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BSM50GP60G

IGBT Modules 600V 50A PIM

器件类别:分立半导体    晶体管   

厂商名称:Infineon(英飞凌)

厂商官网:http://www.infineon.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Infineon(英飞凌)
包装说明
MODULE-24
Reach Compliance Code
not_compliant
ECCN代码
EAR99
外壳连接
ISOLATED
最大集电极电流 (IC)
70 A
集电极-发射极最大电压
600 V
配置
COMPLEX
门极-发射极最大电压
20 V
JESD-30 代码
R-XUFM-X24
元件数量
7
端子数量
24
最高工作温度
150 °C
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
250 W
认证状态
Not Qualified
表面贴装
NO
端子形式
UNSPECIFIED
端子位置
UPPER
处于峰值回流温度下的最长时间
NOT SPECIFIED
晶体管应用
POWER CONTROL
晶体管元件材料
SILICON
标称断开时间 (toff)
315 ns
标称接通时间 (ton)
105 ns
VCEsat-Max
2.55 V
文档预览
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
BSM 150 GD 60 DLC
Höchstzulässige Werte / Maximum rated values
Elektrische Eigenschaften / Electrical properties
Kollektor-Emitter-Sperrspannung
collector-emitter voltage
Kollektor-Dauergleichstrom
DC-collector current
Periodischer Kollektor Spitzenstrom
repetitive peak collector current
Gesamt-Verlustleistung
total power dissipation
Gate-Emitter-Spitzenspannung
gate-emitter peak voltage
Dauergleichstrom
DC forward current
Periodischer Spitzenstrom
repetitive peak forw. current
Grenzlastintegral der Diode
2
I t - value, Diode
Isolations-Prüfspannung
insulation test voltage
t
P
= 1ms
T
c
= 55°C
T
c
= 25°C
t
P
= 1ms, T
c
= 55°C
V
CES
I
C,nom.
I
C
I
CRM
600
150
180
300
V
A
A
A
T
c
= 25°C, Transistor
P
tot
570
W
V
GES
+/- 20V
V
I
F
150
A
I
FRM
300
A
V
R
= 0V, t
p
= 10ms, T
vj
= 125°C
I
2
t
4.800
A
2
s
RMS, f= 50Hz, t= 1min.
V
ISOL
2,5
kV
Charakteristische Werte / Characteristic values
Transistor / Transistor
Kollektor-Emitter Sättigungsspannung
collector-emitter saturation voltage
Gate-Schwellenspannung
gate threshold voltage
Eingangskapazität
input capacitance
Rückwirkungskapazität
reverse transfer capacitance
Kollektor-Emitter Reststrom
collector-emitter cut-off current
Gate-Emitter Reststrom
gate-emitter leakage current
I
C
= 150A, V
GE
= 15V, T
vj
= 25°C
I
C
= 150A, V
GE
= 15V, T
vj
= 125°C
I
C
= 3,0mA, V
CE
= V
GE
, T
vj
= 25°C
V
CE sat
min.
-
-
V
GE(th)
4,5
typ.
1,95
2,20
5,5
max.
2,45
-
6,5
V
V
V
f= 1MHz, T
vj
= 25°C, V
CE
= 25V, V
GE
= 0V
C
ies
-
6,5
-
nF
f= 1MHz, T
vj
= 25°C, V
CE
= 25V, V
GE
= 0V
V
CE
= 600V, V
GE
= 0V, T
vj
= 25°C
V
CE
= 600V, V
GE
= 0V, T
vj
= 125°C
V
CE
= 0V, V
GE
= 20V, T
vj
= 25°C
C
res
-
-
-
0,6
1
1
-
-
500
-
400
nF
µA
mA
nA
I
CES
I
GES
-
prepared by: Andreas Vetter
approved by: Michael Hornkamp
date of publication: 2000-04-26
revision: 1
1 (8)
BSM 150 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
BSM 150 GD 60 DLC
Charakteristische Werte / Characteristic values
Transistor / Transistor
I
C
= 150A, V
CC
= 300V
Einschaltverzögerungszeit (ind. Last)
turn on delay time (inductive load)
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 25°C
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 125°C
I
C
= 150A, V
CC
= 300V
Anstiegszeit (induktive Last)
rise time (inductive load)
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 25°C
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 125°C
I
C
= 150A, V
CC
= 300V
Abschaltverzögerungszeit (ind. Last)
turn off delay time (inductive load)
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 25°C
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 125°C
I
C
= 150A, V
CC
= 300V
Fallzeit (induktive Last)
fall time (inductive load)
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 25°C
V
GE
= ±15V, R
G
= 1,5Ω, T
vj
= 125°C
Einschaltverlustenergie pro Puls
turn-on energy loss per pulse
Abschaltverlustenergie pro Puls
turn-off energy loss per pulse
Kurzschlußverhalten
SC Data
Modulinduktivität
stray inductance module
Modul-Leitungswiderstand, Anschlüsse - Chip
lead resistance, terminals - chip
T
c
= 25°C
I
C
= 150A, V
CC
= 300V, V
GE
= 15V
R
G
= 1,5Ω, T
vj
= 125°C, L
σ
= 15nH
I
C
= 150A, V
CC
= 300V, V
GE
= 15V
R
G
= 1,5Ω, T
vj
= 125°C, L
σ
= 15nH
t
P
10µsec, V
GE
15V
T
vj
≤125°C,
V
CC
=360V, V
CEmax
= V
CES
-L
σCE
·di/dt
E
on
t
f
-
-
-
25
35
2,3
-
-
-
ns
ns
mJ
t
d,off
-
-
200
225
-
-
ns
ns
t
r
-
-
28
30
-
-
ns
ns
t
d,on
-
-
115
125
-
-
ns
ns
min.
typ.
max.
E
off
-
4,6
-
mJ
I
SC
-
675
-
A
L
σCE
-
28
-
nH
R
CC'+EE'
-
1,8
-
mΩ
Charakteristische Werte / Characteristic values
Diode / Diode
Durchlaßspannung
forward voltage
I
F
= 150A, V
GE
= 0V, T
vj
= 25°C
I
F
= 150A, V
GE
= 0V, T
vj
= 125°C
I
F
= 150A, -di
F
/dt= 5600A/µsec
Rückstromspitze
peak reverse recovery current
V
R
= 300V, V
GE
= -10V, T
vj
= 25°C
V
R
= 300V, V
GE
= -10V, T
vj
= 125°C
I
F
= 150A, -di
F
/dt= 5600A/µsec
Sperrverzögerungsladung
recoverred charge
V
R
= 300V, V
GE
= -10V, T
vj
= 25°C
V
R
= 300V, V
GE
= -10V, T
vj
= 125°C
I
F
= 150A, -di
F
/dt= 5600A/µsec
Abschaltenergie pro Puls
reverse recovery energy
V
R
= 300V, V
GE
= -10V, T
vj
= 25°C
V
R
= 300V, V
GE
= -10V, T
vj
= 125°C
E
rec
-
-
-
4,7
-
-
mJ
mJ
Q
r
-
-
11
19
-
-
µC
µC
I
RM
-
-
180
215
-
-
A
A
V
F
min.
-
-
typ.
1,25
1,20
max.
1,6
-
V
V
2 (8)
BSM 150 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
BSM 150 GD 60 DLC
Thermische Eigenschaften / Thermal properties
min.
Innerer Wärmewiderstand
thermal resistance, junction to case
Übergangs-Wärmewiderstand
thermal resistance, case to heatsink
Höchstzulässige Sperrschichttemperatur
maximum junction temperature
Betriebstemperatur
operation temperature
Lagertemperatur
storage temperature
Transistor / transistor, DC
Diode / diode, DC
pro Modul / per module
λ
Paste
= 1W/m*K /
λ
grease
= 1W/m*K
R
thJC
-
-
R
thCK
-
typ.
-
-
0,01
max.
0,22
0,44
-
K/W
K/W
K/W
T
vj
-
-
150
°C
T
op
-40
-
125
°C
T
stg
-40
-
125
°C
Mechanische Eigenschaften / Mechanical properties
Gehäuse, siehe Anlage
case, see appendix
Innere Isolation
internal insulation
CTI
comperative tracking index
Anzugsdrehmoment für mech. Befestigung
mounting torque
Gewicht
weight
Schraube M5
screw M5
M
-15
G
310
Al
2
O
3
225
4
+15
Nm
%
g
Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert.
Sie gilt in Verbindung mit den zugehörigen Technischen Erläuterungen.
This technical information specifies semiconductor devices but promises no characteristics.
It is valid in combination with the belonging technical notes.
3 (8)
BSM 150 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
BSM 150 GD 60 DLC
Ausgangskennlinie (typisch)
Output characteristic (typical)
I
C
= f (V
CE
)
V
GE
= 15V
300
250
Tvj = 25°C
Tvj = 125°C
200
I
C
[A]
150
100
50
0
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
V
CE
[V]
Ausgangskennlinienfeld (typisch)
Output characteristic (typical)
300
I
C
= f (V
CE
)
T
vj
= 125°C
250
VGE = 8V
VGE = 9V
VGE = 10V
VGE = 12V
VGE = 15V
VGE = 20V
200
I
C
[A]
150
100
50
0
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
4,0
4,5
5,0
V
CE
[V]
4 (8)
BSM 150 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules
BSM 150 GD 60 DLC
Übertragungscharakteristik (typisch)
Transfer characteristic (typical)
I
C
= f (V
GE
)
V
CE
= 20V
300
Tvj = 25°C
Tvj = 125°C
250
200
I
C
[A]
150
100
50
0
5
6
7
8
9
10
11
12
13
V
GE
[V]
Durchlaßkennlinie der Inversdiode (typisch)
Forward characteristic of inverse diode (typical)
300
Tvj = 25°C
I
F
= f (V
F
)
250
Tvj = 125°C
200
I
F
[A]
150
100
50
0
0,0
0,2
0,4
0,6
0,8
1,0
1,2
1,4
1,6
V
F
[V]
5 (8)
BSM 150 GD 60 DLC
2000-02-08
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