IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA100, PGA-100, DSP Peripheral
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:ADI(亚德诺半导体)
下载文档型号 | ADSP-1101TG+ | ADSP-1101SG/+ | ADSP-1101TG/+ | ADSP-1101SG+ |
---|---|---|---|---|
描述 | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA100, PGA-100, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA100, CERAMIC, PGA-100, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA100, CERAMIC, PGA-100, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA100, PGA-100, DSP Peripheral |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | PGA | PGA | PGA | PGA |
包装说明 | PGA-100 | CERAMIC, PGA-100 | CERAMIC, PGA-100 | PGA-100 |
针数 | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | unknown | unknown | compliant |
边界扫描 | NO | NO | NO | NO |
最大时钟频率 | 14.29 MHz | 9.52 MHz | 10.53 MHz | 14.29 MHz |
外部数据总线宽度 | 16 | 16 | 16 | 16 |
JESD-30 代码 | S-CPGA-P100 | S-CPGA-P100 | S-CPGA-P100 | S-CPGA-P100 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 33.525 mm | 33.525 mm | 33.525 mm | 33.525 mm |
低功率模式 | NO | NO | NO | NO |
端子数量 | 100 | 100 | 100 | 100 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出数据总线宽度 | 20 | 20 | 20 | 20 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA | PGA | PGA | PGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.29 mm | 4.29 mm | 4.29 mm | 4.29 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 33.525 mm | 33.525 mm | 33.525 mm | 33.525 mm |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |