High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally
encountered are necessary. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assemblies.
In response to this, and to follow from the success of the FLEXITERM
®
range of low voltage parts, AVX is delighted to offer a FLEXITERM
®
high
voltage range of capacitors, FLEXITERM
®
.
The FLEXITERM
®
layer is designed to enhance the mechanical flexure
and temperature cycling performance of a standard ceramic capacitor,
giving customers a solution where board flexure or temperature cycle
damage are concerns.
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
C
A
S
G
W
H
C
272
K
A
Test Level
Z
Termination*
Z = FLEXITERM
®
100% Tin
(RoHS Compliant)
1
A
Temperature Capacitance Code Capacitance
Coefficient
(2 significant digits
Tolerance
C0G = A
+ no. of zeros)
C0G: J = ±5%
X7R = C
Examples:
K = ±10%
10 pF = 100
M = ±20%
100 pF = 101 X7R: K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
220,000 pF = 224
-20%
1 μF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
0805
1206
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
1210*
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
1808*
4.57 ± 0.25
(0.180 ± 0.010)
2.03 ± 0.25
(0.080 ± 0.010)
2.03
(0.080)
0.25 (0.010)
1.02 (0.040)
1812*
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
1825*
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.30
(0.252 ± 0.012)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
2.01 ± 0.20
(0.079 ± 0.008)
(W) Width
1.25 ± 0.20
(0.049 ± 0.008)
(T) Thickness
1.30
Max.
(0.051)
(t) terminal min. 0.50 ± 0.25
max. (0.020 ± 0.010)
*Reflow Soldering Only
millimeters (inches)
2220*
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
3.30
(0.130)
0.25 (0.010)
1.02 (0.040)
2225*
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
91
High Voltage MLC Chips FLEXITERM
®
For 600V to 5000V Applications
C0G Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance
(+25°C, at 500 VDC)
Insulation Resistance
(+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.018 μF
(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
±5%, ±10%, ±20%
0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
在一年多全球芯片供应短缺的情况下，强劲的需求令各大半导体厂商股价连续几个季度飙涨，但近日Truist分析师William Stein警告，这个趋势可能正在转变。 William Stein在研究报告中指出，本周三需求信号开始转向负面，包括电脑、消费电子和通信OEM厂等，甚至这些OEM厂半数以上的半导体供应商。他认为，需求下滑主要与第二季度产量有关，但是到今年下半年整体市场需求依然强劲。 虽然可能...[详细]
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