Microcontroller, 8-Bit, OTPROM, Z8 CPU, 10MHz, CMOS, PDSO20, SSOP-20
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:IXYS
下载文档型号 | Z8E00010HEC | RNM1/4C219.6KOHMFTU | Z8E00010PSC | Z8E00010PSG | Z8E00010PEG | Z8E00010HEG | Z8E00010HSG |
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描述 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 10MHz, CMOS, PDSO20, SSOP-20 | Fixed Resistor, Metal Film, 0.25W, 19600ohm, 1% +/-Tol, -50,50ppm/Cel, | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 10MHz, CMOS, PDIP18, DIP-18 | Microcontroller, 8-Bit, OTPROM, 10MHz, CMOS, PDIP18, PLASTIC, DIP-18 | Microcontroller, 8-Bit, OTPROM, 10MHz, CMOS, PDIP18, PLASTIC, DIP-18 | Microcontroller, 8-Bit, OTPROM, 10MHz, CMOS, PDSO20, SSOP-20 | Microcontroller, 8-Bit, OTPROM, 10MHz, CMOS, PDSO20, SSOP-20 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
Reach Compliance Code | unknown | unknown | not_compliant | compliant | compliant | compliant | compliant |
端子数量 | 20 | 2 | 18 | 18 | 18 | 20 | 20 |
最高工作温度 | 105 °C | 155 °C | 70 °C | 70 °C | 105 °C | 105 °C | 70 °C |
最低工作温度 | -40 °C | -55 °C | - | - | -40 °C | -40 °C | - |
封装形状 | RECTANGULAR | TUBULAR PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | Axial | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
技术 | CMOS | METAL FILM | CMOS | CMOS | CMOS | CMOS | CMOS |
是否无铅 | 含铅 | - | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
厂商名称 | IXYS | - | IXYS | IXYS | IXYS | IXYS | IXYS |
零件包装代码 | SSOP | - | DIP | DIP | DIP | SSOP | SSOP |
包装说明 | SSOP-20 | - | DIP-18 | DIP, | DIP, | SSOP-20 | SSOP-20 |
针数 | 20 | - | 18 | 18 | 18 | 20 | 20 |
具有ADC | NO | - | NO | NO | NO | NO | NO |
位大小 | 8 | - | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 | 10 MHz | - | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
DAC 通道 | NO | - | NO | NO | NO | NO | NO |
DMA 通道 | NO | - | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDSO-G20 | - | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e0 | - | e0 | e3 | e3 | e3 | e3 |
长度 | 7.2 mm | - | 22.86 mm | 22.86 mm | 22.86 mm | 7.2 mm | 7.2 mm |
I/O 线路数量 | 13 | - | 13 | 13 | 13 | 13 | 13 |
PWM 通道 | NO | - | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | - | DIP | DIP | DIP | SSOP | SSOP |
峰值回流温度(摄氏度) | 225 | - | NOT SPECIFIED | 225 | 225 | 225 | 225 |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM(单词) | 512 | - | 512 | 512 | 512 | 512 | 512 |
ROM可编程性 | OTPROM | - | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM |
座面最大高度 | 2 mm | - | 4.24 mm | 4.24 mm | 4.24 mm | 2 mm | 2 mm |
速度 | 10 MHz | - | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | - | 3.5 V | 3.5 V | 4.5 V | 4.5 V | 3.5 V |
标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | NO | NO | NO | YES | YES |
温度等级 | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | TIN | TIN | Tin (Sn) | Tin (Sn) |
端子形式 | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 0.65 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | - | NOT SPECIFIED | 30 | 30 | 30 | 30 |
宽度 | 5.3 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 5.3 mm | 5.3 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |