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23K256T-I/SN

SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 25ns 8-Pin SOIC N T/R

器件类别：存储    存储   

厂商名称：Microchip(微芯科技)

厂商官网：https://www.microchip.com

器件标准：

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参数 参考设计 预览 参数对比
器件参数
参数名称
属性值
欧盟限制某些有害物质的使用
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8542.32.00.41
Chip Density (bit)
256K
Number of Words
32K
Number of Bits/Word (bit)
8
Data Rate Architecture
SDR
Address Bus Width (bit)
16
Number of Ports
1
Timing Type
Synchronous
Max. Access Time (ns)
25
Maximum Clock Rate (MHz)
20
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Operating Current (mA)
10
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
系列
Packaging
Tape and Reel
Supplier Package
SOIC N
Pin Count
8
Standard Package Name
SOP
Mounting
Surface Mount
Package Height
1.25(Min)
Package Length
4.9
Package Width
3.9
PCB changed
8
Lead Shape
Gull-wing
参考设计
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文档预览
23A256/23K256
256K SPI Bus Low-Power Serial SRAM
Device Selection Table
Part Number
23K256
23A256
V
CC
Range
2.7-3.6V
1.5-1.95V
Page Size
32 Byte
32 Byte
Temp. Ranges
I, E
I
Packages
P, SN, ST
P, SN, ST
Features:
• Max. Clock 20 MHz
• Low-Power CMOS Technology:
- Read Current: 3 mA at 1 MHz
- Standby Current: 4
A
Max. at +85°C
• 32,768 x 8-bit Organization
• 32-Byte Page
• HOLD pin
• Flexible Operating modes:
- Byte read and write
- Page mode (32 Byte Page)
- Sequential mode
• Sequential Read/Write
• High Reliability
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
-40C to +125C
- Automotive (E):
• Pb-Free and RoHS Compliant, Halogen Free
Description:
The Microchip Technology Inc. 23X256 are 256 Kbit
Serial SRAM devices. The memory is accessed via a
simple Serial Peripheral Interface (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
The 23X256 is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead TSSOP.
Package Types (not to scale)
Pin Function Table
Name
CS
SO
V
SS
SI
SCK
HOLD
V
CC
Function
Chip Select Input
Serial Data Output
Ground
Serial Data Input
Serial Clock Input
Hold Input
Supply Voltage
PDIP/SOIC/TSSOP
(P, SN, ST)
CS
SO
NC
V
SS
1
2
3
4
8
7
6
5
V
CC
HOLD
SCK
SI
2008-2011 Microchip Technology Inc.
DS22100F-page 1
23A256/23K256
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
V
CC
.............................................................................................................................................................................4.5V
All inputs and outputs w.r.t. V
SS
......................................................................................................... -0.3V to V
CC
+0.3V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ...........................................................................................................................................2kV
†
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
1.5
2.7
.7 V
CC
-0.3
—
V
CC
-0.5
—
—
—
—
—
—
Standby current
—
—
1
5
4
10
7
—
1.2
—
Typ
(1)
—
—
—
—
—
—
—
—
—
—
—
0.2
Max.
1.95
3.6
V
CC
+0.3
0.2xV
CC
0.15xV
CC
0.2
—
±0.5
±0.5
3
6
10
1
Units
V
V
V
V
V
V
V
A
A
mA
mA
mA
A
A
A
pF
V
Test Conditions
23A256 (I-Temp)
23K256 (I,E-Temp)
DC CHARACTERISTICS
Param.
No.
D001
D001
D002
D003
D004
D005
D006
D007
D008
Sym.
V
CC
V
CC
V
IH
V
IL
V
OL
V
OH
I
LI
I
LO
I
CC
Read
Operating current
D009
I
CCS
Characteristic
Supply voltage
Supply voltage
High-level input
voltage
Low-level input
voltage
Low-level output
voltage
High-level output
voltage
Input leakage
current
Output leakage
current
23K256 (E-Temp)
I
OL
= 1 mA
I
OH
= -400
A
CS = V
CC
, V
IN
= V
SS OR
V
CC
CS = V
CC
, V
OUT
= V
SS OR
V
CC
F
CLK
= 1 MHz; SO = O
F
CLK
= 10 MHz; SO = O
F
CLK
= 20 MHz; SO = O
CS = V
CC
= 1.8V, Inputs tied to V
CC
or V
SS
CS = V
CC
= 3.6V, Inputs tied to V
CC
or V
SS
CS = V
CC
= 3.6V, Inputs tied to V
CC
or V
SS
@ 125°C
V
CC
= 0V, f = 1 MHz, Ta = 25°C
(Note
1)
D010
D011
Note 1:
2:
C
INT
V
DR
Input capacitance
RAM data retention
voltage
(2)
This parameter is periodically sampled and not 100% tested. Typical measurements taken at room
temperature (25°C).
This is the limit to which V
DD
can be lowered without losing RAM data. This parameter is periodically
sampled and not 100% tested.
DS22100F-page 2
2008-2011 Microchip Technology Inc.
23A256/23K256
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
—
—
—
—
50
32
32
25
50
50
50
50
50
32
32
25
10
10
10
10
10
10
10
10
—
—
50
32
32
25
50
32
32
25
50
32
32
25
—
—
—
—
0
Max.
10
16
16
20
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
2
—
—
—
—
—
—
—
—
—
—
—
—
50
32
32
25
—
Units
MHz
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
us
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
Note 1
Note 1
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
Note 1
AC CHARACTERISTICS
Param.
Sym.
No.
1
F
CLK
Characteristic
Clock frequency
2
T
CSS
CS setup time
3
T
CSH
CS hold time
4
T
CSD
CS disable time
5
Tsu
Data setup time
6
T
HD
Data hold time
7
8
9
T
R
T
F
T
HI
CLK rise time
CLK fall time
Clock high time
10
T
LO
Clock low time
11
T
CLD
Clock delay time
12
T
V
Output valid from clock low
13
Note 1:
T
HO
Output hold time
This parameter is periodically sampled and not 100% tested.
2008-2011 Microchip Technology Inc.
DS22100F-page 3
23A256/23K256
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Industrial (I):
T
A
= -40°C to +85°C
Automotive (E): T
A
= -40°C to +125°C
Min.
—
—
—
—
10
10
10
—
Max.
20
20
20
20
—
—
—
50
Units
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
V
CC
½1.5V
(I-Temp)
V
CC
½1.8V
(I-Temp)
V
CC
½3.0V
(E-Temp)
V
CC
½3.0V
(I-Temp)
—
—
—
—
AC CHARACTERISTICS
Param.
Sym.
No.
14
T
DIS
Characteristic
Output disable time
15
16
17
18
Note 1:
T
HS
T
HH
T
HZ
T
HV
HOLD setup time
HOLD hold time
HOLD low to output High-Z
HOLD high to output valid
This parameter is periodically sampled and not 100% tested.
TABLE 1-3:
AC Waveform:
AC TEST CONDITIONS
0.1 V
CC
to 0.9 V
CC
5 ns
-40°C to +125°C
—
0.5 V
CC
0.5 V
CC
Input pulse level
Input rise/fall time
Operating temperature
C
L
= 100 pF
Input
Output
Timing Measurement Reference Level:
DS22100F-page 4
2008-2011 Microchip Technology Inc.
23A256/23K256
FIGURE 1-1:
CS
15
SCK
17
SO
n+2
n+1
n
High-Impedance
17
n
5
n
n-1
n-1
HOLD TIMING
16
16
15
Don’t Care
SI
HOLD
n+2
n+1
n
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
2
SCK
5
SI
6
LSB in
7
8
3
11
MSB in
SO
High-Impedance
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
9
SCK
12
SO
MSB out
Don’t Care
13
14
LSB out
10
3
SI
2008-2011 Microchip Technology Inc.
DS22100F-page 5
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参数对比
与23K256T-I/SN相近的元器件有：23K256-E/P、23K256-E/SN、23K256-I/P、23K256T-I/ST、23K256T-E/ST、23K256T-E/SN、23K256-E/ST、23K256-I/SN、23K256-I/ST。描述及对比如下：
型号 23K256T-I/SN 23K256-E/P 23K256-E/SN 23K256-I/P 23K256T-I/ST 23K256T-E/ST 23K256T-E/SN 23K256-E/ST 23K256-I/SN 23K256-I/ST
描述 SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 25ns 8-Pin SOIC N T/R SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 32ns Automotive 8-Pin PDIP Tube SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 32ns Automotive 8-Pin SOIC N Tube SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 25ns 8-Pin PDIP Tube SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 25ns 8-Pin TSSOP T/R SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 32ns Automotive 8-Pin TSSOP T/R SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 32ns Automotive 8-Pin SOIC N T/R SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 32ns Automotive 8-Pin TSSOP Tube SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 25ns 8-Pin SOIC N Tube SRAM Chip Sync Single 3.3V 256K-bit 32K x 8 25ns 8-Pin TSSOP Tube
欧盟限制某些有害物质的使用 Compliant Compliant Compliant Compliant Compliant Compliant Compliant Compliant Compliant Compliant
ECCN (US) EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Part Status Active Active Active Active Active Active Active Active Active Active
HTS 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41 8542.32.00.41
Chip Density (bit) 256K 256K 256K 256K 256K 256K 256K 256K 256K 256K
Number of Words 32K 32K 32K 32K 32K 32K 32K 32K 32K 32K
Number of Bits/Word (bit) 8 8 8 8 8 8 8 8 8 8
Data Rate Architecture SDR SDR SDR SDR SDR SDR SDR SDR SDR SDR
Address Bus Width (bit) 16 16 16 16 16 16 16 16 16 16
Number of Ports 1 1 1 1 1 1 1 1 1 1
Timing Type Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous
Max. Access Time (ns) 25 32 32 25 25 32 32 32 25 25
Maximum Clock Rate (MHz) 20 20 20 20 20 20 20 20 20 20
Minimum Operating Supply Voltage (V) 2.7 2.7 2.7 2.7 2.7 2.7 2.7 2.7 2.7 2.7
Typical Operating Supply Voltage (V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
Maximum Operating Supply Voltage (V) 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6 3.6
Operating Current (mA) 10 10 10 10 10 10 10 10 10 10
Minimum Operating Temperature (°C) -40 -40 -40 -40 -40 -40 -40 -40 -40 -40
Maximum Operating Temperature (°C) 85 125 125 85 85 125 125 125 85 85
Supplier Temperature Grade Industrial Automotive Automotive Industrial Industrial Automotive Automotive Automotive Industrial Industrial
系列
Packaging		 Tape and Reel Tube Tube Tube Tape and Reel Tape and Reel Tape and Reel Tube Tube Tube
Supplier Package SOIC N PDIP SOIC N PDIP TSSOP TSSOP SOIC N TSSOP SOIC N TSSOP
Pin Count 8 8 8 8 8 8 8 8 8 8
Standard Package Name SOP DIP SOP DIP SOP SOP SOP SOP SOP SOP
Mounting Surface Mount Through Hole Surface Mount Through Hole Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package Height 1.25(Min) 3.3 1.25(Min) 3.3 1 1 1.25(Min) 1 1.25(Min) 1
Package Length 4.9 9.27 4.9 9.27 3 3 4.9 3 4.9 3
Package Width 3.9 6.35 3.9 6.35 4.4 4.4 3.9 4.4 3.9 4.4
PCB changed 8 8 8 8 8 8 8 8 8 8
Lead Shape Gull-wing Through Hole Gull-wing Through Hole Gull-wing Gull-wing Gull-wing Gull-wing Gull-wing Gull-wing
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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