Serial I/O Controller, 2 Channel(s), 0.25MBps, CMOS, PDIP40, PLASTIC, DIP-40
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:IXYS
下载文档型号 | Z8523008PSC | Z8523010PEC | Z8523016PEC | Z8023010PSC | Z8523020PSC | Z8523010PSC | Z8523016PSC |
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描述 | Serial I/O Controller, 2 Channel(s), 0.25MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.512MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.625MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, PDIP40, PLASTIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.512MBps, CMOS, PDIP40, PLASTIC, DIP-40 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IXYS | IXYS | IXYS | IXYS | IXYS | IXYS | IXYS |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | PLASTIC, DIP-40 | PLASTIC, DIP-40 | PLASTIC, DIP-40 | PLASTIC, DIP-40 | PLASTIC, DIP-40 | PLASTIC, DIP-40 | PLASTIC, DIP-40 |
针数 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknow | unknown | unknown |
地址总线宽度 | 1 | 1 | 1 | 8 | 1 | 1 | 1 |
边界扫描 | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 8 MHz | 10 MHz | 16 MHz | 10 MHz | 20 MHz | 10 MHz | 16 MHz |
通信协议 | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC |
数据编码/解码方法 | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
最大数据传输速率 | 0.25 MBps | 0.3125 MBps | 0.512 MBps | 0.3125 MBps | 0.625 MBps | 0.3125 MBps | 0.512 MBps |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 52.325 mm | 52.325 mm | 52.325 mm | 52.325 mm | 52.325 mm | 52.325 mm | 52.325 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | NO |
串行 I/O 数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
最高工作温度 | 70 °C | 100 °C | 100 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.24 mm | 4.24 mm | 4.24 mm | 4.24 mm | 4.24 mm | 4.24 mm | 4.24 mm |
最大压摆率 | 10 mA | 12 mA | 15 mA | 12 mA | 20 mA | 12 mA | 15 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
其他特性 | - | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO | MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO |