数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 64KB Flash, 8KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG, CAN-FD
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:Microchip(微芯科技)
厂商官网:https://www.microchip.com
器件标准:
下载文档型号 | dsPIC33CK64MP505-E/M4 | dsPIC33CK32MP206-E/MR | dsPIC33CK32MP206-E/PT | dsPIC33CK128MP506T-I/PT | dsPIC33CK256MP205T-I/M4 | dsPIC33CK64MP205-I/M4 |
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描述 | 数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 64KB Flash, 8KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG, CAN-FD | 数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 32KB Flash, 8KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG | 数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 32KB Flash, 8KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG | 数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 128KB Flash, 16KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG, CAN-FD | 数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 256KB Flash, 24KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG | 数字信号处理器和控制器 - DSP, DSC 16 Bit DSC, 64KB Flash, 8KB RAM, 100MHz, 28Pin, 3 OpAmp, 3 Comp, PTG |
最大时钟频率 | 64 MHz | 64 MHz | 64 MHz | 100 MHz | 64 MHz | 64 MHz |
是否Rohs认证 | 符合 | 符合 | 符合 | - | - | 符合 |
包装说明 | HVQCCN, LCC48,.24SQ,16 | HVQCCN, LCC64,.35SQ,20 | TFQFP, TQFP64,.47SQ | - | HVQCCN, LCC48,.24SQ,16 | HVQCCN, LCC48,.24SQ,16 |
Reach Compliance Code | compliant | compliant | compliant | - | compliant | compliant |
Factory Lead Time | 7 weeks | 16 weeks | 5 weeks | - | 7 weeks | 7 weeks |
桶式移位器 | YES | YES | YES | - | YES | YES |
位大小 | 16 | 16 | 16 | - | 16 | 16 |
边界扫描 | YES | YES | YES | - | YES | YES |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | - | FLOATING POINT | FIXED POINT |
集成缓存 | NO | NO | NO | - | NO | NO |
内部总线架构 | SINGLE | SINGLE | SINGLE | - | MULTIPLE | SINGLE |
JESD-30 代码 | S-PQCC-N48 | S-PQCC-N64 | S-PQFP-G64 | - | S-PQCC-N48 | S-PQCC-N48 |
长度 | 6 mm | 9 mm | 10 mm | - | 6 mm | 6 mm |
低功率模式 | YES | YES | YES | - | YES | YES |
DMA 通道数量 | 4 | 4 | 4 | - | 4 | 4 |
外部中断装置数量 | 4 | 4 | 4 | - | 4 | 4 |
端子数量 | 48 | 64 | 64 | - | 48 | 48 |
计时器数量 | 1 | 1 | 1 | - | 4 | 1 |
片上数据RAM宽度 | 8 | 8 | 8 | - | 8 | 8 |
片上程序ROM宽度 | 8 | 8 | 8 | - | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | TFQFP | - | HVQCCN | HVQCCN |
封装等效代码 | LCC48,.24SQ,16 | LCC64,.35SQ,20 | TQFP64,.47SQ | - | LCC48,.24SQ,16 | LCC48,.24SQ,16 |
封装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, THIN PROFILE, FINE PITCH | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
RAM(字数) | 8192 | 8192 | 8192 | - | 12288 | 8192 |
ROM可编程性 | FLASH | FLASH | FLASH | - | FLASH | FLASH |
筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | - | TS 16949 | - |
座面最大高度 | 0.6 mm | 1 mm | 1.2 mm | - | 0.6 mm | 0.6 mm |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | - | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | - | YES | YES |
技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | INDUSTRIAL | INDUSTRIAL |
端子形式 | NO LEAD | NO LEAD | GULL WING | - | NO LEAD | NO LEAD |
端子节距 | 0.4 mm | 0.5 mm | 0.5 mm | - | 0.4 mm | 0.4 mm |
端子位置 | QUAD | QUAD | QUAD | - | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
宽度 | 6 mm | 9 mm | 10 mm | - | 6 mm | 6 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | DIGITAL SIGNAL PROCESSOR, CONTROLLER | DIGITAL SIGNAL PROCESSOR, CONTROLLER | - | DIGITAL SIGNAL PROCESSOR, CONTROLLER | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
厂商名称 | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |