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AM29PDL127H68VKI

IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC

器件类别:存储    存储   

厂商名称:Cypress(赛普拉斯)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Cypress(赛普拉斯)
Reach Compliance Code
compliant
最长访问时间
65 ns
启动块
BOTTOM/TOP
命令用户界面
YES
通用闪存接口
YES
数据轮询
YES
JESD-30 代码
R-PBGA-B80
内存密度
134217728 bit
内存集成电路类型
FLASH
部门数/规模
16,254
端子数量
80
字数
8388608 words
字数代码
8000000
最高工作温度
85 °C
最低工作温度
-40 °C
组织
8MX16
封装主体材料
PLASTIC/EPOXY
封装代码
FBGA
封装等效代码
BGA80,8X12,32
封装形状
RECTANGULAR
封装形式
GRID ARRAY, FINE PITCH
页面大小
8 words
并行/串行
PARALLEL
电源
1.8,3/3.3 V
认证状态
Not Qualified
就绪/忙碌
YES
部门规模
4K,32K
最大待机电流
0.000005 A
最大压摆率
0.055 mA
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
切换位
YES
类型
NOR TYPE
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Am29PDL127H
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not recommended for designs. For new and current designs,
S29PL127J supersedes Am29PDL127H and is the factory-recommended migration path. Please refer
to the S29PL127J datasheet for specifications and ordering information. Availability of this document
is retained for reference and historical purposes only.
June 2005
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro-
priate, and changes will be noted in a revision summary.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number
26864
Revision
A
Amendment
+6
Issue Date
June 07, 2005
THIS PAGE LEFT INTENTIONALLY BLANK.
PRELIMINARY
Am29PDL127H
128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Page Mode Simultaneous Read/Write
Flash Memory with Enhanced VersatileIO
TM
Control
This product has been retired and is not recommended for designs. For new and current designs, S29PL127J supersedes Am29PDL127H and is the factory-recommended migration path.
Please refer to the S29PL127J datasheet for specifications and ordering information. Availability of this document is retained for reference and historical purposes only.
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
128 Mbit Page Mode device
— Page size of 8 words: Fast page read access from random
locations within the page
— 18 mA program/erase current
— 1 µA typical standby mode current
SOFTWARE FEATURES
Software command-set compatible with JEDEC 42.4
standard
— Backward compatible with Am29F and Am29LV families
Single power supply operation
— Full Voltage range: 2.7 to 3.6 volt read, erase, and program
operations for battery-powered applications
Simultaneous Read/Write Operation
— Data can be continuously read from one bank while
executing erase/program functions in another bank
— Zero latency switching from write to read operations
CFI (Common Flash Interface) complaint
— Provides device-specific information to the system, allowing
host software to easily reconfigure for different Flash devices
Erase Suspend / Erase Resume
— Suspends an erase operation to allow read or program
operations in other sectors of same bank
FlexBank Architecture
— 4 separate banks, with up to two simultaneous operations
per device
— Bank A: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank B: 48 Mbit (32 Kw x 96)
— Bank C: 48 Mbit (32 Kw x 96)
— Bank D: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
Unlock Bypass Program command
— Reduces overall programming time when issuing multiple
program command sequences
HARDWARE FEATURES
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting program or erase
cycle completion
Enhanced VersatileI/O
TM
(V
IO
) Control
— Output voltage generated and input voltages tolerated on all
control inputs and I/Os is determined by the voltage on the
V
IO
pin
— V
IO
options at 1.8 V and 3 V I/O
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading array data
SecSi
TM
(Secured Silicon) Sector region
— Up to 128 words accessible through a command sequence
— Up to 64 factory-locked words
— Up to 64 customer-lockable words
WP#/ ACC (Write Protect/Acceleration) input
— At V
IL
, hardware level protection for the first and last two 4K
word sectors.
— At V
IH
, allows removal of sector protection
— At V
HH
, provides accelerated programming in a factory
setting
Both top and bottom boot blocks in one device
Manufactured on 0.13 µm process technology
20-year data retention at 125°C
Minimum 1 million erase cycle guarantee per sector
Persistent Sector Protection
— A command sector protection method to lock combinations
of individual sectors and sector groups to prevent program or
erase operations within that sector
— Sectors can be locked and unlocked in-system at V
CC
level
PERFORMANCE CHARACTERISTICS
High Performance
— Page access times as fast as 20 ns
— Random access times as fast as 55 ns
Password Sector Protection
— A sophisticated sector protection method to lock
combinations of individual sectors and sector groups to
prevent program or erase operations within that sector using
a user-defined 64-bit password
Power consumption (typical values at 10 MHz)
— 45 mA active read current
Package options
— 80-ball Fine-pitch BGA
— Multi Chip Packages (MCP)
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication#
26864
Rev:
A
Amendment/+6
Issue Date:
June 07, 2005
P R E L I M I N A R Y
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
128 Mbit Page Mode device
— Page size of 8 words: Fast page read access from random
locations within the page
— 18 mA program/erase current
— 1 µA typical standby mode current
SOFTWARE FEATURES
Software command-set compatible with JEDEC 42.4
standard
— Backward compatible with Am29F and Am29LV families
Single power supply operation
— Full Voltage range: 2.7 to 3.6 volt read, erase, and program
operations for battery-powered applications
Simultaneous Read/Write Operation
— Data can be continuously read from one bank while
executing erase/program functions in another bank
— Zero latency switching from write to read operations
CFI (Common Flash Interface) complaint
— Provides device-specific information to the system, allowing
host software to easily reconfigure for different Flash devices
Erase Suspend / Erase Resume
— Suspends an erase operation to allow read or program
operations in other sectors of same bank
FlexBank Architecture
— 4 separate banks, with up to two simultaneous operations
per device
— Bank A: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
— Bank B: 48 Mbit (32 Kw x 96)
— Bank C: 48 Mbit (32 Kw x 96)
— Bank D: 16 Mbit (4 Kw x 8 and 32 Kw x 31)
Unlock Bypass Program command
— Reduces overall programming time when issuing multiple
program command sequences
HARDWARE FEATURES
Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting program or erase
cycle completion
Enhanced VersatileI/O
TM
(V
IO
) Control
— Output voltage generated and input voltages tolerated on all
control inputs and I/Os is determined by the voltage on the
V
IO
pin
— V
IO
options at 1.8 V and 3 V I/O
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading array data
SecSi
TM
(Secured Silicon) Sector region
— Up to 128 words accessible through a command sequence
— Up to 64 factory-locked words
— Up to 64 customer-lockable words
WP#/ ACC (Write Protect/Acceleration) input
— At V
IL
, hardware level protection for the first and last two 4K
word sectors.
— At V
IH
, allows removal of sector protection
— At V
HH
, provides accelerated programming in a factory
setting
Both top and bottom boot blocks in one device
Manufactured on 0.13 µm process technology
20-year data retention at 125°C
Minimum 1 million erase cycle guarantee per sector
Persistent Sector Protection
— A command sector protection method to lock combinations
of individual sectors and sector groups to prevent program or
erase operations within that sector
— Sectors can be locked and unlocked in-system at V
CC
level
PERFORMANCE CHARACTERISTICS
High Performance
— Page access times as fast as 20 ns
— Random access times as fast as 55 ns
Password Sector Protection
— A sophisticated sector protection method to lock
combinations of individual sectors and sector groups to
prevent program or erase operations within that sector using
a user-defined 64-bit password
Power consumption (typical values at 10 MHz)
— 45 mA active read current
Package options
— 80-ball Fine-pitch BGA
— Multi Chip Packages (MCP)
2
Am29PDL127H
June 07, 2005
P R E L I M I N A R Y
GENERAL DESCRIPTION
The Am29PDL127H is a 128 Mbit, 3.0 volt-only Page Mode
and Simultaneous Read/Write Flash memory device orga-
nized as 8 Mwords. The device is offered in an 80-ball
Fine-pitch BGA package, and various multi-chip packages.
The word-wide data (x16) appears on DQ15-DQ0. This de-
vice can be programmed in-system or in standard EPROM
programmers. A 12.0 V V
PP
is not required for write or erase
operations.
The device offers fast page access times of 20 to 30 ns, with
corresponding random access times of 55 to 70 ns, respec-
tively, allowing high speed microprocessors to operate with-
out wait states. To eliminate bus contention the device has
separate chip enable (CE#), write enable (WE#) and output
enable (OE#) controls. Simultaneous Read/Write Operation
with Zero Latency
The Simultaneous Read/Write architecture provides
simul-
taneous operation
by dividing the memory space into 4
banks, which can be considered to be four separate memory
arrays as far as certain operations are concerned. The de-
vice can improve overall system performance by allowing a
host system to program or erase in one bank, then immedi-
ately and simultaneously read from another bank with zero
latency (with two simultaneous operations operating at any
one time). This releases the system from waiting for the
completion of a program or erase operation, greatly improv-
ing system performance.
The device can be organized in both top and bottom sector
configurations. The banks are organized as follows:
Bank
A
B
C
D
Sectors
16 Mbit (4 Kw x 8 and 32 Kw x 31)
48 Mbit (32 Kw x 96)
48 Mbit (32 Kw x 96)
16 Mbit (4 Kw x 8 and 32 Kw x 31)
mands are written to the command register using standard
microprocessor write timing. Register contents serve as in-
puts to an internal state-machine that controls the erase and
programming circuitry. Write cycles also internally latch ad-
dresses and data needed for the programming and erase
operations. Reading data out of the device is similar to read-
ing from other Flash or EPROM devices.
Device programming occurs by executing the program com-
mand sequence. The Unlock Bypass mode facilitates faster
programming times by requiring only two write cycles to pro-
gram data instead of four. Device erasure occurs by execut-
ing the erase command sequence.
The host system can detect whether a program or erase op-
eration is complete by reading the DQ7 (Data# Polling) and
DQ6 (toggle)
status bits.
After a program or erase cycle has
been completed, the device is ready to read array data or ac-
cept another command.
The sector erase architecture allows memory sectors to be
erased and reprogrammed without affecting the data con-
tents of other sectors. The device is fully erased when
shipped from the factory.
Hardware data protection
measures include a low V
CC
de-
tector that automatically inhibits write operations during
power transitions. The hardware sector protection feature
disables both program and erase operations in any combina-
tion of sectors of memory. This can be achieved in-system or
via programming equipment.
The Erase Suspend/Erase Resume
feature enables the
user to put erase on hold for any period of time to read data
from, or program data to, any sector that is not selected for
erasure. True background erase can thus be achieved. If a
read is needed from the SecSi Sector area (One Time Pro-
gram area) after an erase suspend, then the user must use
the proper command sequence to enter and exit this region.
The device offers two power-saving features. When ad-
dresses have been stable for a specified amount of time, the
device enters the
automatic sleep mode.
The system can
also place the device into the standby mode. Power con-
sumption is greatly reduced in both these modes.
AMD’s Flash technology combined years of Flash memory
manufacturing experience to produce the highest levels of
quality, reliability and cost effectiveness. The device electri-
cally erases all bits within a sector simultaneously via
Fowler-Nordheim tunneling. The data is programmed using
hot electron injection.
Page Mode Features
The page size is 8 words. After initial page access is accom-
plished, the page mode operation provides fast read access
speed of random locations within that page.
Standard Flash Memory Features
The device requires a
single 3.0 volt power supply
(2.7 V
to 3.6 V or 2.7 V to 3.3 V) for both read and write functions.
Internally generated and regulated voltages are provided for
the program and erase operations.
The device is entirely command set compatible with the
JEDEC 42.4 single-power-supply Flash standard.
Com-
June 07, 2005
Am29PDL127H
3
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参数对比
与AM29PDL127H68VKI相近的元器件有:AM29PDL127H53VKIN、AM29PDL127H88VKIN。描述及对比如下:
型号 AM29PDL127H68VKI AM29PDL127H53VKIN AM29PDL127H88VKIN
描述 IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC IC,EEPROM,NOR FLASH,8MX16,CMOS,BGA,80PIN,PLASTIC
是否Rohs认证 不符合 不符合 不符合
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
Reach Compliance Code compliant compliant compliant
最长访问时间 65 ns 55 ns 85 ns
启动块 BOTTOM/TOP BOTTOM/TOP BOTTOM/TOP
命令用户界面 YES YES YES
通用闪存接口 YES YES YES
数据轮询 YES YES YES
JESD-30 代码 R-PBGA-B80 R-PBGA-B80 R-PBGA-B80
内存密度 134217728 bit 134217728 bit 134217728 bit
内存集成电路类型 FLASH FLASH FLASH
部门数/规模 16,254 16,254 16,254
端子数量 80 80 80
字数 8388608 words 8388608 words 8388608 words
字数代码 8000000 8000000 8000000
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
组织 8MX16 8MX16 8MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FBGA FBGA FBGA
封装等效代码 BGA80,8X12,32 BGA80,8X12,32 BGA80,8X12,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
页面大小 8 words 8 words 8 words
并行/串行 PARALLEL PARALLEL PARALLEL
电源 1.8,3/3.3 V 3/3.3 V 1.8,3/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES
部门规模 4K,32K 4K,32K 4K,32K
最大待机电流 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.055 mA 0.055 mA 0.055 mA
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM
切换位 YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE
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