型号
- 型号
- 关键词
ZBT SRAM, 1MX18, 8.5ns, CMOS, PBGA165, BGA-165
厂商名称：ALSC [Alliance Semiconductor Corporation]
下载文档| 型号 | AS7C331MNTF18A-85BC | AS7C331MNTF18A-85BIN | AS7C331MNTF18A-10BC | AS7C331MNTF18A-10BCN | AS7C331MNTF18A-10BI | AS7C331MNTF18A-10BIN | AS7C331MNTF18A-85BI | AS7C331MNTF18A-85BCN |
|---|---|---|---|---|---|---|---|---|
| 描述 | ZBT SRAM, 1MX18, 8.5ns, CMOS, PBGA165, BGA-165 | ZBT SRAM, 1MX18, 8.5ns, CMOS, PBGA165, LEAD FREE, BGA-165 | ZBT SRAM, 1MX18, 10ns, CMOS, PBGA165, BGA-165 | ZBT SRAM, 1MX18, 10ns, CMOS, PBGA165, LEAD FREE, BGA-165 | ZBT SRAM, 1MX18, 10ns, CMOS, PBGA165, BGA-165 | ZBT SRAM, 1MX18, 10ns, CMOS, PBGA165, LEAD FREE, BGA-165 | ZBT SRAM, 1MX18, 8.5ns, CMOS, PBGA165, BGA-165 | ZBT SRAM, 1MX18, 8.5ns, CMOS, PBGA165, LEAD FREE, BGA-165 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 |
| 针数 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 8.5 ns | 8.5 ns | 10 ns | 10 ns | 10 ns | 10 ns | 8.5 ns | 8.5 ns |
| 最大时钟频率 (fCLK) | 100 MHz | 100 MHz | 83 MHz | 83 MHz | 83 MHz | 83 MHz | 100 MHz | 100 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
| JESD-609代码 | e0 | e3/e6 | e0 | e3/e6 | e0 | e3/e6 | e0 | e3/e6 |
| 长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
| 内存密度 | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bit | 18874368 bi |
| 内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 | 1MX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TBGA | TBGA | TBGA | TBGA | TBGA | TBGA | TBGA | TBGA |
| 封装等效代码 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 |
| 电源 | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大待机电流 | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 0.25 mA | 0.25 mA | 0.23 mA | 0.23 mA | 0.23 mA | 0.23 mA | 0.25 mA | 0.25 mA |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | PURE MATTE TIN/TIN BISMUTH | Tin/Lead (Sn/Pb) | PURE MATTE TIN/TIN BISMUTH | Tin/Lead (Sn/Pb) | PURE MATTE TIN/TIN BISMUTH | Tin/Lead (Sn/Pb) | PURE MATTE TIN/TIN BISMUTH |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 |
| 宽度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |