Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 5/25/17
.1% Thin Film Chip Resistors
(RoHS Compliant)
CHARACTERISTICS
Characteristics
Limits
288-0603-RC & 288-0805-RC Series
Test Methods
Temperature
Coefficient
Refer to item 5.
Natural resistance change per temp. degree centigrade.
R2-R1
x 106 (PPM/ºC)
R1(t2-t1)
R1: Resistance value at room temperature (t1)
R2: Resistance value at room temp. plus 100 ºC (t2)
Short-time
overload
Insulation
Reistance
Load Life
Humidity
(steady state)
Terminal bending
Solderability
Soldering Heat
∆
R/R: ±0.5%
>1,000mΩ
∆
R/R: ±0.2%
>7KΩ
∆
R/R:±0.5%
∆ R/R: ±0.3%
∆
R/R: ±0.2%
95% coverage min.
∆
R/R: ±0.2%
Permanent resistance change after the application of
2.5 times RCWV for 5 seconds.
Apply 100V dc for 1 minute
RCWW 70ºC, 1.5 hours on, 0.5 hours off, total 1,000 hours.
40ºC,90~95%rh, RCWV 1.5 hours on, 0.5 hours off, total 1,000 hours.
Twist of test board:
Y/X = 3/90 mm for 10 Seconds
Wave Solder:
Test temperature of solder: 245ºC±5ºC dipping time
in solder: 2-3 seconds.
Dip the resistor into a solder bath having a temperature of 260ºC+5ºC and
hold it for 10±1 seconds.
XC-600224
XICON PASSIVE COMPONENTS • (800) 628-0544
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
