型号
- 型号
- 关键词
| 型号 | 40C100B | 40C120B | 40C40B | 40C80B | 40C20B | 40C60B | 40C_07 |
|---|---|---|---|---|---|---|---|
| 描述 | Silicon Controlled Rectifier | Silicon Controlled Rectifier | Silicon Controlled Rectifier | Silicon Controlled Rectifier | Silicon Controlled Rectifier | Silicon Controlled Rectifier | Silicon Controlled Rectifier |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | - |
| 零件包装代码 | TO-65 | TO-65 | TO-65 | TO-65 | TO-65 | TO-65 | - |
| 包装说明 | POST/STUD MOUNT, O-MUPM-D2 | POST/STUD MOUNT, O-MUPM-D2 | POST/STUD MOUNT, O-MUPM-D2 | POST/STUD MOUNT, O-MUPM-D2 | POST/STUD MOUNT, O-MUPM-D2 | POST/STUD MOUNT, O-MUPM-D2 | - |
| 针数 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | - |
| 标称电路换相断开时间 | 100 µs | 100 µs | 100 µs | 100 µs | 100 µs | 100 µs | - |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | - |
| 关态电压最小值的临界上升速率 | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | 200 V/us | - |
| 最大直流栅极触发电流 | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | - |
| 最大直流栅极触发电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 最大维持电流 | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA | 200 mA | - |
| JEDEC-95代码 | TO-208AC | TO-208AC | TO-208AC | TO-208AC | TO-208AC | TO-208AC | - |
| JESD-30 代码 | O-MUPM-D2 | O-MUPM-D2 | O-MUPM-D2 | O-MUPM-D2 | O-MUPM-D2 | O-MUPM-D2 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C | - |
| 封装主体材料 | METAL | METAL | METAL | METAL | METAL | METAL | - |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | - |
| 封装形式 | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | POST/STUD MOUNT | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 最大均方根通态电流 | 63 A | 63 A | 63 A | 63 A | 63 A | 63 A | - |
| 重复峰值关态漏电流最大值 | 6000 µA | 6000 µA | 6000 µA | 6000 µA | 6000 µA | 6000 µA | - |
| 断态重复峰值电压 | 1000 V | 1200 V | 400 V | 800 V | 200 V | 600 V | - |
| 重复峰值反向电压 | 1000 V | 1200 V | 400 V | 800 V | 200 V | 600 V | - |
| 表面贴装 | NO | NO | NO | NO | NO | NO | - |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - |
| 端子形式 | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | SOLDER LUG | - |
| 端子位置 | UPPER | UPPER | UPPER | UPPER | UPPER | UPPER | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 触发设备类型 | SCR | SCR | SCR | SCR | SCR | SCR | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
