3 independent and simultaneous display combinations of DisplayPort /HDMI
/ LVDS monitors
Encode/transcode HD content
Digital Display Interface
DDI1 supporting DisplayPort / HDMI / DVI
DDI2 supporting DisplayPort / HDMI / DVI
DDI3 supporting DisplayPort / HDMI / DVI
VGA
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536)
Memory
Dual channel with ECC 1600/1333 MHz DDR3L memory up to 16GB in dual
SODIMM socket
LVDS
Single/dual channel 18/24-bit LVDS from eDP (two lanes)
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel AMT 9.0 support
®
●
Audio
Chipset
Intel
®
HD Audio integrated in SOC
L3 Cache
6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E
Audio Codec
Located on carrier Express-BASE6 (ALC886 standard supported)
Expansion Busses
PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4)
6 PCI Express x1 (AB): lanes 0/1/2/3/4/5
1 PCI Express x1 (CD): lane 6
LPC bus, SMBus (system) , I
2
C (user)
Supports: Voltage/Current monitoring, Power sequence debug support, AT/
ATX mode control, Logistics and Forensic information, Flat Panel Control,
General Purpose I
2
C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan
Control
●
Ethernet
Intel
®
MAC/PHY: I217LM (Enterprise SKU) with AMT 9.0 support
Interface: 10/100/1000 GbE connection
SEMA Board Controller
●
I/O Interfaces
USB: 4x USB 3.0 (USB 0,1,2,3)
4x USB 2.0 (USB 4,5,6,7)
SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)
Serial: 2 UART ports COM1/2 with console redirection
GPIO: 4 GPO and 4 GPI with interrupt
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
Providing BIOS POST code LED, BMC access, SPI BIOS flashing, Power
Testpoints, Debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
Note:
“build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Specifications
●
Super I/O
Standard support for W83627DHG-P
Supported on carrier if needed
●
Mechanical and Environmental
Form Factor: PICMG COM.0: Rev 2.1 Type 6
Dimension: Basic size: 125 mm x 95 mm
●
TPM
Chipset: Atmel AT97SC3204
Type: TPM 1.2
Operating Temperature
Standard: 0°C to +60°C
Extreme Rugged: -40°C to +85°C (build option)
●
Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V ±5%
Wide Input: ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4,
WOL S3/S4/S5)
ECO mode: Supports deep S5 mode for power saving
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
HALT Tested
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
●
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux , VxWorks, QNX
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Functional Diagram
SODIMM ECC
1333/1600 MHz
1~8 GB DDR3L
SODIMM ECC
1333/1600 MHz
1~8 GB DDR3L
single / dual
18/24-bit LVDS
4
th
Generation
Intel® Core
TM
i7/i5/i3 Processor
eDP
2 lane
60-pin
XDP
D D I 1 (port B )
D P / H D MI / D V I / S D V O
DDI 2 (port C)
DP / HDMI / DVI
DDI 3 (port D)
DP / HDMI / DVI
PCI Express x16 (Gen3)
2 x8 or 1 x8 + 2 x4
RTD2136R/N
eDP-LVDS
Intel® Celeron®
“Haswell”
AB
6x PCIe x1 (Gen2)
(port 0~5)
i217LM
GbE
4x USB 3.0 upgrade (QM87)
2x USB 3.0 upgrade (HM86)
PCIe x1
(port 7)
4x SATA3 (QM87)
2x SATA3 & 2x SATA2 (HM86)
8x USB 1.1/2.0
HD Audio
Mobile Intel®
QM87/HM86
Chipset
1x PCIe x1 (Gen2)
(port 6)
UART0
UART1
Debug
header
NCT5104D
Serial
ATMEL
AT97SC3204
TPM
LPC bus
PCA9535
4x GP0
4x GPI
SMBus
GPIO
SPI 0
BIOS
SPI_CS0
SPI_CS1
GP I C
DDC I
2
C
SPI_CS#
2
SPI 1
BIOS
Sensor
-40+85°C
SEMA
SPI
CD
VGA
DMI
FDI
Ordering Information
●
Accessories
Heat Spreaders
●
Express-HLE-i7-4860EQ
COM Express
®
Basic Size Type 6 Module with Intel
®
Core™
i7-4860EQ at 2.4GHz with GT3 level graphics and ECC
Express-HLE-i7-4700EQ
COM Express
®
Basic Size Type 6 Module with Intel
®
Core™
i7-4700EQ at 2.4/1.7 GHz with GT2 level graphics and ECC
Express-HLE-i5-4400E
COM Express
®
Basic Size Type 6 Module with Intel
®
Core™
i5-4400E at 2.7 GHz with GT2 level graphics and ECC
Express-HLE-i3-4100E
COM Express
®
Basic Size Type 6 Module with Intel
®
Core™
i3-4100E at 2.4 GHz with GT2 level graphics and ECC
Express-HLE-i5-4402E
COM Express
®
Basic Size Type 6 Module with Intel
®
Core™
i5-4402E at 1.6 GHz with GT2 level graphics and ECC
Express-HLE-i3-4102E
COM Express
®
Basic Size Type 6 Module with Intel
®
Core™
i3-4102E at 1.6 GHz with GT2 level graphics and ECC
Express-HLE-2000E
COM Express
®
Basic Size Type 6 Module with Celeron
®
2000E
2.2 GHz (no Turbo) 35W (2C/GT1) with ECC
Express-HLE-2002E
COM Express
®
Basic Size Type 6 Module with Celeron
®
2002E
1.5 GHz (no Turbo) 25W (2C/GT1) with ECC
●
HTS-HL-B
Heatspreader for Express-HL with threaded standoffs for
bottom mounting
HTS-HL-BT
Heatspreader for Express-HL with through hole standoffs for
top mounting
●
●
●
Passive Heatsinks
●
●
THS-HL-BL
Low profile heatsink for Express-HL with threaded standoffs for
bottom mounting
THS-HL-BLT
Low profile heatsink for Express-HL with through hole standoffs
for top mounting
THSH-HL-BL
High profile heatsink for Express-HL with threaded standoffs
for bottom mounting
●
●
●
●
Active Heatsink
●
●
THSF-HL-BL
High profile heatsink with Fan for Express-HL with threaded
standoffs for bottom mounting
Starter Kit
●
COM Express Type 6 Starter Kit Plus
COM Express formfactor starter kit with Express-BASE6 board,
power supply, and accessory kit
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Development Boards u0026 Kits - x86 REF CARRIER BRD FOR COM-Express TYPE 6
Computer-On-Modules - COM
Computer-On-Modules - COM
Computer-On-Modules - COM
Computer-On-Modules - COM
Power Switch ICs - Power Distribution DSO-8-6
Computer-On-Modules - COM COM Express type 6 Module with 2C Intel Celeron 2000E Processor at 2.2 GHz(GT1 only) with HM86 Chipset, with ECC memory support
