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6AM11

0.27ohm, POWER, FET, SP12, 12 PIN

器件类别:分立半导体    晶体管   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
包装说明
SP12, 12 PIN
针数
12
Reach Compliance Code
unknown
最大漏极电流 (Abs) (ID)
5 A
FET 技术
METAL-OXIDE SEMICONDUCTOR
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
极性/信道类型
N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs)
36 W
表面贴装
NO
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To all our customers
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Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
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Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
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6AM11
Silicon N-Channel/P-Channel Power MOS FET Array
ADE-208-1215 (Z)
1st. Edition
Mar. 2001
Application
High speed power switching
Features
Low on-resistance
N-channel: R
DS(on)
0.17 , V
GS
= 10 V, I
D
= 2.5 A
P-channel: R
DS(on)
0.2 , V
GS
= –10 V, I
D
= –2.5 A
Capable of 4 V gate drive
Low drive current
High speed switching
High density mounting
Suitable for H-bridged motor driver
6AM11
Outline
SP-12
5
S
Pch
6
G
4G
11
G
12
S
12
Nch
2G
D3
8
G
D7
9
G
D 10
34
56
78
9 10
1112
S
1
N-ch Source
1.
2, 8, 9 N-ch Gate
3, 7, 10. N-ch Drain
P-ch Drain
4, 6, 11. P-ch Gate
5, 12. P-ch Source
Absolute Maximum Ratings
(Ta = 25°C) (1 Unit)
Ratings
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body to drain diode reverse drain current
Channel dissipation
Symbol
V
DSS
V
GSS
I
D
I
D(pulse)
*
1
I
DR
Pch*
2
Channel temperature
Storage temperature
Notes: 1. PW
10 µs, duty cycle
1%
2. 6 Device Operation
Tch
Tstg
Nch
60
±20
5
20
5
Pch
–60
±20
–5
–20
–5
Unit
V
V
A
A
A
W
W
°C
°C
Pch (Tc = 25°C)*
2
36
4.8
150
–55 to +150
6AM11
Electrical Characteristics
(Ta = 25°C) (1 Unit)
N channel
Item
Drain to source
breakdown voltage
Gate to source
breakdown voltage
Gate to source leak
current
Symbol
V
(BR)DSS
V
(BR)GSS
I
GSS
Min
60
±20
1.0
Forward transfer
admittance
Input capacitance
Output capacitance
Reverse transfer
capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Body to drain diode
forward voltage
Body to drain diode
reverse recovery time
Note:
|y
fs
|
Ciss
Coss
Crss
t
d(on)
t
r
t
d(off)
t
f
V
DF
t
rr
2.7
Typ
0.13
0.18
4.5
400
220
60
5
30
170
75
1.0
100
Max
±10
250
2.0
0.17
0.24
P channel
Min
–60
±20
–1.0
2.7
Typ
0.15
0.20
5.0
900
460
130
8
35
180
85
–1.0
170
Max
±10
Unit
V
V
µA
Test conditions
I
D
= 10 mA, V
GS
= 0
I
G
= ±100 µA, V
DS
= 0
V
GS
= ±16 V, V
DS
= 0
V
DS
= 50 V, V
GS
= 0
I
D
= 1 mA, V
DS
= 10 V
I
D
= 2.5 A,
V
GS
= 10 V*
1
I
D
= 2.5 A, V
GS
= 4 V*
1
I
D
= 2.5 A,
V
DS
= 10 V*
1
V
DS
= 10 V, V
GS
= 0,
f = 1 MHz
Zero gate voltage drain I
DSS
current
Gate to source cutoff
voltage
Static drain to source
on state resistance
V
GS(off)
R
DS(on)
–250 µA
–2.0
0.2
0.27
V
S
pF
pF
pF
ns
ns
ns
ns
V
ns
I
D
= 2.5 A, V
GS
= 10 V,
R
L
= 12
I
F
= 5 A, V
GS
= 0
I
F
= 5 A, V
GS
= 0,
diF/dt = 50 A/µs
1. Pulse Test
Polarity of test conditions for P channel device is reversed.
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