74AHC573-Q100; 74AHCT573-Q100
Octal D-type transparant latch; 3-state
Rev. 1 — 10 June 2013
Product data sheet
1. General description
The 74AHC573-Q100; 74AHCT573-Q100 is a high-speed Si-gate CMOS device and is
pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with
JEDEC standard No. 7A.
The 74AHC573-Q100; 74AHCT573-Q100 consists of eight D-type transparent latches
featuring separate D-type inputs for each latch and 3-state true outputs for bus oriented
applications. A latch enable input (LE) and an output enable input (OE) are common to all
latches.
When pin LE is HIGH, data at the Dn inputs enters the latches. In this condition the
latches are transparent, i.e. a latch output will change state each time its corresponding
Dn input changes. When pin LE is LOW, the latches store the information that is present
at the Dn inputs, after a set-up time preceding the HIGH-to-LOW transition of LE.
When pin OE is LOW, the contents of the 8 latches are available at the outputs. When
pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE
input does not affect the state of the latches.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from
40 C
to +85
C
and from
40 C
to +125
C
Balanced propagation delays
All inputs have a Schmitt trigger action
Common 3-state output enable input
Inputs accept voltages higher than V
CC
Input levels:
For 74AHC573-Q100: CMOS input level
For 74AHCT573-Q100: TTL input level
ESD protection:
MIL-STD-883, method 3015 exceeds 2000V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0
)
Multiple package options
NXP Semiconductors
74AHC573-Q100; 74AHCT573-Q100
Octal D-type transparant latch; 3-state
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74AHC573D-Q100
74AHCT573D-Q100
74AHC573PW-Q100
74AHCT573PW-Q100
74AHC573BQ-Q100
74AHCT573BQ-Q100
40 C
to +125
C
40 C
to +125
C
TSSOP20
40 C
to +125
C
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
Version
SOT163-1
Type number
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
DHVQFN20 plastic dual in-line compatible thermal enhanced
SOT764-1
very thin quad flat package no leads; 20 terminals;
body 2.5
4.5
0.85 mm
4. Functional diagram
2
3
4
5
6
7
8
9
D0
D1
D2
D3
D4
D5
D6
D7
LATCH
1 to 8
3-STATE
OUTPUTS
Q0 19
Q1 18
Q2 17
Q3 16
Q4 15
Q5 14
Q6 13
Q7 12
11 LE
1 OE
mna809
Fig 1.
Functional diagram
74AHC_AHCT573_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 June 2013
2 of 19
NXP Semiconductors
74AHC573-Q100; 74AHCT573-Q100
Octal D-type transparant latch; 3-state
11
1
1
2
3
4
5
6
7
8
9
OE
D0
D1
D2
D3
D4
D5
D6
D7
LE
11
mna807
C1
EN1
2
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
19
18
17
16
15
14
13
12
4
5
6
7
8
9
3
1D
19
18
17
16
15
14
13
12
mna808
Fig 2.
Logic symbol
Fig 3.
IEC logic symbol
D0
D1
D2
D3
D4
D5
D6
D7
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
LATCH
1
LE LE
LATCH
2
LE LE
LATCH
3
LE LE
LATCH
4
LE LE
LATCH
5
LE LE
LATCH
6
LE LE
LATCH
7
LE LE
LATCH
8
LE LE
LE
OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
mna810
Fig 4.
Logic diagram
74AHC_AHCT573_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 June 2013
3 of 19
NXP Semiconductors
74AHC573-Q100; 74AHCT573-Q100
Octal D-type transparant latch; 3-state
5. Pinning information
5.1 Pinning
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 5.
Pin configuration SO20 and TSSOP20
Fig 6.
Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Symbol
OE
D0 to D7
GND
LE
Q0 to Q7
V
CC
Pin description
Pin
1
2, 3, 4, 5, 6, 7, 8, 9
10
11
19, 18, 17, 16, 15, 14, 13, 12
20
Description
output enable input (active LOW)
data input
ground (0 V)
latch enable (active HIGH)
data output
supply voltage
74AHC_AHCT573_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 June 2013
4 of 19
NXP Semiconductors
74AHC573-Q100; 74AHCT573-Q100
Octal D-type transparant latch; 3-state
6. Functional description
Table 3.
Function table
[1]
Input
OE
Enable and read register (transparent
mode)
Latch and read register
Latch register and disable outputs
L
L
H
LE
H
L
L
Dn
L
H
l
h
l
h
[1]
H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition;
Z = high-impedance OFF-state.
Operating mode
Internal latch
L
H
L
H
L
H
Output
Qn
L
H
L
H
Z
Z
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
V
I
I
IK
I
OK
I
O
I
CC
I
GND
T
stg
P
tot
[1]
[2]
Parameter
supply voltage
input voltage
input clamping current
output clamping current
output current
supply current
ground current
storage temperature
total power dissipation
Conditions
Min
0.5
0.5
Max
+7.0
+7.0
-
+20
+25
+75
-
+150
500
Unit
V
V
mA
mA
mA
mA
mA
C
mW
V
I
<
0.5
V
V
O
<
0.5
V or V
O
> V
CC
+ 0.5 V
V
O
=
0.5
V to (V
CC
+ 0.5 V)
[1]
[1]
20
20
25
-
75
65
T
amb
=
40 C
to +125
C
[2]
-
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
For SO20 packages: above 70
C
the value of P
tot
derates linearly at 8 mW/K.
For TSSOP20 packages: above 60
C
the value of P
tot
derates linearly at 5.5 mW/K.
For DHVQFN20 packages: above 60
C
the value of P
tot
derates linearly with 4.5 mW/K.
74AHC_AHCT573_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 June 2013
5 of 19
Microchip MCU
