AXK7L, 8L
NARROW-PITCH
CONNECTORS
FOR PC BOARD-TO-FPC
CONNECTION
NEW
NARROW PITCH
(0.4mm)
CONNECTORS F4
4. Easy to design product circuits
1) An insulating wall provided for the
bottom surface of the connector prevents
contact between the pattern on the PC
board and the metal pins, enabling
pattern wiring under the connector, and
thus contributing to the reduction in size of
PC boards.
[Socket]
[Header]
FEATURES
1. The lowest profile class among two-
piece connectors in the world (Mated
height: 0.9mm)
Achieved both a 0.4-mm pitch and an ultra
low profile of 0.9 mm high when mated,
contributing to further thickness reduction
of products.
2. Ultra low profile, but high contact
reliability
Our own bellows-type double contact
structure provides a high resistance to
twisting and shock, ensuring a high
contact reliability.
Socket
Header
Pattern wiring under the
connector is possible.
Double contact
1.5
Before mating
FPC
F4 connector
Reinforcing
plate (including
the FPC)
PCB
0.9
Example of connection between
a board and an FPC
3. Improved mating strength between
the socket and header
The simple locking structures provided for
the retention fittings and the contact
points improve the mating strength and
provide tactile feedback when locked.
Socket
Header
2) The usage shown below further
enhances the flexibility of connector
positioning.
[Example of application of connection
between a board and an FPC]
FPC
P4
F4
PCB
After mating
0.9mm
Locking structure of the retention fittings
5. Standard use of Ni barrier plating
The use of Ni barrier plating, which is
highly resistant against solder creeping,
on the socket terminals is standard.
PRODUCT TYPES
Mated height
No. of contacts
20
22
30
40
50
60
70
80
Part No.
Socket
AXK7L20227*
AXK7L22227*
AXK7L30227*
AXK7L40227*
AXK7L50227*
AXK7L60227*
AXK7L70227*
AXK7L80227*
Header
AXK8L20125*
AXK8L22125*
AXK8L30125*
AXK8L40125*
AXK8L50125*
AXK8L60125*
AXK8L70125*
AXK8L80125*
Inner carton (1-reel)
Packing
Outer carton
0.9 mm
Asterisk at the last digit
of the part No.:
J: 3,000 pieces
V: 3,000 pieces
Asterisk at the last digit
of the part No.:
J: 6,000 pieces (2 reels)
V: 15,000 pieces (5 reels)
Notes) 1. Regarding ordering units: During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please consult us.
Samples: Available. Please consult us.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production.
For this type of connector, 9th digit of the part no. changes from 2 to 1. e.g. 20 contacts for sockets: AXK7L20217*
3. Please consult us regarding a different number of contacts.
NARROW PITCH (0.4mm) CONNECTORS F4
AKCT1B57E ’03.9
http://www.nais-e.com/
New
1
AXK7L, 8L
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Electrical
characteristics
Breakdown voltage
Insulation resistance
Contact resistance
Ambient temperature
Soldering heat resistance
Storage temperature
Specifications
0.3A/terminal (Max. 5 A at total terminals)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (Initial)
Max. 90mΩ
–55°C to +85°C
Max. peak temperature of 245°C
300°C within 5 sec, 350°C within 3 sec.
–55°C to +85°C (Product only)
–40°C to +50°C (Emboss packing)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
50 times
40 contacts; Socket: 0.05g Header: 0.03g
Conditions
—
—
Rated voltage is applied for one minutes and check for short circuit or
damage with a detection current of 1mA
Using 250V DC megger (applied for 1 min.)
Measured based on the HP4338B measurement method of JIS C 5402
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
No freezing at low temperatures
Sequence
1. -55
+0
°C,
30 min.
–3
2. 25
+10
°C,
Max.5 min.
–5
3. 85
+3
°C,
30 min.
–0
4. 25
+10
°C,
Max.5 min.
–5
Temperature 40±2°C,
humidity 90 to 95% R.H.
Temperature 35±2°C,
saltwater concentration 5±1%
Temperature 40±2°C,
gas concentration 3±1 ppm, humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/hours
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
2
S resistance
(header and socket mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
2. Material and surface treatment
Part name
Molded portion
Contact/Post
Material
LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Au plating over Ni
Terminal portion: Au plating over Ni (Except for front edge of terminal)
Retention fitting portion: Sn plating over Ni (Socket: except for front edge of the terminal)
DIMENSIONS
• Socket (Mated height 0.9 mm)
Terminal coplanarity
0.87
A
B±0.1
0.40±0.05
0.15±0.03
This surface
C 0.15
Suction 0.80
mm General tolerance:
±0.2
Dimension table (mm)
0.08
(Contact and
retention fitting)
Dimensions
No. of
contacts
20
22
30
40
50
60
70
80
A
6.4
6.8
8.4
10.4
12.4
14.4
16.4
18.4
B
3.6
4.0
5.6
7.6
9.6
11.6
13.6
15.6
C
5.0
5.4
7.0
9.0
11.0
13.0
15.0
17.0
D
6.4
6.8
8.4
10.4
12.4
14.4
16.4
18.4
5.00
4.40
0.10±0.03
0.40±0.05
C±0.15
Retention solder tab
• Header (Mated height: 0.9 mm)
Dimension table (mm)
Terminal coplanarity
0.63
A
B
C±0.1
0.40±0.05
0.15±0.03
5.00
0.08
(Post and
retention fitting)
Dimensions
No. of
contacts
20
22
30
40
50
60
70
80
A
6.0
6.4
8.0
10.0
12.0
14.0
16.0
18.0
B
5.74
6.14
7.74
9.74
11.74
13.74
15.74
17.74
C
3.6
4.0
5.6
7.6
9.6
11.6
13.6
15.6
D
6.4
6.8
8.4
10.4
12.4
14.4
16.4
18.4
1.20±0.05
Suction 2.30
3.36
.1
Retention solder tab
5
2
R0
.1
5
R0
0.08±0.03
4.10
AXK7L, 8L
• Socket and header are mated
Header
0.90±0.15
Socket
EMBOSSED TAPE AND REEL DIMENSIONS CHART
1. Socket
• Tape dimensions
1) A dimensions: 24mm
(A±0.3)
(C)
(1.75)
(4.0)
2) A dimensions: 32mm
(A±0.3)
(B)
(C)
(1.75)
(4.0)
Top cover tape
Emboss carrier tape
2) A dimensions: 16mm
(A±0.3)
(C)
(1.75)
(4.0)
Top cover tape
Emboss carrier tape
Pull-out direction
Pull-out direction
(2.0)
(2.0)
(2.0)
°
to
165
165
8.0
8.0
8.0
°
to
180
°
180
1.5
+0.1
0
dia.
1.5
+0
0
°
1.5
+0.1
0
d
ia.
.1
dia
.
Narrow pitch connector
Narrow pitch connector
Dimension table (mm)
Dimensions
No. of
contacts
Max.24
26 to 70
80
A
16.0
24.0
32.0
B
—
—
28.4
C
7.5
11.5
14.2
D
16.4
24.4
32.4
2. Header
• Tape dimensions
1) A dimensions: 24mm
(A±0.3)
(C)
(1.75)
(4.0)
2) A dimensions: 32mm
(A±0.3)
(B)
(C)
(1.75)
(4.0)
Top cover tape
Emboss carrier tape
2) A dimensions: 16mm
(A±0.3)
(C)
(1.75)
(4.0)
Emboss carrier tape
Top cover tape
Pull-out direction
(2.0)
Pull-out direction
(2.0)
(2.0)
°
to
165
°
to
165
8.0
8.0
8.0
°
180
°
180
1.5
+0.1
0
dia.
1.5
+0
.
0 1
dia
.
1.5
+0.1
0
d
ia.
Narrow pitch connector
Narrow pitch connector
Dimension table (mm)
Dimensions
No. of
contacts
Max.24
26 to 70
80
A
16.0
24.0
32.0
B
—
—
28.4
C
7.5
11.5
14.2
D
16.4
24.4
32.4
• Reel dimensions
(D
+2
)
0
Label
Top cover tape
Emboss carrier tape
370 dia.
Taping reel
Cavity
3
AXK7L, 8L
NOTES
1. Removal by pulling up from an end
causes the entire connector removal
force to concentrate on the retention
fittings and end terminals. Therefore,
please lift and remove from the side.
Doing so will also prevent cracking of
the soldered parts.
• Socket
Recommended PC board pattern
(Mount pad arrangement pattern)
B±0.05
0.40±0.03
0.23±0.03
• Header
Recommended PC board pattern
(Mount pad arrangement pattern)
C±0.05
0.40±0.03
0.23±0.03
Max. 2.20
C
0.
40
0.57±0.03
4.70±0.03
3.60±0.03
4.00±0.03
5.60±0.03
Pull
1.00±0.03
D±0.05
: Through hole without
insulation is prohibited.
D±0.05
Relation between connector and mounting pad
NG
Recommended metal mask pattern
Pull
(Max. 2.20)
(3.20±0.03)
(4.70±0.03)
Mounting pad
: Through hole without
insulation is prohibited.
Recommended metal mask pattern
Metal mask thickness: 150
µm
Metal mask thickness: 150
µm
(Terminal portion opening area ratio: 53%)
(Metal portion opening area ratio: 100%)
(0.49)
1.40±0.01
1.00±0.01
(Terminal portion opening area ratio: 52%)
(Metal portion opening area ratio: 40%)
1.30±0.01
0.25±0.01
(0.45)
3.60±0.01
4.50±0.01
(0.57)
3.36±0.01
2. PC Boards and Recommended Metal
Mask Patterns
Connectors are mounted with high
density, with a pitch interval of 0.4 to 0.5
mm. It is therefore necessary to make
sure that the right levels of solder are
used, in order to reduce solder bridge and
other issues. The figures to the right are
recommended metal mask patterns.
Please use them as a reference.
In particular, if a lot of solder is used in
the header retaining retention fittings,
it might interfere with and cause
incomplete socket mating. Therefore,
please follow the recommended
conditions given on the left.
5.60±0.01
3.60±0.01
4.42±0.01
5.40±0.01
1.30±0.01
(1.00)
0.20±0.01
0.40±0.01
0.20±0.01
0.40±0.01
Recommended metal mask pattern
Metal mask thickness: 120
µm
Recommended metal mask pattern
Metal mask thickness: 120
µm
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 100%)
(0.61)
1.40±0.01
1.00±0.01
(Terminal portion opening area ratio: 66%)
(Metal portion opening area ratio: 51%)
1.30±0.01
0.31±0.01
5.60±0.01
3.60±0.01
4.18±0.01
5.40±0.01
(1.00)
0.20±0.01
0.40±0.01
1.30±0.01
0.20±0.01
0.40±0.01
These materials are printed on ECF pulp.
These materials are printed with earth-friendly vegetable-based (soybean oil) ink.
Please contact ..........
Matsushita Electric Works, Ltd.
Automation Controls Company
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
Telephone: Japan (81) Osaka (06) 6908-1050
Facsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT © 2003 All Rights Reserved
A
4
KCT1B57E
200309-3YT
Specifications are subject to change without notice.
Printed in Japan.
4.50±0.01
1.40±0.03
3.20±0.03
C
0.
40
C
4
0.
0
