型号
- 型号
- 关键词
Standard SRAM, 256KX18, 10ns, CMOS, PQFP100, TQFP-100
厂商名称：Micross
厂商官网：https://www.micross.com
下载文档| 型号 | AS5SS256K18DQ-10/883C | AS5SS256K18DB-8/883C | AS5SS256K18DB-9/883C | AS5SS256K18DQ-8/883C | AS5SS256K18DQ-9/883C | AS5SS256K18DB-10/883C |
|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX18, 10ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 256KX18, 8ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | Standard SRAM, 256KX18, 8.5ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | Standard SRAM, 256KX18, 8ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 256KX18, 8.5ns, CMOS, PQFP100, TQFP-100 | Standard SRAM, 256KX18, 10ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 |
| 零件包装代码 | QFP | BGA | BGA | QFP | QFP | BGA |
| 包装说明 | LQFP, | BGA, | BGA, | LQFP, | LQFP, | BGA, |
| 针数 | 100 | 119 | 119 | 100 | 100 | 119 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 10 ns | 8 ns | 8.5 ns | 8 ns | 8.5 ns | 10 ns |
| 其他特性 | AUTOMATIC POWER DOWN | AUTOMATIC POWER DOWN | AUTOMATIC POWER DOWN | AUTOMATIC POWER DOWN | AUTOMATIC POWER DOWN | AUTOMATIC POWER DOWN |
| JESD-30 代码 | R-PQFP-G100 | R-PBGA-B119 | R-PBGA-B119 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 |
| 内存密度 | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 119 | 119 | 100 | 100 | 119 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 256KX18 | 256KX18 | 256KX18 | 256KX18 | 256KX18 | 256KX18 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | BGA | BGA | LQFP | LQFP | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | GRID ARRAY | GRID ARRAY | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD |
| 端子形式 | GULL WING | BALL | BALL | GULL WING | GULL WING | BALL |
| 端子位置 | QUAD | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM |
| 厂商名称 | Micross | - | - | Micross | Micross | Micross |
嵌入式系统
RF/无线
RF/无线
微控制器 MCU
FPGA/CPLD
实时操作系统RTOS
