首页 > 器件类别 > 分立半导体 > 晶体管

APT1201R4BFLL

Power Field-Effect Transistor, 9A I(D), 1200V, 1.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247AB, TO-247, 3 PIN

器件类别:分立半导体    晶体管   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

下载文档
器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Microsemi
零件包装代码
TO-247AD
包装说明
TO-247, 3 PIN
针数
3
Reach Compliance Code
unknown
雪崩能效等级(Eas)
1210 mJ
外壳连接
DRAIN
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
1200 V
最大漏极电流 (Abs) (ID)
9 A
最大漏极电流 (ID)
9 A
最大漏源导通电阻
1.4 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码
TO-247AB
JESD-30 代码
R-PSFM-T3
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
300 W
最大脉冲漏极电流 (IDM)
36 A
认证状态
Not Qualified
表面贴装
NO
端子形式
THROUGH-HOLE
端子位置
SINGLE
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
SWITCHING
晶体管元件材料
SILICON
文档预览
APT1201R4BFLL
APT1201R4SFLL
1200V
9A 1.400
POWER MOS 7
®
R
FREDFET
D
3
PAK
TO-247
Power MOS 7 is a new generation of low loss, high voltage, N-Channel
enhancement mode power MOSFETS. Both conduction and switching
®
losses are addressed with Power MOS 7 by significantly lowering R
DS(ON)
®
and Q
g
. Power MOS 7 combines lower conduction and switching losses
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
• Lower Input Capacitance
• Lower Miller Capacitance
• Lower Gate Charge, Qg
MAXIMUM RATINGS
Symbol
V
DSS
I
D
I
DM
V
GS
V
GSM
P
D
T
J
,T
STG
T
L
I
AR
E
AR
E
AS
Parameter
Drain-Source Voltage
Continuous Drain Current @ T
C
= 25°C
Pulsed Drain Current
1
• Increased Power Dissipation
• Easier To Drive
• TO-247 or Surface Mount D
3
PAK Package
D
G
S
All Ratings: T
C
= 25°C unless otherwise specified.
APT1201R4BFLL_SFLL
UNIT
Volts
Amps
1200
9
36
±30
±40
300
2.40
-55 to 150
300
9
30
4
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
Total Power Dissipation @ T
C
= 25°C
Linear Derating Factor
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
Avalanche Current
1
Volts
Watts
W/°C
°C
Amps
mJ
(Repetitive and Non-Repetitive)
1
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
1210
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
DSS
R
DS(on)
I
DSS
I
GSS
V
GS(th)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
GS
= 0V, I
D
= 250µA)
Drain-Source On-State Resistance
2
MIN
TYP
MAX
UNIT
Volts
1200
1.40
250
1000
±100
3
5
(V
GS
= 10V, I
D
= 4.5A)
Ohms
µA
nA
Volts
3-2004
050-7392 Rev A
Zero Gate Voltage Drain Current (V
DS
= 1200V, V
GS
= 0V)
Zero Gate Voltage Drain Current (V
DS
= 960V, V
GS
= 0V, T
C
= 125°C)
Gate-Source Leakage Current (V
GS
= ±30V, V
DS
= 0V)
Gate Threshold Voltage (V
DS
= V
GS
, I
D
= 1mA)
CAUTION:
These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
DYNAMIC CHARACTERISTICS
Symbol
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
3
APT1201R4BFLL_SFLL
Test Conditions
V
GS
= 0V
V
DS
= 25V
f = 1 MHz
V
GS
= 10V
V
DD
= 600V
I
D
= 9A @ 25°C
V
GS
= 15V
V
DD
= 600V
I
D
= 9A @ 25°C
R
G
= 1.6Ω
MIN
TYP
MAX
UNIT
2030
309
60
76
10
51
8
5
27
11
2500
472
90
120
12
80
16
10
41
25
ns
nC
pF
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
I
S
I
SM
V
SD
dv
/
dt
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
Pulsed Source Current
Diode Forward Voltage
Peak Diode Recovery
1
2
dt
MIN
TYP
MAX
UNIT
Amps
Volts
V/ns
ns
µC
Amps
9
36
1.3
18
T
j
= 25°C
T
j
= 125°C
T
j
= 25°C
T
j
= 125°C
T
j
= 25°C
T
j
= 125°C
(Body Diode)
(V
GS
= 0V, I
S
= -I
D
9A)
5
dv
/
t
rr
Q
rr
I
RRM
Reverse Recovery Time
(I
S
= -I
D
9A,
di
/
dt
= 100A/µs)
Reverse Recovery Charge
(I
S
= -I
D
9A,
di
/
dt
= 100A/µs)
Peak Recovery Current
(I
S
= -I
D
9A,
di
/
dt
= 100A/µs)
210
710
.07
2.0
10
15
THERMAL CHARACTERISTICS
Symbol
R
θJC
R
θJA
Characteristic
Junction to Case
Junction to Ambient
MIN
TYP
MAX
UNIT
°C/W
0.42
40
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
4 Starting T
j
= +25°C, L = 29.9mH, R
G
= 25Ω, Peak I
L
= 9A
5
dv
/
dt
numbers reflect the limitations of the test circuit rather than the
device itself.
IS
-
ID
9A
di
/
dt
700A/µs
VR
1200
TJ
150
°
C
APT Reserves the right to change, without notice, the specifications and information contained herein.
0.45
Z
JC
, THERMAL IMPEDANCE (°C/W)
θ
D=0.5
0.1
0.05
0.2
0.1
0.05
0.01
0.005
0.02
0.01
SINGLE PULSE
Note:
PDM
t1
t2
t
Duty Factor D = 1/t2
Peak TJ = PDM x Z
θJC
+ TC
050-7392 Rev A
3-2004
0.001
10
-5
10
-3
10
-2
10
-1
1.0
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
10
-4
10
Typical Performance Curves
I
D
, DRAIN CURRENT (AMPERES)
20
18
16
14
12
10
08
06
04
02
0
APT1201R4BFLL_SFLL
VGS =15,10 & 8V
7V
Graph Deleted
6.5V
6V
5.5V
5V
FIGURE 2, HIGH VOLTAGE OUTPUT CHARACTERISTICS
R
DS
(ON), DRAIN-TO-SOURCE ON RESISTANCE
0
5
10
15
20
25
30
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS
1.40
V
GS
25
I
D
, DRAIN CURRENT (AMPERES)
VDS> ID (ON) x RDS (ON)MAX.
250µSEC. PULSE TEST
@ <0.5 % DUTY CYCLE
NORMALIZED TO
= 10V @ 0.5 I [Cont.]
D
50
1.30
1.20
1.10
1.00
0.90
0.80
VGS=10V
40
30
TJ = +125°C
TJ = +25°C
0
VGS=20V
20
TJ = -55°C
0
2
4
6
8
10
V
GS
, GATE-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 4, TRANSFER CHARACTERISTICS
0
9
8
I
D
, DRAIN CURRENT (AMPERES)
BV
DSS
, DRAIN-TO-SOURCE BREAKDOWN
VOLTAGE (NORMALIZED)
4 6 8 10 12 14 16 18 20
I
D
, DRAIN CURRENT (AMPERES)
FIGURE 5, R
DS
(ON) vs DRAIN CURRENT
2
1.15
1.10
1.05
1.00
0.95
0.90
0.85
-50
7
6
5
4
3
2
1
0
25
50
75
100
125
150
T
C
, CASE TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE
R
DS
(ON), DRAIN-TO-SOURCE ON RESISTANCE
(NORMALIZED)
-25
0
25
50 75 100 125 150
T
J
, JUNCTION TEMPERATURE (°C)
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
1.2
2.5
I
D
= 0.5 I
V
GS
D
[Cont.]
= 10V
2.0
V
GS
(TH), THRESHOLD VOLTAGE
(NORMALIZED)
1.1
1.0
0.9
0.8
0.7
0.6
1.5
1.0
0.5
0.0
-50 -25
0
25 50
75 100 125 150
T
J
, JUNCTION TEMPERATURE (°C)
FIGURE 8, ON-RESISTANCE vs. TEMPERATURE
0
25
50
75 100 125 150
T
C
, CASE TEMPERATURE (°C)
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
-50 -25
050-7392 Rev A
3-2004
36
OPERATION HERE
LIMITED BY RDS (ON)
10,000
5,000
100µS
C, CAPACITANCE (pF)
APT1201R4BFLL_SFLL
I
D
, DRAIN CURRENT (AMPERES)
Ciss
1,000
10
Coss
5
1mS
100
Crss
V
GS
, GATE-TO-SOURCE VOLTAGE (VOLTS)
I = I [Cont.]
D
D
I
DR
, REVERSE DRAIN CURRENT (AMPERES)
TC =+25°C
TJ =+150°C
SINGLE PULSE
1
1
10
100
1200
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 10, MAXIMUM SAFE OPERATING AREA
16
10mS
10
.01
.1
1
10
50
V
DS
, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 11, CAPACITANCE vs DRAIN-TO-SOURCE VOLTAGE
200
100
12
VDS=100V
VDS=250V
VDS=400V
8
TJ =+150°C
10
TJ =+25°C
4
0 10 20 30 40 50 60 70 80 90 100
Q
g
, TOTAL GATE CHARGE (nC)
FIGURE 12, GATE CHARGES vs GATE-TO-SOURCE VOLTAGE
0
0.3
0.5
0.7
0.9
1.1
1.3
1.5
V
SD
, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
FIGURE 13, SOURCE-DRAIN DIODE FORWARD VOLTAGE
1
TO-247 Package Outline
Drain
(Heat Sink)
4.69 (.185)
5.31 (.209)
1.49 (.059)
2.49 (.098)
6.15 (.242) BSC
D PAK Package Outline
4.98 (.196)
5.08 (.200)
1.47 (.058)
1.57 (.062)
15.95 (.628)
16.05 (.632)
13.41 (.528)
13.51 (.532)
3
15.49 (.610)
16.26 (.640)
5.38 (.212)
6.20 (.244)
1.04 (.041)
1.15 (.045)
Drain
20.80 (.819)
21.46 (.845)
3.50 (.138)
3.81 (.150)
Revised
4/18/95
13.79 (.543)
13.99 (.551)
Revised
8/29/97
11.51 (.453)
11.61 (.457)
0.46 (.018)
0.56 (.022) {3 Plcs}
4.50 (.177) Max.
2.87 (.113)
3.12 (.123)
1.65 (.065)
2.13 (.084)
1.01 (.040)
1.40 (.055)
3-2004
0.40 (.016)
0.79 (.031)
0.020 (.001)
0.178 (.007)
2.67 (.105)
2.84 (.112)
1.27 (.050)
1.40 (.055)
1.98 (.078)
2.08 (.082)
5.45 (.215) BSC
{2 Plcs.}
19.81 (.780)
20.32 (.800)
1.22 (.048)
1.32 (.052)
3.81 (.150)
4.06 (.160)
(Base of Lead)
050-7392 Rev A
Gate
Drain
Source
Heat Sink (Drain)
and Leads
are Plated
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
Source
Drain
Gate
Dimensions in Millimeters (Inches)
APT’s products are covered by one or more of U.S.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. US and Foreign patents pending. All Rights Reserved.
查看更多>
参数对比
与APT1201R4BFLL相近的元器件有:APT1201R4SFLL。描述及对比如下:
型号 APT1201R4BFLL APT1201R4SFLL
描述 Power Field-Effect Transistor, 9A I(D), 1200V, 1.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247AB, TO-247, 3 PIN Power Field-Effect Transistor, 9A I(D), 1200V, 1.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, D3PAK, 3 PIN
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
厂商名称 Microsemi Microsemi
包装说明 TO-247, 3 PIN D3PAK, 3 PIN
针数 3 3
Reach Compliance Code unknown unknown
雪崩能效等级(Eas) 1210 mJ 1210 mJ
外壳连接 DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 1200 V 1200 V
最大漏极电流 (Abs) (ID) 9 A 9 A
最大漏极电流 (ID) 9 A 9 A
最大漏源导通电阻 1.4 Ω 1.4 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 代码 R-PSFM-T3 R-PSSO-G2
元件数量 1 1
端子数量 3 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT SMALL OUTLINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
极性/信道类型 N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 300 W 300 W
最大脉冲漏极电流 (IDM) 36 A 36 A
认证状态 Not Qualified Not Qualified
表面贴装 NO YES
端子形式 THROUGH-HOLE GULL WING
端子位置 SINGLE SINGLE
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
晶体管应用 SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON
SA7527的性能;大家学习一下;
此芯片用在我之前的原理图上不知道是否有一些保护功能,高手帮忙指点下; 例如短路保护 断路保护 过温...
czf0408 LED专区
急求altium designer的TI高精运放的元件库
https://designcontent.live.altiu ... _and_Linear_...
lauren PCB设计
有谁读出了LaunchPad的 固件的?想写到EZ430—C2500中,让其升级,谢谢!
想写到EZ430—C2500中,让其升级,谢谢! 有谁读出了LaunchPad的 固件的?想写到E...
caoqing 微控制器 MCU
抢先曝光3:东芝慕尼黑电子展展牌——工业展区
根据东芝电子展微信直播群大家的投票,今天我们将曝光的东芝电子展的工业区展牌。 大家如对此展区的...
nmg 工控电子
CE6.0下的基于对话框的mfc应用程序出现如下编译错误,如何解决?请大虾指教。
CE6.0下的基于对话框的mfc应用程序出现如下编译错误,如何解决?请大虾指教。 我的SDK是用基于...
donglele2005 嵌入式系统
分享一本不过时的《电源管理基础Dummies®》
电源管理基础电子书为大家介绍有关电源管理的基础知识,以及最新发展趋势和应用。以下是本电子书中的一些...
okhxyyo 电源技术
热门器件
热门资源推荐
器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
需要登录后才可以下载。
登录取消