Multilayer ceramic capacitors
Chip capacitors, C0G
Date:
October 2006
Data Sheet
ã
EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS’ prior express consent is prohibited.
Multilayer ceramic capacitors
C0G
Ordering code system
Chip
B37940
K
5
010
C
5
60
Packaging
60
62
70
72
01
^
^
^
^
^
cardboard tape, 180-mm reel
blister tape, 180-mm reel
cardboard tape, 330-mm reel
blister tape, 330-mm reel
bulk case
Decimal place
for cap. values <10 pF, otherwise 0
Capacitance tolerance
C
R
<10 pF:
B
^
±0.1
pF
C
^
±0.25
pF (standard for capacitance values
≤4.7
pF)
D
^
±0.5
pF (standard for capacitance values
≤8.2
pF)
F
G
J
K
C
R
³10
pF:
^
^
^
^
±
1%
±
2%
±
5% (standard)
±10%
Capacitance,
coded
(example)
010
^
1 · 10
0
pF = 1 pF
100
^
10 · 10
0
pF = 10 pF
221
^
22 · 10
1
pF = 220 pF
50
5
100
1
200
2
Rated voltage
Rated voltage [VDC]
Code
Termination
Standard:
On request:
K
^
nickel barrier for all case sizes
J
^
silver-palladium for conductive adhesion: all case sizes
Type and size
Chip size
(inch / mm)
0402
/ 1005
0603
/ 1608
0805
/ 2012
1206
/ 3216
1210
/ 3225
Temperature characteristic
C0G
B37920
B37930
B37940
B37871
B37949
Please read
Cautions and warnings
and
Important notes
at the end of this document.
2
10/06
Multilayer ceramic capacitors
C0G
Features
■
■
■
■
■
Chip
Good thermal stability
High insulation resistance
Low dissipation factor
Low inductance
To AEC-Q200
Applications
■
■
■
■
Resonant circuits
Filter circuits
Timing elements
Coupling and filtering, particularly in RF circuits
Termination
■
For soldering: Nickel barrier terminations (Ni)
■
For conductive adhesion: Silver-palladium terminations (AgPd) on request
Options
■
Alternative capacitance tolerances available on request
Delivery mode
■
Cardboard and blister tape (blister tape for chip thickness
³
1.2
±
0.1 mm and case size 1210),
180-mm and 330-mm reel available
■
Bulk case for case sizes 0402, 0603 (50 V) and 0805 (50 V) on request
Electrical data
Temperature characteristic
Climatic category (IEC 60068-1)
Standard
Dielectric
Rated voltage
Test voltage
Capacitance range / E series
Temperature coefficient
Dissipation factor (limit value)
Insulation resistance
1)
at + 25
°
C
Insulation resistance
1)
at +125
°
C
Time constant
1)
at + 25
°
C
Time constant
1)
at +125
°
C
Operating temperature range
Ageing
C0G
55/125/56
EIA
Class 1
50, 100, 200
2.5 · V
R
/5 s
1 pF … 10 nF (E6/E12)
0
±
30 · 10
–6
/K
<1.0 · 10
–3
>10
5
>10
4
>1000
>100
–55 … +125
none
V
R
V
test
C
R
tan
d
R
ins
R
ins
t
t
T
op
VDC
VDC
M
W
M
W
s
s
°
C
1) For C
R
>10 nF the time constant
t
= C · R
ins
is given.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
3
10/06
C0G
Multilayer ceramic capacitors
C0G
Capacitance tolerances
C
R
£
4.7 pF
Code letter
Tolerance
B
C
(standard)
D
5.6 pF
£
C
R
£
8.2 pF
B
C
D
(standard)
±
0.1 pF
±
0.25 pF
(on request)
±
0.5 pF
±
0.1 pF
±
0.25 pF
±
0.5 pF
(on request) (on request)
C
R
³
10 pF
Code letter
Tolerance
F
G
J
(standard)
K
±
1% (on request for 50 V
±
2% (on request for 50 V
±
5%
and 100 V; not available for and 100 V; not available for
200 V)
200 V)
±
10%
Dimensional drawing
b
s
k
k
KKE0329-N
Dimensions (mm)
Case size
l
b
s
k
(inch)
(mm)
0402
1005
1.0
±
0.10
0.5
±
0.05
0.5
±
0.05
0.1 –0.40
0603
1608
1.6
±
0.15
0.8
±
0.10
0.8
±
0.10
0.1 –0.40
0805
2012
2.00
±
0.20
1.25
±
0.15
1.30 max.
0.13 –0.75
1206
3216
3.20
±
0.20
1.60
±
0.15
1.30 max.
0.25 –0.75
1210
3225
3.20
±
0.30
2.50
±
0.30
1.70 max.
0.25 –0.75
Tolerances to CECC 32101-801
Please read
Cautions and warnings
and
Important notes
at the end of this document.
4
10/06
Multilayer ceramic capacitors
C0G
Recommended solder pad
D
C0G
C
A
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
0402/1005
0603/1608
0805/2012
1206/3216
1210/3225
Type
single chip
single chip
single chip
single chip
single chip
A
0.35 … 0.45
0.60 … 0.70
0.60 … 0.70
0.80 … 0.90
1.00 … 1.20
C
1.0 … 1.40
1.8 … 2.20
2.2 … 2.60
3.8 … 4.32
4.0 … 4.80
D
0.4 … 0.6
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
1.8 … 2.3
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
0603/1608
0805/2012
1206/3216
Termination
Ceramic body
Type
single chip
single chip
single chip
A
0.8 … 0.9
0.9 … 1.0
1.0 … 1.1
C
2.2 … 2.8
2.8 … 3.2
4.2 … 4.8
D
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
Termination
(nickel barrier)
Inner electrode
AgPd
Substrate electrode
Intermediate electrode
External electrode
Ag
Ni
Sn
KKE0484-W
Please read
Cautions and warnings
and
Important notes
at the end of this document.
5
10/06
DSP 与 ARM 处理器
