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BFG425W,135

射频(RF)双极晶体管 Single NPN 4.5V 25mA 135mW 50 25GHz

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
Source Url Status Check Date
2013-06-14 00:00:00
Brand Name
NXP Semiconductor
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
针数
4
制造商包装代码
SOT343R
Reach Compliance Code
compliant
文档预览
DISCRETE SEMICONDUCTORS
DATA SHEET
BFG425W
NPN 25 GHz wideband transistor
Product specification
Supersedes data of 1998 Mar 11
2010 Sep 15
NXP Semiconductors
Product specification
NPN 25 GHz wideband transistor
FEATURES
Very high power gain
Low noise figure
High transition frequency
Emitter is thermal lead
Low feedback capacitance.
APPLICATIONS
RF front end
Wideband applications, e.g. analog and digital cellular
telephones, cordless telephones (PHS, DECT, etc.)
Radar detectors
Pagers
Satellite television tuners (SATV)
High frequency oscillators.
Marking code:
P5*
handbook, halfpage
BFG425W
PINNING
PIN
1
2
3
4
emitter
base
emitter
collector
DESCRIPTION
3
4
2
Top view
1
MSB842
DESCRIPTION
NPN double polysilicon wideband transistor with buried
layer for low voltage applications in a plastic, 4-pin
dual-emitter SOT343R package.
QUICK REFERENCE DATA
SYMBOL
V
CBO
V
CEO
I
C
P
tot
h
FE
C
re
f
T
G
max
F
PARAMETER
collector-base voltage
collector current (DC)
total power dissipation
DC current gain
feedback capacitance
transition frequency
maximum power gain
noise figure
T
s
103
C
I
C
= 25 mA; V
CE
= 2 V; T
j
= 25
C
I
C
= 0; V
CB
= 2 V; f = 1 MHz
open emitter
collector-emitter voltage open base
CONDITIONS
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Fig.1 Simplified outline SOT343R.
MIN.
50
TYP.
25
80
95
25
20
1.2
MAX.
10
4.5
30
135
120
UNIT
V
V
mA
mW
fF
GHz
dB
dB
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz; T
amb
= 25
C 
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz; T
amb
= 25
C 
I
C
= 2 mA; V
CE
= 2 V; f = 2 GHz;
S
=
opt
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
2010 Sep 15
2
NXP Semiconductors
Product specification
NPN 25 GHz wideband transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
Note
1. T
s
is the temperature at the soldering point of the emitter pins.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-s
PARAMETER
thermal resistance from junction to soldering point
VALUE
350
PARAMETER
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
total power dissipation
storage temperature
operating junction temperature
T
s
103
C;
note 1; see Fig.2
open base
open collector
CONDITIONS
open emitter
65
MIN.
BFG425W
MAX.
10
4.5
1
30
135
+150
150
V
V
V
UNIT
mA
mW
C
C
UNIT
K/W
handbook, halfpage
200
MGG681
Ptot
(mW)
150
100
50
0
0
40
80
120
Ts (°C)
160
Fig.2 Power derating curve.
2010 Sep 15
3
NXP Semiconductors
Product specification
NPN 25 GHz wideband transistor
CHARACTERISTICS
T
j
= 25
C
unless otherwise specified.
SYMBOL
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
h
FE
C
c
C
e
C
re
f
T
G
max
S
21
F
2
BFG425W
PARAMETER
collector-base breakdown voltage
emitter-base breakdown voltage
collector-base leakage current
DC current gain
collector capacitance
emitter capacitance
feedback capacitance
transition frequency
maximum power gain; note 1
insertion power gain
noise figure
CONDITIONS
I
C
= 2.5
A;
I
E
= 0
I
E
= 2.5
A;
I
C
= 0
I
E
= 0; V
CB
= 4.5 V
I
C
= 25 mA; V
CE
= 2 V; see Fig.3
I
E
= i
e
= 0; V
CB
= 2 V; f = 1 MHz
I
C
= i
c
= 0; V
EB
= 0.5 V; f = 1 MHz
I
C
= 0; V
CB
= 2 V; f = 1 MHz;
see Fig.4
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz;
T
amb
= 25
C;
see Fig.5
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz;
T
amb
= 25
C;
see Figs 7 and 8
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz;
T
amb
= 25
C;
see Fig.8
I
C
= 2 mA; V
CE
= 2 V; f = 900 MHz;
S
=
opt
; see Fig.13
I
C
= 2 mA; V
CE
= 2 V; f = 2 GHz;
S
=
opt
; see Fig.13
MIN.
10
4.5
1
50
TYP.
80
300
575
95
25
20
17
0.8
1.2
12
22
MAX.
15
120
UNIT
V
V
V
nA
fF
fF
fF
GHz
dB
dB
dB
dB
dBm
dBm
collector-emitter breakdown voltage I
C
= 1 mA; I
B
= 0
P
L1
ITO
Notes
output power at 1 dB gain
compression
third order intercept point
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz;
Z
S
= Z
S opt
; Z
L
= Z
L opt
; note 2
I
C
= 25 mA; V
CE
= 2 V; f = 2 GHz;
Z
S
= Z
S opt
; Z
L
= Z
L opt
; note 2
1. G
max
is the maximum power gain, if K > 1. If K < 1 then G
max
= MSG; see Figs 6, 7 and 8.
2. Z
S
is optimized for noise; Z
L
is optimized for gain.
2010 Sep 15
4
NXP Semiconductors
Product specification
NPN 25 GHz wideband transistor
BFG425W
MGG682
handbook, halfpage
120
handbook, halfpage
200
MGG683
Cre
(fF)
hFE
(1)
(2)
(3)
160
80
120
80
40
40
0
0
(1) V
CE
= 3 V.
(2) V
CE
= 2 V.
(3) V
CE
= 1 V.
0
10
20
30
IC (mA)
40
0
1
2
3
4
5
VCB (V)
I
C
= 0; f = 1 MHz.
Fig.3
DC current gain as a function of collector
current; typical values.
Fig.4
Feedback capacitance as a function of
collector-base voltage; typical values.
handbook, halfpage
25
MGG684
fT
handbook, halfpage
30
MGG685
(GHz)
20
MSG
(dB)
20
15
10
10
5
0
1
10
IC (mA)
10
2
0
0
10
20
30
IC (mA)
40
V
CE
= 2 V; f = 2 GHz; T
amb
= 25
C.
V
CE
= 2 V; f = 900 MHz.
Fig.5
Transition frequency as a function of
collector current; typical values.
Fig.6
Maximum stable gain as a function of
collector current; typical values.
2010 Sep 15
5
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