit component encountered by the
ESD transient.
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
200°C
60 – 180 seconds
Vibration
Chemical Resistance
Solder Leach Resistance and
Terminal Adhesion
T
P
T
L
T
S(max)
Temperature
Ramp-up
t
P
t
L
Ramp-do
Ramp-down
Preheat
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260°C
10 – 30 seconds
6°C/second max
8 minutes max
T
S(min)
t
S
time to peak temperature
25
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Time
Based on IPC/JEDEC J-STD-020
Packaging
Part Number
XGD10402
XGD10603
XGD10603
Quantity & Packaging Code
KR
MR
NR
Quantity
10000
1000
5000
Packaging Option
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Tape & Reel (7” reel)
Packaging Specification
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
EIA RS-481-1 (IEC 286, part 3)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/01/15
XTREME-GUARD™ ESD Suppressors
Surface Mount Polymeric Electrostatic Discharge Suppressors
Dimensions
0402 Device
Reference Dimensions:
1.02 ± 0.05
(0.040" ± 0.002")
0603 Device
Dimensions: mm (inch)
0.09 +/- 0.05
(0.004" ± 0.002")
0.46 ± 0.05
(0.018" ± 0.002")
Reference Dimensions:
1.68 ± 0.08
(0.066" ± 0.003")
Dimensions: mm (inch)
0.19 +/- 0.08
(0.008" ± 0.003")
0.51 ± 0.05
(0.020" ± 0.002")
0.46 ± 0.05
(0.018" ± 0.002")
0.84 ± 0.05
(0.033" ± 0.002")
0.23 ± 0.10
(0.009" ± 0.004")
Reflow Solder Only
0.381 (0.015")
1.55
(0.061")
.584 (0.023")
0.43 ± 0.18
(0.017" ± 0.007")
Re
Only
Reflow Solder
ow Solder
0.51 (0.020")
0.381 (0.015")
3.05
1.55
(0.061")
(0.120")
1.27
.584 (0.023")
(0.050")
Wave Solder
0.76 (0.030")
3.30
(0.130")
1.27 (0.050")
0.76 (0.030")
0.559 (0.022")
Recommended Pad Layout
0.76 (0.030")
0.559 (0.022")
Recommended Pad Layout
Tape and Reel Specifications
T
t
D
d
D
s
Description
C
t
- Cover tape thickness
0402 Series
(mm)
0.05
1.50
4.00
0.56
1.14
2.00
0.62
0.65
8.00
0603 Series
(mm)
0.05
1.50
4.00
0.58
1.85
4.00
1.02
0.65
8.00
P
d
P
w
P
h
T
w
D
d
- Drive hole diameter
D
s
- Drive hole spacing
P
d
- Pocket depth
P
h
- Pocket height
P
s
- Pocket spacing
P
w
- Pocket width
T
t
- Carrier tape thickness
T
w
- Carrier tape width
C
t
P
s
Typical Test Setup
FARADAY CAGE
Part Numbering System
XGD 1 0603 NR
AGILENT INFINIIUM
1.5 GHz 8 GS/s
30dB PASTERNAK ATTENUATOR
PE7025-30
TEKTRONIX LOW CAP PROBE
6158 (20x TIP)
COMPUTER
LEAD-FREE
XTREME-GUARD™
ESD SUPPRESSORS
LINES PROTECTED:
1 = 1 line
QUANTITY &
PACKAGING CODE:
MR = 1000 pieces, tape & reel
NR = 5000 pieces, tape & reel
KR = 10,000 pieces, tape & reel
DEVICE SIZE CODE:
0402 = 0402 (1005)
0603 = 0603 (1608)
QUADTECH 1865
RESISTANCE METER
RESISTANCE
TEST FIXTURE
ESD TEST FIXTURE
TEST BOARD W/ DUT
ESD PULSE GENERATOR
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/01/15
FPGA/CPLD
