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AM29705AFMB

Multi-Port SRAM, 16X4, 30ns, CMOS, PDFP28, FLAT PACK-28

器件类别:存储    存储   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
厂商名称
Rochester Electronics
包装说明
DFP,
Reach Compliance Code
unknown
最长访问时间
30 ns
JESD-30 代码
R-PDFP-F28
JESD-609代码
e0
内存密度
64 bit
内存集成电路类型
MULTI-PORT SRAM
内存宽度
4
功能数量
1
端子数量
28
字数
16 words
字数代码
16
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
16X4
封装主体材料
PLASTIC/EPOXY
封装代码
DFP
封装形状
RECTANGULAR
封装形式
FLATPACK
并行/串行
PARALLEL
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
TIN LEAD
端子形式
FLAT
端子位置
DUAL
文档预览
REI Datasheet
AM29705A, AM29707
16-Word by 4-Bit 2-Port RAM
The AM29705A is a 16-word by 4-bit, two-power RAM. This RAM features two separate output ports
such that any two 4-bit words can be read from these outputs simultaneously. Each output port has
a four-bit Latch but a common Latch Enable (LE) input is used to control all eight latches. The device
has two Write Enable (WE) inputs and is designed such that the Write Enable 1 (WE
1
) and Latch
Enable (LE) inputs can be wired together to make the operation of the RAM appear edge triggered.
The device has a fully decoded four-bit A-address field to address any of the 16 memory words for
the A-output port. Likewise, a four-bit B-address input is used to simultaneously select any of the 16
words for presentation at the B-output port. New incoming data is written into the four-bit RAM word
selected by the B-address. The D inputs are used to load new data into the device.
Rochester Electronics
Manufactured Components
Rochester branded components are
manufactured using either die/wafers
purchased from the original suppliers
or Rochester wafers recreated from the
original IP. All recreations are done with
the approval of the OCM.
Parts are tested using original factory
test programs or Rochester developed
test solutions to guarantee product
meets or exceeds the OCM data sheet.
Quality Overview
ISO-9001
• AS9120 certification
• Qualified Manufacturers List (QML) MIL-PRF-38535
Class Q Military
Class V Space Level
• Qualified Suppliers List of Distributors (QSLD)
Rochester is a critical supplier to DLA and
meets all industry and DLA standards.
Rochester Electronics, LLC is committed to supplying
products that satisfy customer expectations for
quality and are equal to those originally supplied by
industry manufacturers.
The original manufacturer’s datasheet accompanying this document reflects the performance
and specifications of the Rochester manufactured version of this device. Rochester Electronics
guarantees the performance of its semiconductor products to the original OEM specifications.
‘Typical’ values are for reference purposes only. Certain minimum or maximum ratings may be
based on product characterization, design, simulation, or sample testing.
© 2013 Rochester Electronics, LLC. All Rights Reserved 10012013
To learn more, please visit
www.rocelec.com
查看更多>
参数对比
与AM29705AFMB相近的元器件有:AM29705AFM、AM29705ADC、AM29705APC、AM29705ADMB、AM29705ALMB。描述及对比如下:
型号 AM29705AFMB AM29705AFM AM29705ADC AM29705APC AM29705ADMB AM29705ALMB
描述 Multi-Port SRAM, 16X4, 30ns, CMOS, PDFP28, FLAT PACK-28 Multi-Port SRAM, 16X4, 30ns, TTL, CDFP28, FP-28 Multi-Port SRAM, 16X4, 25ns, TTL, CDIP28, CERAMIC, SLIMDIP-28 Multi-Port SRAM, 16X4, 25ns, TTL, PDIP28, DIP-28 Multi-Port SRAM, 16X4, 30ns, CMOS, CDIP28, CERAMIC, SLIMDIP-28 Multi-Port SRAM, 16X4, 30ns, CMOS, CHIP-28
包装说明 DFP, DFP, DIP, DIP, DIP, DIE,
Reach Compliance Code unknown unknown unknown unknown unknown unknow
最长访问时间 30 ns 30 ns 25 ns 25 ns 30 ns 30 ns
JESD-30 代码 R-PDFP-F28 S-CDFP-F28 R-CDIP-T28 R-PDIP-T28 R-CDIP-T28 S-XUUC-N28
内存密度 64 bit 64 bit 64 bit 64 bit 64 bit 64 bi
内存集成电路类型 MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM
内存宽度 4 4 4 4 4 4
功能数量 1 1 1 1 1 1
端子数量 28 28 28 28 28 28
字数 16 words 16 words 16 words 16 words 16 words 16 words
字数代码 16 16 16 16 16 16
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 70 °C 70 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C - - -55 °C -55 °C
组织 16X4 16X4 16X4 16X4 16X4 16X4
封装主体材料 PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
封装代码 DFP DFP DIP DIP DIP DIE
封装形状 RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 FLATPACK FLATPACK IN-LINE IN-LINE IN-LINE UNCASED CHIP
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
最大供电电压 (Vsup) 5.5 V 5.5 V 5.25 V 5.25 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.75 V 4.75 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES NO NO NO YES
技术 CMOS TTL TTL TTL CMOS CMOS
温度等级 MILITARY MILITARY COMMERCIAL COMMERCIAL MILITARY MILITARY
端子形式 FLAT FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD
端子位置 DUAL DUAL DUAL DUAL DUAL UPPER
厂商名称 Rochester Electronics - Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
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