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BFQ251-T/R

TRANSISTOR UHF BAND, Si, PNP, RF SMALL SIGNAL TRANSISTOR, TO-92, BIP RF Small Signal

器件类别:分立半导体    晶体管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
NXP(恩智浦)
包装说明
CYLINDRICAL, O-PBCY-T3
Reach Compliance Code
unknown
其他特性
HIGH RELIABILITY
最大集电极电流 (IC)
0.3 A
基于收集器的最大容量
2 pF
集电极-发射极最大电压
65 V
配置
SINGLE
最小直流电流增益 (hFE)
20
最高频带
ULTRA HIGH FREQUENCY BAND
JEDEC-95代码
TO-92
JESD-30 代码
O-PBCY-T3
元件数量
1
端子数量
3
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
ROUND
封装形式
CYLINDRICAL
极性/信道类型
PNP
功耗环境最大值
1 W
认证状态
Not Qualified
参考标准
CECC
表面贴装
NO
端子形式
THROUGH-HOLE
端子位置
BOTTOM
晶体管应用
AMPLIFIER
晶体管元件材料
SILICON
标称过渡频率 (fT)
1300 MHz
文档预览
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D186
BFQ251
PNP video transistor
Product specification
Supersedes data of 1997 Oct 02
1998 Oct 06
Philips Semiconductors
Product specification
PNP video transistor
FEATURES
High breakdown voltages
Low output capacitance
High gain bandwidth
Good thermal stability
Gold metallization ensures
excellent reliability.
APPLICATIONS
Buffer/driver in high-resolution
colour graphics monitors.
DESCRIPTION
PNP video transistor in a SOT54
(TO-92) plastic package.
NPN complement: BFQ231.
PINNING
BFQ251
page
1
2
3
MSB033
PIN
1
2
3
base
DESCRIPTION
collector
emitter
Fig.1
Simplified outline
(SOT54; TO-92).
QUICK REFERENCE DATA
SYMBOL
V
CBO
V
CER
I
C
P
tot
h
FE
f
T
Note
1. T
s
is the temperature at the soldering point of the collector pin, 4 mm from the body.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
CBO
V
CEO
V
CER
V
EBO
I
C
P
tot
T
stg
T
j
Notes
1. T
s
is the temperature at the soldering point of the collector pin, 4 mm from the body.
2. Transistor mounted on a printed-circuit board with a metallized pad area of 10 mm
2
.
PARAMETER
collector-base voltage
collector-emitter voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
total power dissipation
storage temperature
junction temperature
T
s
65
°C;
notes 1 and 2; see Fig.3
open emitter
open base
R
BE
= 100
open collector
CONDITIONS
−65
MIN.
MAX.
−100
−65
−95
−3
−300
1
+150
150
V
V
V
V
mA
W
°C
°C
UNIT
PARAMETER
collector-base voltage
collector-emitter voltage
collector current (DC)
total power dissipation
DC current gain
transition frequency
T
s
65
°C;
note 1
I
C
=
−50
mA; V
CE
=
−10
V
open emitter
R
BE
= 100
CONDITIONS
20
MIN.
30
1.3
TYP.
MAX.
−100
−95
−300
1
GHz
UNIT
V
V
mA
W
I
C
=
−50
mA; V
CE
=
−10
V; T
amb
= 25
°C
1
1998 Oct 06
2
Philips Semiconductors
Product specification
PNP video transistor
THERMAL CHARACTERISTICS
SYMBOL
R
th j-s
R
th j-a
Note
1. T
s
is the temperature at the soldering point of the collector pin, 4 mm from the body.
CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
V
(BR)CBO
V
(BR)CEO
V
(BR)CER
V
(BR)EBO
I
CES
I
CBO
h
FE
C
cb
f
T
PARAMETER
collector-base breakdown voltage
CONDITIONS
I
C
=
−0.1
mA; I
E
= 0
MIN.
−100
−65
−95
−3
20
1
TYP.
30
2
1.3
PARAMETER
thermal resistance from junction to soldering point
thermal resistance from junction to ambient
CONDITIONS
note 1
BFQ251
VALUE
85
185
UNIT
K/W
K/W
MAX. UNIT
−100
−20
pF
GHz
V
V
V
V
µA
µA
collector-emitter breakdown voltage I
C
=
−10
mA; I
B
= 0
collector-emitter breakdown voltage I
C
=
−10
mA; R
BE
= 100
emitter-base breakdown voltage
collector-emitter cut-off current
collector-base cut-off current
DC current gain
collector-base capacitance
transition frequency
I
E
=
−0.1
mA; I
C
= 0
I
B
= 0; V
CE
=
−50
V
I
E
= 0; V
CB
=
−50
V
I
C
=
−50
mA; V
CE
=
−10
V; see Fig.4
I
C
= i
c
= 0; V
CB
=
−10
V; f = 1 MHz;
see Fig.5
I
C
=
−50;
V
CE
=
−10
V; see Fig.6
−400
handbook, halfpage
IC
(mA)
−300
MEA232 - 1
MEA228 - 1
1.2
handbook, halfpage
Ptot
(W)
1.0
0.8
−200
0.6
0.4
−100
0.2
0
0
−20
−40
−60
−80
−100
VCEO (V)
0
0
50
100
150
Ts (
o
C)
200
T
amb
= 25
°C.
Fig.2 DC SOAR.
Fig.3 Power derating curve.
1998 Oct 06
3
Philips Semiconductors
Product specification
PNP video transistor
BFQ251
MEA231
MEA229
handbook,
40
halfpage
6
handbook, halfpage
Ccb
(pF)
hFE
30
4
20
2
10
0
0
−100
−200
IC (mA)
−300
0
0
−10
−20
−30
−40
VCB (V)
V
CE
=
−10
V; T
amb
= 25
°C.
f = 1 MHz; T
amb
= 25
°C.
Fig.4
DC current gain as a function of collector
current; typical values.
Fig.5
Collector-base capacitance as a function of
collector-base voltage; typical values.
handbook, halfpage
1.5
MBK897
fr
(GHz)
1
0.5
0
0
−50
−100
I (mA)
C
−150
V
CE
=
−10
V; T
amb
= 25
°C.
Fig.6
Transition frequency as a function of
collector current; typical values.
1998 Oct 06
4
Philips Semiconductors
Product specification
PNP video transistor
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
BFQ251
SOT54
c
E
d
A
L
b
1
D
2
e1
e
3
b
1
L1
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
REFERENCES
IEC
JEDEC
TO-92
EIAJ
SC-43
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
A
5.2
5.0
b
0.48
0.40
b1
0.66
0.56
c
0.45
0.40
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
e
2.54
e1
1.27
L
14.5
12.7
L1
(1)
2.5
1998 Oct 06
5
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