型号
- 型号
- 关键词
512 X 8 SPI BUS SERIAL EEPROM, PDSO8
512 × 8 总线串行电可擦除只读存储器, PDSO8
厂商名称：Microchip(微芯科技)
厂商官网：https://www.microchip.com
器件标准：
| 型号 | 25LC040A-H/SN | 25LC040AT-H/SN | 25LC040A | 25LC020A-H/SN | 25LC010A_09 | 25LC020A | 25LC010A |
|---|---|---|---|---|---|---|---|
| 描述 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 组织 | 512X8 | 512X8 | 512 X 8 | 256X8 | 512 X 8 | 512 X 8 | 512 X 8 |
| 表面贴装 | YES | YES | Yes | YES | Yes | Yes | Yes |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大工作温度 | - | - | 150 Cel | - | 150 Cel | 150 Cel | 150 Cel |
| 最小工作温度 | - | - | -40 Cel | - | -40 Cel | -40 Cel | -40 Cel |
| 最大供电/工作电压 | - | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电/工作电压 | - | - | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V |
| 额定供电电压 | - | - | 5 V | - | 5 V | 5 V | 5 V |
| 最大时钟频率 | - | - | 5 MHz | - | 5 MHz | 5 MHz | 5 MHz |
| 加工封装描述 | - | - | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | - | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
| 无铅 | - | - | Yes | - | Yes | Yes | Yes |
| 欧盟RoHS规范 | - | - | Yes | - | Yes | Yes | Yes |
| 中国RoHS规范 | - | - | Yes | - | Yes | Yes | Yes |
| 状态 | - | - | ACTIVE | - | ACTIVE | ACTIVE | ACTIVE |
| 工艺 | - | - | CMOS | - | CMOS | CMOS | CMOS |
| 包装形状 | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 包装尺寸 | - | - | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 端子间距 | - | - | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子涂层 | - | - | MATTE TIN | - | MATTE TIN | MATTE TIN | MATTE TIN |
| 包装材料 | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 存储密度 | - | - | 4096 deg | - | 4096 deg | 4096 deg | 4096 deg |
| 操作模式 | - | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 位数 | - | - | 512 | - | 512 | 512 | 512 |
| 内存IC类型 | - | - | SPI BUS SERIAL EEPROM | - | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM |
| 串行并行 | - | - | SERIAL | - | SERIAL | SERIAL | SERIAL |
| 写周期最大TWC | - | - | 6 ms | - | 6 ms | 6 ms | 6 ms |