A17682-040,A17682-040 pdf中文资料,A17682-040引脚图,A17682-040电路-Datasheet-电子工程世界

文档预览

Tflex UT20000 Series

Ultra-Thin Thermal Gap Filler

Product Description

Tflex™ UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed

for thin interfaces that offers excellent thermal performance and high compliancy. It is designed

without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy

material handling and durability during assembly.

Tflex™ UT20000 provides excellent interfacing and its ability to wet out mating surfaces allows for

efficient transfer of heat away from components. It is an ideal choice for low-pressure

applications and optimum solution in handheld devices with thin interface gap and limited space

requirements.

Tflex™ UT20000 is electrically non-conductive, stable from -50°C thru 200°C and offered in

thicknesses that range from 0.008” (200

µm)

up to 0.040” (1000

µm).

FEATURES AND BENEFITS

•

Thermal Conductivity of 3.0 W/mK

No fiberglass carrier to minimize thermal resistance, yet still easy to handle

Excellent surface wetting for low contact resistance

Unique formulation minimizes thermal resistance at low mounting forces

Environmentally friendly solution that meets regulatory requirements including RoHS

and REACH

SPECIFICATIONS

TYPICAL PROPERTIES

Construction & Composition

Color

Thickness Range

Thermal Conductivity (W/mK)

Density (g/cc)

Hardness (Shore 00)

Outgassing TML (weight %)

Outgassing CVCM (weight %)

Temperature Range

Rth@ 200 µm, 10 psi, 50

Dielectric Constant @ 1MHz

UL Flammability Rating

Volume Resistivity

VALUE

Ceramic filled silicone sheet

Grey

200 µm (0.008”)- 1000 µm (0.040”)

3.0

3.2

83.3 (200-375) µm

56.4 (400-1000) µm

0.34%

0.09%

-50°C to 200°C

0.25°C–in2/W

5.87

V-0

2.2 x 10

^15

ohm-cm

TEST METHOD

N/A

Visual

N/A

Hot Disk

Helium Pyncometer

ASTM D2240

ASTM E595

Laird Test Method

ASTM D5470

ASTM D150

UL 94

ASTM D257

Americas: +1.866.928.8181

Europe: +49.(0).8031.2460.0

Asia: +86.755.2714.1166

www.lairdtech.com

Tflex UT20000 Series

Ultra-Thin Thermal Gap Filler

Tflex UT20000 Thermal Resistance vs Pressure

0.600 C-in2/W

0.500 C-in2/W

0.400 C-in2/W

0.300 C-in2/W

0.200 C-in2/W

0.100 C-in2/W

0.000 C-in2/W

10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi

8mils

10mils

16mils

20mils

30mils

40mils

AVAILABILITY

STANDARD THICKNESSES

•

0.008” (200 µm) up to 0.040” (1000 µm) thick material available in 25 µm increments

•

Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts. Custom die cut parts on a roll available for 200 µm

(0.008”) thru 375 µm (0.015”)

PART NUMBER SYSTEM

Tflex™ indicates Laird elastomeric thermal gap filler product line. UT20000 indicates Tflex UT20000 product line with thickness in microns

T f l e x UT2

Product code

0500

Pad thickness

µm

0250 => 250µm

0325 => 325µm

0500 => 500µm

1000 => 1000µm

EXAMPLES:

•

Tflex™ UT20200= 200 µm (0.008”) thick Tflex™ UT20000 material

•

Tflex™ UT20500= 500 µm (0.020”) thick Tflex™ UT20000 material

A17759-00 Tflex UT20000 DS 082417

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end

user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or

consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies,

Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third

parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.