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BSS123NH6327

Small Signal Field-Effect Transistor, 0.19A I(D), 100V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3

器件类别:分立半导体    晶体管   

厂商名称:Infineon(英飞凌)

厂商官网:http://www.infineon.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Infineon(英飞凌)
包装说明
SMALL OUTLINE, R-PDSO-G3
针数
3
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
LOGIC LEVEL COMPATIBLE
配置
SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压
100 V
最大漏极电流 (Abs) (ID)
0.19 A
最大漏极电流 (ID)
0.19 A
最大漏源导通电阻
6 Ω
FET 技术
METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss)
3.1 pF
JESD-30 代码
R-PDSO-G3
JESD-609代码
e3
元件数量
1
端子数量
3
工作模式
ENHANCEMENT MODE
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
极性/信道类型
N-CHANNEL
最大功率耗散 (Abs)
0.5 W
参考标准
AEC-Q101
表面贴装
YES
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
30
晶体管元件材料
SILICON
Base Number Matches
1
文档预览
BSS123N
OptiMOS
Small-Signal-Transistor
Features
• N-channel
• Enhancement mode
• Logic level (4.5V rated)
• Avalanche rated
• Qualified according to AEC Q101
• 100% lead-free; RoHS compliant, Halogen free
Product Summary
V
DS
R
DS(on),max
V
GS
=10 V
V
GS
=4.5 V
I
D
100
6
10
0.19
A
V
W
PG-SOT23
3
1
2
Type
BSS123N
Package
SOT23
Tape and Reel Information
H6327: 3000 pcs/ reel
Marking
SAs
Halogon Free
Yes
Packing
Non dry
Maximum ratings,
at
T
j
=25 °C, unless otherwise specified
Parameter
Continuous drain current
Symbol Conditions
I
D
T
A
=25 °C
T
A
=70 °C
Pulsed drain current
Avalanche energy, single pulse
I
D,pulse
E
AS
T
A
=25 °C
I
D
=0.19 A,
R
GS
=25
W
I
D
=0.19 A,
V
DS
=80 V,
di /dt =200 A/µs,
T
j,max
=150 °C
Value
0.19
0.15
0.77
2.0
mJ
Unit
A
Reverse diode dv /dt
dv /dt
6
kV/µs
Gate source voltage
Power dissipation
1)
Operating and storage temperature
ESD Class
Soldering Temperature
IEC climatic category; DIN IEC 68-1
V
GS
P
tot
T
j
,
T
stg
JESD22-A114 -HBM
T
A
=25 °C
±20
0.5
-55 ... 150
0 (<250V)
260 °C
55/150/56
V
W
°C
Rev 2.3
page 1
2012-11-21
BSS123N
Parameter
Symbol Conditions
min.
Thermal characteristics
Thermal resistance,
junction - ambient
Values
typ.
max.
Unit
R
thJA
minimal footprint
1)
-
-
250
K/W
Electrical characteristics,
at
T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Drain-source leakage current
V
(BR)DSS
V
GS
=0 V,
I
D
=250 µA
V
GS(th)
I
DSS
V
DS
=Vgs V,
I
D
=13 µA
V
DS
=100 V,
V
GS
=0 V,
T
j
=25 °C
V
DS
=100 V,
V
GS
=0 V,
T
j
=150 °C
Gate-source leakage current
Drain-source on-state resistance
I
GSS
R
DS(on)
V
GS
=20 V,
V
DS
=0 V
V
GS
=4.5 V,
I
D
=0.15 A
V
GS
=10 V,
I
D
=0.19 A
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=0.15 A
100
0.8
-
-
1.4
-
-
1.8
0.01
mA
V
-
-
-
-
-
-
2.7
2.4
0.41
5
10
10
6
-
S
nA
W
1)
Performed on 40mm² FR4 PCB. The traces are 1mm wide, 70µm thick and 20mm long; they are present on both
sides of the PCB
Rev 2.3
page 2
2012-11-21
BSS123N
Parameter
Symbol Conditions
min.
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
Gate charge total
Gate plateau voltage
Reverse Diode
Diode continous forward current
Diode pulse current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
I
S
I
S,pulse
V
SD
t
rr
Q
rr
V
GS
=0 V,
I
F
=0.19 A,
T
j
=25 °C
V
R
=50 V,
I
F
=0.19 A,
di
F
/dt =100 A/µs
-
T
A
=25 °C
-
-
-
-
-
0.8
12
4.3
0.77
1.1
18
6.5
V
ns
nC
-
0.19
A
Q
gs
Q
gd
Q
g
V
plateau
V
DD
=50 V,
I
D
=0.19 A,
V
GS
=0 to 10 V
-
-
-
-
0.04
0.23
0.6
2.5
0.06
0.35
0.9
-
V
nC
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DD
=50 V,
V
GS
=10 V,
I
D
=0.19 A,
R
G,ext
=6
W
V
GS
=0 V,
V
DS
=25 V,
f
=1 MHz
-
-
-
-
-
-
-
15.7
3.4
2.1
2.3
3.2
7.4
22
20.9
4.5
3.1
3.5
4.6
11.1
33
ns
pF
Values
typ.
max.
Unit
Rev 2.3
page 3
2012-11-21
BSS123N
1 Power dissipation
P
tot
=f(T
A
)
2 Drain current
I
D
=f(T
A
);
V
GS
≥10 V
0.6
0.2
0.5
0.15
0.4
P
tot
[W]
0.3
I
D
[A]
0
40
80
120
160
0.1
0.2
0.05
0.1
0
0
0
40
80
120
160
T
A
[°C]
T
A
[°C]
3 Safe operating area
I
D
=f(V
DS
);
T
A
=25 °C;
D
=0
parameter:
t
p
1
1 µs
100 µs
10 µs
1 ms
4 Max. transient thermal impedance
Z
thJA
=f(t
p
)
parameter:
D
=t
p
/T
1000
0.1
10 ms
DC
Z
thJA
[K/W]
0.5
I
D
[A]
0.01
100
0.2
0.1
0.05
0.001
0.02
0.01
single pulse
0.0001
0.1
1
10
100
1000
10
0.0001 0.001
0.01
0.1
1
10
100
V
DS
[V]
t
p
[s]
Rev 2.3
page 4
2012-11-21
BSS123N
5 Typ. output characteristics
I
D
=f(V
DS
);
T
j
=25 °C
parameter:
V
GS
0.8
10 V
4V
3.5 V
3.3 V
6 Typ. drain-source on resistance
R
DS(on)
=f(I
D
);
T
j
=25 °C
parameter:
V
GS
10
9
8
2.8 V
0.7
3V
0.6
7
0.5
3V
6
R
DS(on)
[W]
I
D
[A]
0.4
2.8 V
5
4
3
3.3 V
0.3
3.5 V
4V
4.5 V
10 V
0.2
2
1
0
0
2
4
6
8
10
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0
V
DS
[V]
I
D
[A]
7 Typ. transfer characteristics
I
D
=f(V
GS
); |V
DS
|>2|I
D
|R
DS(on)max
8 Typ. forward transconductance
g
fs
=f(I
D
);
T
j
=25 °C
0.8
1
0.9
0.8
0.7
0.6
0.7
0.5
0.6
0.4
g
fs
[S]
150 °C
25 °C
I
D
[A]
0.5
0.4
0.3
0.3
0.2
0.2
0.1
0.1
3
4
0
0.0
0.2
0.4
0.6
0.8
0
0
1
2
V
GS
[V]
I
D
[A]
Rev 2.3
page 5
2012-11-21
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参数对比
与BSS123NH6327相近的元器件有:BSS123N。描述及对比如下:
型号 BSS123NH6327 BSS123N
描述 Small Signal Field-Effect Transistor, 0.19A I(D), 100V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3 All Small Signal n-channel products are suitable for automotive applications (excluding 2N7002).
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