FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:Zilog, Inc.
厂商官网:https://www.zilog.com/
下载文档型号 | Z0803804CMB | Z0803806CMB | Z0853806CMB | Z0803806CME | Z0853806CME | Z0853806LME | Z0853806LMB | Z0803806LME | Z0803806LMB |
---|---|---|---|---|---|---|---|---|---|
描述 | FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 | FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 | FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 | FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 | FIFO Controller, CMOS, CDIP40, CERAMIC, DIP-40 | FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 | FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 | FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 | FIFO Controller, CMOS, CQCC44, CERAMIC, LCC-44 |
厂商名称 | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | LCC | LCC | LCC | LCC |
包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | QCCN, | QCCN, | QCCN, | QCCN, |
针数 | 40 | 40 | 40 | 40 | 40 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
总线兼容性 | Z8001; Z8002; Z8 | Z8001; Z8002; Z8 | 8080; Z80 | Z8001; Z8002; Z8 | 8080; Z80 | 8080; Z80 | 8080; Z80 | Z8001; Z8002; Z8 | Z8001; Z8002; Z8 |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-N44 |
低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
端子数量 | 40 | 40 | 40 | 40 | 40 | 44 | 44 | 44 | 44 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP | DIP | QCCN | QCCN | QCCN | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.699 mm | 4.699 mm | 4.699 mm | 4.699 mm | 4.699 mm | 2.286 mm | 2.286 mm | 2.286 mm | 2.286 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 16.51 mm | 16.51 mm | 16.51 mm | 16.51 mm |
uPs/uCs/外围集成电路类型 | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO | MEMORY CONTROLLER, FIFO |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - | - | - | 不符合 | 不符合 |
地址总线宽度 | 8 | 8 | - | 8 | - | - | - | 8 | 8 |
JESD-609代码 | e0 | e0 | - | e0 | - | - | - | e0 | e0 |
筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - | - | - | MIL-STD-883 Class B | - | MIL-STD-883 Class B |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |