描述 |
SOIC-24, Tube |
SOIC-24, Tube |
SOIC-24, Tube |
SOIC-24, Tube |
FIFO, 256X1, 8ns, Synchronous, CMOS, PDIP24 |
FIFO, 512X1, 8ns, Synchronous, CMOS, PDIP24 |
FIFO, 64X1, 8ns, Synchronous, CMOS, PDIP24 |
是否无铅 |
含铅 |
含铅 |
含铅 |
含铅 |
含铅 |
含铅 |
含铅 |
是否Rohs认证 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
不符合 |
厂商名称 |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
包装说明 |
SOP, SOP24,.4 |
SOP, SOP24,.4 |
SOIC-24 |
SOP, SOP24,.4 |
DIP, DIP24,.3 |
DIP, DIP24,.3 |
DIP, DIP24,.3 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
_compli |
_compli |
_compli |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
最长访问时间 |
10 ns |
8 ns |
10 ns |
10 ns |
8 ns |
8 ns |
8 ns |
最大时钟频率 (fCLK) |
66.7 MHz |
83.3 MHz |
66.7 MHz |
66.7 MHz |
83.3 MHz |
83.3 MHz |
83.3 MHz |
周期时间 |
15 ns |
12 ns |
15 ns |
15 ns |
12 ns |
12 ns |
12 ns |
JESD-30 代码 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDIP-T24 |
R-PDIP-T24 |
R-PDIP-T24 |
JESD-609代码 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
内存密度 |
256 bit |
256 bit |
512 bit |
64 bit |
256 bi |
512 bi |
64 bi |
内存集成电路类型 |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
内存宽度 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
24 |
24 |
24 |
24 |
24 |
24 |
24 |
字数 |
256 words |
256 words |
512 words |
64 words |
256 words |
512 words |
64 words |
字数代码 |
256 |
256 |
512 |
64 |
256 |
512 |
64 |
工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
组织 |
256X1 |
256X1 |
512X1 |
64X1 |
256X1 |
512X1 |
64X1 |
可输出 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SOP |
SOP |
SOP |
SOP |
DIP |
DIP |
DIP |
封装等效代码 |
SOP24,.4 |
SOP24,.4 |
SOP24,.4 |
SOP24,.4 |
DIP24,.3 |
DIP24,.3 |
DIP24,.3 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
IN-LINE |
并行/串行 |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
峰值回流温度(摄氏度) |
225 |
225 |
225 |
225 |
225 |
225 |
225 |
电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
最大待机电流 |
0.08 A |
0.08 A |
0.08 A |
0.08 A |
0.08 A |
0.08 A |
0.08 A |
最大压摆率 |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
NO |
NO |
NO |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
端子节距 |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
2.54 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
30 |
30 |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
- |
- |
- |
零件包装代码 |
SOIC |
SOIC |
SOIC |
SOIC |
- |
- |
- |
针数 |
24 |
24 |
24 |
24 |
- |
- |
- |
制造商包装代码 |
PS24 |
PS24 |
PS24 |
PS24 |
- |
- |
- |
湿度敏感等级 |
1 |
1 |
1 |
1 |
- |
- |
- |