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5962-9561320HUX

Standard SRAM, 512KX8, 45ns, CMOS, CDFP36, CERAMIC, DFP-36

器件类别:存储    存储   

厂商名称:White Electronic Designs Corporation

厂商官网:http://www.wedc.com/

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器件参数
参数名称
属性值
厂商名称
White Electronic Designs Corporation
包装说明
CERAMIC, DFP-36
Reach Compliance Code
unknown
最长访问时间
45 ns
JESD-30 代码
R-CDFP-F36
长度
23.365 mm
内存密度
4194304 bit
内存集成电路类型
STANDARD SRAM
内存宽度
8
功能数量
1
端子数量
36
字数
524288 words
字数代码
512000
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
512KX8
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
DFP
封装形状
RECTANGULAR
封装形式
FLATPACK
并行/串行
PARALLEL
认证状态
Not Qualified
座面最大高度
3.18 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子形式
FLAT
端子节距
1.27 mm
端子位置
DUAL
宽度
12.955 mm
Base Number Matches
1
文档预览
NOT MEASUREMENT
SENSITIVE
MIL-HDBK-103AP
6 MARCH 2014
SUPERSEDING
MIL-HDBK-103AN
12 SEPTEMBER 2013
DEPARTMENT OF DEFENSE
HANDBOOK
LIST OF STANDARD MICROCIRCUIT DRAWINGS
This handbook is for guidance only. Do not cite this document
as a requirement.
AMSC N/A
FSC 5962
MIL-HDBK-103AP
FOREWORD
1. This handbook is approved for use by all Departments and Agencies of the Department of Defense.
2. This handbook is for guidance only. This handbook cannot be cited as a requirement. If it is, the contractor does not have
to comply.
3. The proliferation of industry prepared drawings for the same part used in a variety of military applications has become an
ever increasing item of expense to the DoD. Numerous situations have arisen where one military acquisition document would
be more appropriate and cost effective than the multiplicity of contractor prepared drawings. Standard Microcircuit Drawings
(SMDs) are being prepared to eliminate the need for the multitude of contractor prepared drawings for the same device when
the minimum requirements of SMD's are sufficient to meet the requirements of the application on an interim or permanent
basis.
4. Comments, suggestions, or questions on this document should be addressed to: Commander, DLA Land and Maritime,
ATTN: VAS, 3990 East Broad St., Columbus, OH 43218-3990, or emailed to
linear@dla.mil.
Since contact information can
change, you may want to verify the currency of this address information using the ASSIST online database at
https://assist.dla.mil.
ii
MIL-HDBK-103AP
CONTENTS
PARAGRAPH
1.
1.1
1.2
1.2.1
1.2.2
1.2.3
1.2.4
2.
3.
4.
4.1
4.2
4.3
4.4
4.5
4.6
5.
5.1
5.2
6.
6.1
6.1.1
6.1.2
6.2
7.
7.1
7.2
TABLE 1
SECTION 1
Part I
Part II
Part III
PAGE
SCOPE .......................................................................................................................................... 1
Purpose...................................................................................................................................... 1
Part or identifying number (PIN) ................................................................................................ 1
Drawing number......................................................................................................................... 1
Device class designator ............................................................................................................. 1
Case outline / lead finish ............................................................................................................ 2
Substitutability ............................................................................................................................ 2
APPLICABLE DOCUMENTS ......................................................................................................... 2
DEFINITIONS ................................................................................................................................ 2
REQUIREMENTS .......................................................................................................................... 2
Drawing requirements ................................................................................................................ 2
Preparation procedures ............................................................................................................. 2
Drawing effectivity and duration ................................................................................................. 2
Approved sources of supply....................................................................................................... 2
Radiation hardness assurance (RHA) levels ............................................................................. 2
Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3
CONFIGURATION MANAGEMENT .............................................................................................. 3
Configuration management of SMDs ......................................................................................... 3
Record of users.......................................................................................................................... 3
DISTRIBUTION and REQUESTS .................................................................................................. 4
Distribution ................................................................................................................................. 4
Automatic distribution ................................................................................................................ 4
Electronic distribution ................................................................................................................. 4
Requests .................................................................................................................................... 4
NOTES .......................................................................................................................................... 4
Intended use .............................................................................................................................. 4
Subject item (key word) listing ................................................................................................... 4
Noun code descriptions ................................................................................................................. 5
Microcircuits................................................................................................................................... 12
Listed by SMD PIN .....................................................................................................................
12
Listed by generic PIN .................................................................................................................
714
Listed approved sources ............................................................................................................
932
Concluding material ...................................................................................................................
936
iii
MIL-HDBK-103AP
1. SCOPE
1.1 Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the
DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP will be
the avenue for screening candidate parts for the SMDP by the DLA Land and Maritime Military Parts Control Advisory Group
(MPCAG).
1.2 Part or Identifying number (PIN). The PIN's listed in section 1, part I, are composed of the elements shown in the
following example (see 1.2.2 for one part - one part number differentiation):
One part - one part number PIN
5962-90123
01
M
X
A
Drawing number
(1.2.1)
Device
Type
Device
Class
Designator
(1.2.2)
Case
Outline
(1.2.3)
Lead
Finish
(1.2.3)
Non - one part - one part number PIN
86030
or
5962-88668
Drawing number
01
X
A
Device type
Case outline
(1.2.3)
Lead finish
(1.2.3)
1.2.1 Drawing number. One part - one part number SMD's for device classes Q, V, H, and K may cover custom device
products which are generally used to specify application specific integrated circuits (both monolithic and hybrid). To
differentiate between one part - one part number SMD's that cover standard product from custom product a single alpha
character will be placed in the unique 3 digit portion of the SMD drawing number as in the following example: 5962-90A23.
This will be the only change to the SMD PIN for custom products.
1.2.2 Device class designator. One part - one part number SMD's (fully implemented after SMD 5962-90659) contain device
requirements for all three of the major military microcircuit requirements documents. By establishing a one part number
system covering all three documents, the OEM can acquire to the highest level available for a given generic device to meet
system needs without modifying the original contract parts selection criteria.
Military documentation format
New MIL-PRF-38535 Standard
Microcircuit Drawings
New MIL-PRF-38534 Standard
Microcircuit Drawings
New 1.2.1 of MIL-STD-883 Standard
Microcircuit Drawings, based on
Appendix A of MIL-PRF-38535
Example PIN
5962-XXXXXZZ(Q,V,T or N)YY
5962-XXXXXZZ(H,K,D,G or E)YY
5962-XXXXXZZ(M)YY
Manufacturing
source listing
QML-38535
QML-38534
MIL-HDBK-103
Document
listing
MIL-HDBK-103
MIL-HDBK-103
MIL-HDBK-103
This handbook is for guidance only and cannot be cited as a requirement.
1
MIL-HDBK-103AP
1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the
section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to
supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the
other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed
herein.
1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.
2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.
3. DEFINITIONS This section is not applicable to the handbook.
4. REQUIREMENTS
4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.
4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.
4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become
inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.
4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources
formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources
of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device
classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the
convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.
Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of
supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for
those devices that the manufacturer specifies that he will no longer supply.
4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or
MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN
as indicated in the following example:
5962(M, D, P, L, R, F, G, or H)8999901EA
Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;
however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request
of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The
manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in
Section 1, Part I of the appendix of this document.
2
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