XPC740PRX400RE,XPC740PRX400RE pdf中文资料,XPC740PRX400RE引脚图,XPC740PRX400RE电路-Datasheet-电子工程世界

参数对比

与XPC740PRX400RE相近的元器件有：XPC750PRX333LE、XPC740PRX300LE、XPC740PRX366RE、XPC740PRX333LE、XPC750PRX366RE、XPC750PRX300LE、XPC750PRX400RE。描述及对比如下：

型号	XPC740PRX400RE	XPC750PRX333LE	XPC740PRX300LE	XPC740PRX366RE	XPC740PRX333LE	XPC750PRX366RE	XPC750PRX300LE	XPC750PRX400RE
描述	RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	32-BIT, 300MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360	32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
包装说明	BGA, BGA255,16X16,50	BGA, BGA360,19X19,50	BGA, BGA255,16X16,50	BGA, BGA255,16X16,50	BGA, BGA255,16X16,50	BGA,	BGA, BGA360,19X19,50	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
其他特性	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V I/O SUPPLY
地址总线宽度	32	32	32	32	32	32	32	32
位大小	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
外部数据总线宽度	64	64	64	64	64	64	64	64
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FIXED POINT
集成缓存	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-CBGA-B255	S-CBGA-B360	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B360	S-CBGA-B360	S-CBGA-B360
长度	21 mm	25 mm	21 mm	21 mm	21 mm	25 mm	25 mm	25 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	255	360	255	255	255	360	360	360
最高工作温度	65 °C	105 °C	105 °C	65 °C	105 °C	65 °C	105 °C	65 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	3 mm	3.2 mm	3 mm	3 mm	3 mm	3.2 mm	3.2 mm	3.2 mm
速度	400 MHz	333 MHz	300 MHz	366 MHz	333 MHz	366 MHz	300 MHz	400 MHz
最大供电电压	2.1 V	2 V	2 V	2.1 V	2 V	2.1 V	2 V	2.1 V
最小供电电压	2 V	1.8 V	1.8 V	2 V	1.8 V	2 V	1.8 V	2 V
标称供电电压	2.05 V	1.9 V	1.9 V	2.05 V	1.9 V	2.05 V	1.9 V	2.05 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	OTHER	OTHER	COMMERCIAL	OTHER	COMMERCIAL	OTHER	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	21 mm	25 mm	21 mm	21 mm	21 mm	25 mm	25 mm	25 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
厂商名称	Motorola ( NXP )	-	-	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
是否Rohs认证	-	不符合	不符合	-	不符合	不符合	不符合	不符合
JESD-609代码	-	e0	e0	-	e0	e0	e0	e0
峰值回流温度（摄氏度）	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
端子面层	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED