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74HC259DB,112

Latches 8-BIT ADDRSSBL LATCH

器件类别:逻辑    逻辑   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
Brand Name
NXP Semiconductor
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
SSOP1
包装说明
5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
针数
16
制造商包装代码
SOT338-1
Reach Compliance Code
compliant
其他特性
1:8 DMUX FOLLOWED BY LATCH
系列
HC/UH
JESD-30 代码
R-PDSO-G16
JESD-609代码
e4
长度
6.2 mm
负载电容(CL)
50 pF
逻辑集成电路类型
D LATCH
最大I(ol)
0.004 A
湿度敏感等级
1
位数
1
功能数量
1
端子数量
16
最高工作温度
125 °C
最低工作温度
-40 °C
输出极性
TRUE
封装主体材料
PLASTIC/EPOXY
封装代码
SSOP
封装等效代码
SSOP16,.3
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
2/6 V
Prop。Delay @ Nom-Sup
56 ns
传播延迟(tpd)
255 ns
认证状态
Not Qualified
座面最大高度
2 mm
最大供电电压 (Vsup)
6 V
最小供电电压 (Vsup)
2 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
NICKEL PALLADIUM GOLD
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
触发器类型
LOW LEVEL
宽度
5.3 mm
Base Number Matches
1
文档预览
74HC259; 74HCT259
8-bit addressable latch
Rev. 6 — 2 February 2016
Product data sheet
1. General description
The 74HC259; 74HCT259 is an 8-bit addressable latch. The device features four modes
of operation. In the addressable latch mode, data on the D input is written into the latch
addressed by the inputs AO to A3. The addressed latch will follow the data input,
non-addressed latches will retain their previous states. In memory mode, all latches retain
their previous states and are unaffected by the data or address inputs. In the 3-to-8
decoding or demultiplexing mode, the addressed output follows the D input and all other
outputs are LOW. In the reset mode, all outputs are forced LOW and unaffected by the
data or address inputs. Inputs include clamp diodes. This enables the use of current
limiting resistors to interface inputs to voltages in excess of V
CC
.
2. Features and benefits
Combined demultiplexer and 8-bit latch
Serial-to-parallel capability
Output from each storage bit available
Random (addressable) data entry
Easily expandable
Common reset input
Useful as a 3-to-8 active HIGH decoder
Complies with JEDEC standard no. 7A
Input levels:
For 74HC259: CMOS level
For 74HCT259: TTL level
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22E exceeds 1000 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
Nexperia
74HC259; 74HCT259
8-bit addressable latch
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC259D
74HCT259D
74HC259DB
74HCT259DB
74HC259PW
74HCT259PW
74HC259BQ
74HCT259BQ
40 C
to +125
C
DHVQFN16
40 C
to +125
C
TSSOP16
40 C
to +125
C
SSOP16
40 C
to +125
C
SO16
Description
plastic small outline package; 16 leads;
body width 3.9 mm
plastic shrink small outline package; 16 leads; body
width 5.3 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
Version
SOT109-1
SOT338-1
SOT403-1
Type number
plastic dual in-line compatible thermal enhanced very SOT763-1
thin quad flat package; no leads; 16 terminals;
body 2.5
3.5
0.85 mm
4. Functional diagram
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
74HC_HCT259
All information provided in this document is subject to legal disclaimers.
.
Product data sheet
Rev. 6 — 2 February 2016
©
2 of 21
Nexperia B.V. 2017. All rights reserved
Nexperia
74HC259; 74HCT259
8-bit addressable latch
Fig 3.
Functional diagram
5. Pinning information
5.1 Pinning
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4.
Pin configuration SO16, SSOP16 and
TSSOP16
Fig 5.
Pin configuration DHVQFN16
74HC_HCT259
All information provided in this document is subject to legal disclaimers.
.
Product data sheet
Rev. 6 — 2 February 2016
©
3 of 21
Nexperia B.V. 2017. All rights reserved
Nexperia
74HC259; 74HCT259
8-bit addressable latch
5.2 Pin description
Table 2.
Symbol
A0, A1, A2
Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7
GND
D
LE
MR
V
CC
Pin description
Pin
1, 2, 3
4, 5, 6, 7, 9, 10, 11, 12
8
13
14
15
16
Description
address input
latch output
ground (0 V)
data input
latch enable input (active LOW)
conditional reset input (active LOW)
supply voltage
6. Functional description
Table 3.
Function table
[1]
Input
MR
Reset (clear)
L
L
Demultiplexer
(active HIGH 8-channel) L
decoder (when D = H)
L
L
L
L
L
L
Memory (no action)
Addressable latch
H
H
H
H
H
H
H
H
H
[1]
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
d = HIGH or LOW data one set-up time prior to the LOW-to-HIGH LE transition;
q = lower case letter indicates the state of the referenced input one set-up time prior to the LOW-to-HIGH transition.
Operating mode
Output
LE
H
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
D
X
d
d
d
d
d
d
d
d
X
d
d
d
d
d
d
d
d
A0
X
L
H
L
H
L
H
L
H
X
L
H
L
H
L
H
L
H
A1
X
L
L
H
H
L
L
H
H
X
L
L
H
H
L
L
H
H
A2
X
L
L
L
L
H
H
H
H
X
L
L
L
L
H
H
H
H
Q0
L
L
L
L
L
L
L
L
q
0
q
0
q
0
q
0
q
0
q
0
q
0
q
0
Q1
L
Q2
L
L
Q3
L
L
L
Q4
L
L
L
L
Q5
L
L
L
L
L
Q6
L
L
L
L
L
L
Q7
L
L
L
L
L
L
L
Q=d
q
7
q
7
q
7
q
7
q
7
q
7
q
7
Q=d
Q=d L
L
L
L
L
L
L
q
1
Q=d L
L
L
L
L
L
q
2
q
2
Q=d L
L
L
L
L
q
3
q
3
q
3
Q=d L
L
L
L
q
4
q
4
q
4
q
4
Q=d L
L
L
q
5
q
5
q
5
q
5
q
5
Q=d L
L
q
6
q
6
q
6
q
6
q
6
q
6
Q=d L
Q = d q
1
q
1
q
1
q
1
q
1
q
1
q
1
Q = d q
2
q
2
q
2
q
2
q
2
q
2
Q = d q
3
q
3
q
3
q
3
q
3
Q = d q
4
q
4
q
4
q
4
Q = d q
5
q
5
q
5
Q = d q
6
q
6
Q = d q
7
74HC_HCT259
All information provided in this document is subject to legal disclaimers.
.
Product data sheet
Rev. 6 — 2 February 2016
©
4 of 21
Nexperia B.V. 2017. All rights reserved
Nexperia
74HC259; 74HCT259
8-bit addressable latch
Table 4.
LE
L
H
L
H
[1]
Operating mode select table
[1]
MR
H
H
L
L
Mode
Addressable latch mode
Memory mode
Demultiplexer mode
Reset mode
H = HIGH voltage level; L = LOW voltage level.
7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
I
IK
I
OK
I
O
I
CC
I
GND
T
stg
P
tot
Parameter
supply voltage
input clamping current
output clamping current
output current
supply current
ground current
storage temperature
total power dissipation
T
amb
=
40 C
to +125
C
SO16 package
(T)SSOP16 package
DHVQFN16 package
[1]
[2]
[3]
[4]
[2]
[3]
[4]
Conditions
V
I
<
0.5
V or V
I
> V
CC
+ 0.5 V
V
O
<
0.5
V or V
O
> V
CC
+ 0.5 V
V
O
=
0.5
V to V
CC
+ 0.5 V
[1]
[1]
Min
0.5
-
-
-
-
70
65
-
-
-
Max
+7.0
20
20
25
+70
-
+150
500
500
500
Unit
V
mA
mA
mA
mA
mA
C
mW
mW
mW
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
P
tot
derates linearly with 8 mW/K above 70
C.
P
tot
derates linearly with 5.5 mW/K above 60
C.
P
tot
derates linearly with 4.5 mW/K above 60
C.
74HC_HCT259
All information provided in this document is subject to legal disclaimers.
.
Product data sheet
Rev. 6 — 2 February 2016
©
5 of 21
Nexperia B.V. 2017. All rights reserved
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参数对比
与74HC259DB,112相近的元器件有:74HCT259DB,112、74HCT259PW,118。描述及对比如下:
型号 74HC259DB,112 74HCT259DB,112 74HCT259PW,118
描述 Latches 8-BIT ADDRSSBL LATCH Latches 8-BIT ADDRSSBL LATCH Latches 8-BIT ADDRSSBL LATCH
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor
是否Rohs认证 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SSOP1 SSOP1 TSSOP
包装说明 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
针数 16 16 16
制造商包装代码 SOT338-1 SOT338-1 SOT403-1
Reach Compliance Code compliant compliant compliant
其他特性 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH
系列 HC/UH HCT HCT
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e4 e4 e4
长度 6.2 mm 6.2 mm 5 mm
负载电容(CL) 50 pF 50 pF 50 pF
逻辑集成电路类型 D LATCH D LATCH D LATCH
最大I(ol) 0.004 A 0.004 A 0.00002 A
湿度敏感等级 1 1 1
位数 1 1 1
功能数量 1 1 1
端子数量 16 16 16
最高工作温度 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C
输出极性 TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP SSOP TSSOP
封装等效代码 SSOP16,.3 SSOP16,.3 TSSOP16,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260
电源 2/6 V 5 V 5 V
Prop。Delay @ Nom-Sup 56 ns 59 ns 59 ns
传播延迟(tpd) 255 ns 57 ns 57 ns
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 2 mm 2 mm 1.1 mm
最大供电电压 (Vsup) 6 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30
触发器类型 LOW LEVEL LOW LEVEL LOW LEVEL
宽度 5.3 mm 5.3 mm 4.4 mm
Base Number Matches 1 1 1
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器件捷径:
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