DRAM Controller, 2M X 8, MOS, CPGA68, CERAMIC, PGA-68
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商官网:https://www.rocelec.com/
下载文档型号 | A8207-8 | A8207-16 | R8207-10 | R8207-16 | R8207-8 |
---|---|---|---|---|---|
描述 | DRAM Controller, 2M X 8, MOS, CPGA68, CERAMIC, PGA-68 | DRAM Controller, 2M X 8, MOS, CPGA68, CERAMIC, PGA-68 | DRAM Controller, 2M X 8, MOS, CQCC68, CERAMIC, LCC-68 | DRAM Controller, 2M X 8, MOS, CQCC68, CERAMIC, LCC-68 | DRAM Controller, 2M X 8, MOS, CQCC68, CERAMIC, LCC-68 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | PGA | PGA | LCC | LCC | LCC |
包装说明 | PGA, | PGA, | QCCN, | QCCN, | QCCN, |
针数 | 68 | 68 | 68 | 68 | 68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
其他特性 | SINGLE AND DUAL PORT CONFIGURATION; TRANSPARENT MEMORY SCRUBBING IN ECC MODE | SINGLE AND DUAL PORT CONFIGURATION; TRANSPARENT MEMORY SCRUBBING IN ECC MODE | SINGLE AND DUAL PORT CONFIGURATION; TRANSPARENT MEMORY SCRUBBING IN ECC MODE | SINGLE AND DUAL PORT CONFIGURATION; TRANSPARENT MEMORY SCRUBBING IN ECC MODE | SINGLE AND DUAL PORT CONFIGURATION; TRANSPARENT MEMORY SCRUBBING IN ECC MODE |
地址总线宽度 | 18 | 18 | 18 | 18 | 18 |
边界扫描 | NO | NO | NO | NO | NO |
总线兼容性 | 8086; 8088; 80186; 80188 | 80286 | 8086; 8088; 80186; 80188 | 80286 | 8086; 8088; 80186; 80188 |
JESD-30 代码 | S-CPGA-P68 | S-CPGA-P68 | R-CQCC-N68 | R-CQCC-N68 | R-CQCC-N68 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
低功率模式 | NO | NO | NO | NO | NO |
内存组织 | 2M X 8 | 2M X 8 | 2M X 8 | 2M X 8 | 2M X 8 |
区块数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 68 | 68 | 68 | 68 | 68 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA | PGA | QCCN | QCCN | QCCN |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V |
最小供电电压 | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | YES |
技术 | MOS | MOS | MOS | MOS | MOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | PIN/PEG | PIN/PEG | NO LEAD | NO LEAD | NO LEAD |
端子位置 | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/外围集成电路类型 | MEMORY CONTROLLER, DRAM | MEMORY CONTROLLER, DRAM | MEMORY CONTROLLER, DRAM | MEMORY CONTROLLER, DRAM | MEMORY CONTROLLER, DRAM |