型号
- 型号
- 关键词
| 型号 | BFS17A,215 | BFS17A-T | BFS17AT/R |
|---|---|---|---|
| 描述 | TRANS NPN 25MA 15V 3GHZ SOT23 | TRANSISTOR UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP RF Small Signal | TRANSISTOR UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR, TO-236AB, PLASTIC PACKAGE-3, BIP RF Small Signal |
| 零件包装代码 | TO-236 | SOT-23 | SOT-23 |
| 包装说明 | PLASTIC, SST, 3 PIN | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 |
| 针数 | 3 | 3 | 3 |
| Reach Compliance Code | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 最大集电极电流 (IC) | 0.025 A | 0.025 A | 0.025 A |
| 集电极-发射极最大电压 | 15 V | 15 V | 15 V |
| 配置 | SINGLE | SINGLE | SINGLE |
| 最小直流电流增益 (hFE) | 25 | 25 | 25 |
| 最高频带 | ULTRA HIGH FREQUENCY BAND | ULTRA HIGH FREQUENCY BAND | ULTRA HIGH FREQUENCY BAND |
| JESD-30 代码 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
| 元件数量 | 1 | 1 | 1 |
| 端子数量 | 3 | 3 | 3 |
| 最高工作温度 | 150 °C | 150 °C | 150 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 极性/信道类型 | NPN | NPN | NPN |
| 功耗环境最大值 | 0.3 W | 0.3 W | 0.3 W |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 参考标准 | CECC | CECC | CECC |
| 表面贴装 | YES | YES | YES |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL |
| 晶体管应用 | AMPLIFIER | AMPLIFIER | AMPLIFIER |
| 晶体管元件材料 | SILICON | SILICON | SILICON |
| 标称过渡频率 (fT) | 2800 MHz | 2800 MHz | 2800 MHz |
| 是否Rohs认证 | 符合 | - | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) |
| JESD-609代码 | e3 | - | e3 |
| 峰值回流温度（摄氏度） | 260 | - | 260 |
| 最大功率耗散 (Abs) | 0.3 W | - | 0.3 W |
| 端子面层 | Tin (Sn) | - | TIN |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 |
| JEDEC-95代码 | - | TO-236AB | TO-236AB |
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模拟与混合信号
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模拟与混合信号
