型号
- 型号
- 关键词
| 型号 | 7204S12TP | 5962-01-356-3041 | 7203S25J | 5962-01-319-9077 | 5962-01-418-5858 | 5962-01-413-3523 | 7203S12TP | 7203S35J |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 4KX9, 12ns, Asynchronous, CMOS, PDIP28 | FIFO, 4KX9, 50ns, Asynchronous, CMOS, PDIP28 | FIFO, 2KX9, 25ns, Asynchronous, CMOS, PQCC32 | FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28 | FIFO, 4KX9, 35ns, Asynchronous, CMOS, PDIP28 | FIFO, 4KX9, 50ns, Asynchronous, CMOS, CDIP28 | FIFO, 2KX9, 12ns, Asynchronous, CMOS, PDIP28 | FIFO, 2KX9, 35ns, Asynchronous, CMOS, PQCC32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | _compli | _compli | not_compliant | not_compliant | not_compliant | _compli | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 12 ns | 50 ns | 25 ns | 65 ns | 35 ns | 50 ns | 12 ns | 35 ns |
| 最大时钟频率 (fCLK) | 50 MHz | 15 MHz | 28.5 MHz | 12.5 MHz | 22.2 MHz | 15 MHz | 50 MHz | 22.2 MHz |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-PQCC-J32 |
| 内存密度 | 36864 bi | 36864 bi | 18432 bit | 18432 bit | 36864 bit | 36864 bi | 18432 bi | 18432 bi |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 端子数量 | 28 | 28 | 32 | 28 | 28 | 28 | 28 | 32 |
| 字数 | 4096 words | 4096 words | 2048 words | 2048 words | 4096 words | 4096 words | 2048 words | 2048 words |
| 字数代码 | 4000 | 4000 | 2000 | 2000 | 4000 | 4000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| 组织 | 4KX9 | 4KX9 | 2KX9 | 2KX9 | 4KX9 | 4KX9 | 2KX9 | 2KX9 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | DIP | DIP | DIP | DIP | QCCJ |
| 封装等效代码 | DIP28,.3 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.3 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 | 260 | 225 | 260 | 260 | 260 | 225 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.012 A | 0.008 A | 0.012 A | 0.008 A | 0.008 A |
| 最大压摆率 | 0.12 mA | 0.12 mA | 0.12 mA | 0.15 mA | 0.12 mA | 0.15 mA | 0.12 mA | 0.12 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 6 | 30 | 6 | 6 | 6 | 30 | 30 |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | - | e0 | e0 |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
