4.1 x 1.0mm SMD CHIP LED LAMP
APKA4110PWC
WHITE
Features
!
4.1mm x 1.0mm SMT LED, 1.52mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR
!
VARIOUS
Description
The source color devices are made with InGaN
on SiC Light Emitting Diode.
COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE: 2000PCS/REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
±0.25(±0.01")
unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD1201
APPROVED: J.Lu
REV NO: V.1
CHECKED: Allen Liu
D
i
g
i
t
a
l
l
y
s
i
g
n
e
d
b
y
Y
A
N
G
S
H
O
U
F
E
N
c
n
=
Y
A
N
G
S
H
O
U
F
E
N
,
o
u
=
4
2
,
o
=
K
I
N
G
B
R
I
G
H
T
,
c
=
U
S
D
a
t
e
:
2
0
0
3
.
0
3
.
2
5
1
9
:
3
8
:
4
8
+
0
8
'0
0
'R
e
a
s
o
n
:
D
o
c
u
m
e
n
t
i
s
c
e
r
t
i
f
i
e
d
DATE: MAR/25/2003
DRAWN: K.ZHANG
PAGE: 1 OF 4
Selection Guide
Par t No .
Dic e
L en s Ty p e
Iv (m c d )
@ 20 m A
Min .
APKA4110PWC
WHITE(InGaN )
WATER CLEAR
50
Ty p .
150
V i ew i n g
An g l e
2θ1/2
90 °
Note:
1.
θ1/2
is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
)
=25°C
°
Sy m b o l
V
F
I
R
X
Chromaticity Coordinates
Y
c
capacitance
White
White
0.34
65
pF
V
F
= 0 V, f = 1 M Hz
Par am et er
Forward Voltage
Reverse Current
White
White
0.33
D ev i c e
Ty p .
3.65
Max .
4.2
10
Un it s
V
uA
Tes t Co n d it io n s
I
F
= 2 0 m A
V
R
= 5V
Absolute Maximum Ratings at T
)
=25°C
°
Par am et er
Power dissipation
DC Forward Current
Peak Forward Current [1]
Reverse Voltage
Operating Temperature
Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Wh it e
10 2
30
160
5
-40
°
C To + 85
°C
-40
°
C To + 85
°C
Un it s
mW
mA
mA
V
SPEC NO: DSAD1201
APPROVED: J.Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: MAR/25/2003
DRAWN: K.ZHANG
PAGE: 2 OF 4
White
APKA4110PWC
SPEC NO: DSAD1201
APPROVED: J.Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: MAR/25/2003
DRAWN: K.ZHANG
PAGE: 3 OF 4
APKA4110PWC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD1201
APPROVED: J.Lu
REV NO: V.1
CHECKED: Allen Liu
DATE: MAR/25/2003
DRAWN: K.ZHANG
PAGE: 4 OF 4