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BC857BM

PNP general purpose transistors

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
零件包装代码
SC-101
包装说明
1 MM X 0.6 MM, 0.5 MM HEIGHT, PLASTIC, SC-101, 3 PIN
针数
3
Reach Compliance Code
compli
ECCN代码
EAR99
外壳连接
COLLECTOR
最大集电极电流 (IC)
0.1 A
集电极-发射极最大电压
45 V
配置
SINGLE
最小直流电流增益 (hFE)
220
JESD-30 代码
R-PBCC-N3
JESD-609代码
e3
湿度敏感等级
1
元件数量
1
端子数量
3
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
260
极性/信道类型
PNP
最大功率耗散 (Abs)
0.43 W
认证状态
Not Qualified
表面贴装
YES
端子面层
Tin (Sn)
端子形式
NO LEAD
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
晶体管应用
SWITCHING
晶体管元件材料
SILICON
标称过渡频率 (fT)
100 MHz
Base Number Matches
1
文档预览
DISCRETE SEMICONDUCTORS
DATA SHEET
M3D883
BOTTOM VIEW
BC857M series
PNP general purpose transistors
Product data sheet
Supersedes data of 2003 Jul 15
2004 Mar 10
NXP Semiconductors
Product data sheet
PNP general purpose transistors
FEATURES
Leadless ultra small plastic package
(1 mm
×
0.6 mm
×
0.5 mm)
Board space 1.3
×
0.9 mm
Power dissipation comparable to SOT23.
APPLICATIONS
General purpose small signal DC
Low and medium frequency AC applications
Mobile communications, digital (still) cameras, PDAs,
PCMCIA cards.
DESCRIPTION
PNP general purpose transistor in a SOT883 leadless ultra
small plastic package.
NPN complement: BC847M series.
MARKING
TYPE NUMBER
BC857AM
BC857BM
BC857CM
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
BC857AM
BC857BM
BC857CM
DESCRIPTION
MARKING CODE
D1
D2
D3
QUICK REFERENCE DATA
SYMBOL
V
CEO
I
C
I
CM
PINNING
PIN
1
2
3
base
emitter
collector
BC857M series
PARAMETER
collector-emitter voltage
collector current (DC)
peak collector current
MAX.
−45
−100
−200
UNIT
V
mA
mA
DESCRIPTION
handbook, halfpage
3
3
1
2
2
1
Bottom view
MAM469
Fig.1 Simplified outline (SOT883) and symbol.
VERSION
SOT883
Leadless ultra small plastic package; 3 solder lands; body
1.0 x 0.6 x 0.5 mm
2004 Mar 10
2
NXP Semiconductors
Product data sheet
PNP general purpose transistors
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
PARAMETER
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
T
amb
25
°C
note 1
note 2
T
stg
T
j
T
amb
Notes
storage temperature
junction temperature
operating ambient temperature
−65
−65
CONDITIONS
open emitter
open base
open collector
MIN.
BC857M series
MAX.
−50
−45
−5
−100
−200
−100
250
430
+150
150
+150
V
V
V
UNIT
mA
mA
mA
mW
mW
°C
°C
°C
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60
μm
copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm
2
.
THERMAL CHARACTERISTICS
SYMBOL
R
th(j-a)
PARAMETER
thermal resistance from junction to ambient
CONDITIONS
in free air
note 1
note 2
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60
μm
copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm
2
.
500
290
K/W
K/W
VALUE
UNIT
2004 Mar 10
3
NXP Semiconductors
Product data sheet
PNP general purpose transistors
CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
I
CBO
I
EBO
h
FE
PARAMETER
collector-base cut-off current
emitter-base cut-off current
DC current gain
BC857AM
BC857BM
BC857CM
V
BE
V
CEsat
C
c
f
T
F
Note
1. Pulse test: t
p
300
μs; δ ≤
0.02.
base-emitter voltage
collector-emitter saturation voltage
collector capacitance
transition frequency
noise figure
I
C
=
−2
mA; V
CE
=
−5
V
I
C
=
−10
mA; V
CE
=
−5
V
I
C
=
−10
mA; I
B
=
−0.5
mA
I
C
=
−100
mA; I
B
=
−5
mA; note 1
I
E
= i
e
= 0; V
CB
=
−10
V; f = 1 MHz
V
CE
=
−5
V; I
C
=
−10
mA;
f = 100 MHz
I
C
=
−200 μA;
V
CE
=
−5
V;
R
S
= 2 kΩ; f = 1 kHz; B = 200 Hz
CONDITIONS
V
CB
=
−30
V; I
E
= 0
V
CB
=
−30
V; I
E
= 0; T
j
= 150
°C
V
EB
=
−5
V; I
C
= 0
V
CE
=
−5
V; I
C
=
−2
mA
125
220
420
−600
100
BC857M series
MIN.
MAX.
−15
−5
−100
250
475
800
−750
−820
−200
−400
2.5
10
UNIT
nA
μA
nA
mV
mV
mV
mV
pF
MHz
dB
2004 Mar 10
4
NXP Semiconductors
Product data sheet
PNP general purpose transistors
GRAPHICAL INFORMATION BC857AM
MLE188
BC857M series
handbook, halfpage
500
handbook, halfpage
−1200
VBE
(mV)
−1000
MLE189
hFE
400
(1)
(1)
300
−800
(2)
200
(2)
−600
(3)
100
−400
(3)
0
−10
−2
−10
−1
−1
−10
−10
2
−10
3
IC (mA)
−200
−10
−2
V
CE
=
−5
V.
−10
−1
−1
−10
−10
2
−10
3
IC (mA)
V
CE
=
−5
V.
(1) T
amb
= 150
°C.
(2) T
amb
= 25
°C.
(3) T
amb
=
−55 °C.
(1) T
amb
=
−55 °C.
(2) T
amb
= 25
°C.
(3) T
amb
= 150
°C.
Fig.3
Fig.2 DC current gain; typical values.
Base-emitter voltage as a function of
collector current; typical values.
−10
4
handbook, halfpage
VCEsat
(mV)
−10
3
MLE190
handbook, halfpage
−1200
MLE191
VBEsat
(mV)
−1000
(1)
(2)
−800
−10
2
(1)
(2)
(3)
−600
(3)
−400
−10
−10
−1
−1
−10
−10
2
IC (mA)
−10
3
−200
−10
−1
−1
−10
−10
2
−10
3
IC (mA)
I
C
/I
B
= 20.
(1) T
amb
= 150
°C.
(2) T
amb
= 25
°C.
(3) T
amb
=
−55 °C.
I
C
/I
B
= 20.
(1) T
amb
=
−55 °C.
(2) T
amb
= 25
°C.
(3) T
amb
= 150
°C.
Fig.4
Collector-emitter saturation voltage as a
function of collector current; typical values.
Fig.5
Base-emitter saturation voltage as a
function of collector current; typical values.
2004 Mar 10
5
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参数对比
与BC857BM相近的元器件有:BC857AM、BC857CM、BC857M。描述及对比如下:
型号 BC857BM BC857AM BC857CM BC857M
描述 PNP general purpose transistors PNP general purpose transistors PNP general purpose transistors PNP general purpose transistors
是否无铅 不含铅 不含铅 不含铅 -
是否Rohs认证 符合 符合 符合 -
零件包装代码 SC-101 SC-101 SC-101 -
包装说明 1 MM X 0.6 MM, 0.5 MM HEIGHT, PLASTIC, SC-101, 3 PIN 1 MM X 0.6 MM, 0.5 MM HEIGHT, PLASTIC, SC-101, 3 PIN 1 MM X 0.6 MM, 0.5 MM HEIGHT, PLASTIC, SC-101, 3 PIN -
针数 3 3 3 -
Reach Compliance Code compli compli compli -
ECCN代码 EAR99 EAR99 EAR99 -
外壳连接 COLLECTOR COLLECTOR COLLECTOR -
最大集电极电流 (IC) 0.1 A 0.1 A 0.1 A -
集电极-发射极最大电压 45 V 45 V 45 V -
配置 SINGLE SINGLE SINGLE -
最小直流电流增益 (hFE) 220 125 420 -
JESD-30 代码 R-PBCC-N3 R-PBCC-N3 R-PBCC-N3 -
JESD-609代码 e3 e3 e3 -
湿度敏感等级 1 1 1 -
元件数量 1 1 1 -
端子数量 3 3 3 -
最高工作温度 150 °C 150 °C 150 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER -
峰值回流温度(摄氏度) 260 260 260 -
极性/信道类型 PNP PNP PNP -
最大功率耗散 (Abs) 0.43 W 0.43 W 0.43 W -
认证状态 Not Qualified Not Qualified Not Qualified -
表面贴装 YES YES YES -
端子面层 Tin (Sn) Tin (Sn) Tin (Sn) -
端子形式 NO LEAD NO LEAD NO LEAD -
端子位置 BOTTOM BOTTOM BOTTOM -
处于峰值回流温度下的最长时间 30 30 30 -
晶体管应用 SWITCHING SWITCHING SWITCHING -
晶体管元件材料 SILICON SILICON SILICON -
标称过渡频率 (fT) 100 MHz 100 MHz 100 MHz -
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