型号
- 型号
- 关键词
EEPROM, 256KX8, Serial, CMOS, PDSO5, 2.90 X 1.60 MM, GREEN, PLASTIC, MO-193AB, SOT-23, 5 PIN
厂商名称：Atmel (Microchip)
下载文档| 型号 | AT24C02C-TSUM-T | AT24C02CU3-CUM-T | AT24C02CY6-MAHM-T |
|---|---|---|---|
| 描述 | EEPROM, 256KX8, Serial, CMOS, PDSO5, 2.90 X 1.60 MM, GREEN, PLASTIC, MO-193AB, SOT-23, 5 PIN | EEPROM, 256KX8, Serial, CMOS, PBGA8, 2 X 1.50 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | EEPROM, 256KX8, Serial, CMOS, PDSO8, 2.00 X 3.00 MM, 0.50 MM PITCH, GREEN, MO-229, UDFN-8 |
| 零件包装代码 | TSOT | BGA | SON |
| 包装说明 | TSSOP, | VFBGA, | HVSON, |
| 针数 | 5 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.1.B.1 | 3A991.B.1.B.1 | 3A991.B.1.B.1 |
| 其他特性 | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 |
| JESD-30 代码 | R-PDSO-G5 | R-PBGA-B8 | R-PDSO-N8 |
| JESD-609代码 | e3 | e3 | e4 |
| 长度 | 2.9 mm | 2 mm | 3 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 5 | 8 | 8 |
| 字数 | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | VFBGA | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 0.85 mm | 0.6 mm |
| 串行总线类型 | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | BALL | NO LEAD |
| 端子节距 | 0.95 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | BOTTOM | DUAL |
| 宽度 | 1.6 mm | 1.5 mm | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms |
| 厂商名称 | - | Atmel (Microchip) | Atmel (Microchip) |