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Z0803804CMB

FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Zilog, Inc.

厂商官网:https://www.zilog.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Zilog, Inc.
零件包装代码
DIP
包装说明
DIP,
针数
40
Reach Compliance Code
unknown
ECCN代码
3A001.A.2.C
地址总线宽度
8
边界扫描
NO
总线兼容性
Z8001; Z8002; Z8
外部数据总线宽度
8
JESD-30 代码
R-CDIP-T40
JESD-609代码
e0
低功率模式
NO
端子数量
40
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
认证状态
Not Qualified
筛选级别
MIL-STD-883 Class B
座面最大高度
4.699 mm
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
NO
技术
CMOS
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
15.24 mm
uPs/uCs/外围集成电路类型
MEMORY CONTROLLER, FIFO
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参数对比
与Z0803804CMB相近的元器件有:Z0803806CMB、Z0853806CMB、Z0803806CME、Z0853806CME、Z0853806LME、Z0853806LMB、Z0803806LME、Z0803806LMB。描述及对比如下:
型号 Z0803804CMB Z0803806CMB Z0853806CMB Z0803806CME Z0853806CME Z0853806LME Z0853806LMB Z0803806LME Z0803806LMB
描述 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44
厂商名称 Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc. Zilog, Inc.
零件包装代码 DIP DIP DIP DIP DIP LCC LCC LCC LCC
包装说明 DIP, DIP, DIP, DIP, DIP, QCCN, QCCN, QCCN, QCCN,
针数 40 40 40 40 40 44 44 44 44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
边界扫描 NO NO NO NO NO NO NO NO NO
总线兼容性 Z8001; Z8002; Z8 Z8001; Z8002; Z8 8080; Z80 Z8001; Z8002; Z8 8080; Z80 8080; Z80 8080; Z80 Z8001; Z8002; Z8 Z8001; Z8002; Z8
外部数据总线宽度 8 8 8 8 8 8 8 8 8
JESD-30 代码 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 R-CDIP-T40 S-CQCC-N44 S-CQCC-N44 S-CQCC-N44 S-CQCC-N44
低功率模式 NO NO NO NO NO NO NO NO NO
端子数量 40 40 40 40 40 44 44 44 44
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 DIP DIP DIP DIP DIP QCCN QCCN QCCN QCCN
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE SQUARE
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.699 mm 4.699 mm 4.699 mm 4.699 mm 4.699 mm 2.286 mm 2.286 mm 2.286 mm 2.286 mm
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL QUAD QUAD QUAD QUAD
宽度 15.24 mm 15.24 mm 15.24 mm 15.24 mm 15.24 mm 16.51 mm 16.51 mm 16.51 mm 16.51 mm
uPs/uCs/外围集成电路类型 MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO MEMORY CONTROLLER, FIFO
是否Rohs认证 不符合 不符合 - 不符合 - - - 不符合 不符合
地址总线宽度 8 8 - 8 - - - 8 8
JESD-609代码 e0 e0 - e0 - - - e0 e0
筛选级别 MIL-STD-883 Class B MIL-STD-883 Class B MIL-STD-883 Class B - - - MIL-STD-883 Class B - MIL-STD-883 Class B
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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