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BUP602D

IGBT With Antiparallel Diode (Low forward voltage drop High switching speed Low tail current Latch-up free Including fast free-wheel diode)

器件类别:分立半导体    晶体管   

厂商名称:SIEMENS

厂商官网:http://www.infineon.com/

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器件参数
参数名称
属性值
厂商名称
SIEMENS
包装说明
FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code
unknow
其他特性
HIGH SPEED
最大集电极电流 (IC)
36 A
集电极-发射极最大电压
600 V
配置
SINGLE WITH BUILT-IN DIODE
最大降落时间(tf)
680 ns
门极发射器阈值电压最大值
6.5 V
门极-发射极最大电压
20 V
JEDEC-95代码
TO-218
JESD-30 代码
R-PSFM-T3
元件数量
1
端子数量
3
最高工作温度
150 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
极性/信道类型
N-CHANNEL
功耗环境最大值
150 W
认证状态
Not Qualified
最大上升时间(tr)
110 ns
表面贴装
NO
端子形式
THROUGH-HOLE
端子位置
SINGLE
晶体管应用
MOTOR CONTROL
晶体管元件材料
SILICON
最大关闭时间(toff)
330 ns
标称断开时间 (toff)
250 ns
最大开启时间(吨)
60 ns
标称接通时间 (ton)
40 ns
VCEsat-Max
2.7 V
文档预览
BUP 602D
IGBT With Antiparallel Diode
Preliminary data
• Low forward voltage drop
• High switching speed
• Low tail current
• Latch-up free
• Including fast free-wheel diode
Pin 1
G
Type
BUP 602D
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-gate voltage
Symbol
Values
600
600
Unit
V
Pin 2
C
Ordering Code
Q67040-A4229-A2
Pin 3
E
V
CE
600V
I
C
36A
Package
TO-218 AB
V
CE
V
CGR
V
GE
I
C
R
GE
= 20 kΩ
Gate-emitter voltage
DC collector current
± 20
A
36
22
T
C
= 25 °C
T
C
= 90 °C
Pulsed collector current,
t
p
= 1 ms
I
Cpuls
72
40
T
C
= 25 °C
T
C
= 90 °C
Diode forward current
I
F
31
T
C
= 90 °C
Pulsed diode current,
t
p
= 1 ms
I
Fpuls
180
T
C
= 25 °C
Power dissipation
P
tot
150
W
- 55 ... + 150
- 55 ... + 150
°C
T
C
= 25 °C
Chip or operating temperature
Storage temperature
T
j
T
stg
Semiconductor Group
1
Jul-31-1996
BUP 602D
Maximum Ratings
Parameter
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Thermal Resistance
Thermal resistance, chip case
Diode thermal resistance, chip case
Symbol
-
-
Values
E
55 / 150 / 56
Unit
-
R
thJC
R
thJC
D
0.83
1.5
K/W
Electrical Characteristics,
at T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
min.
Static Characteristics
Gate threshold voltage
Values
typ.
max.
Unit
V
GE(th)
4.5
5.5
2.1
2.2
3
3.3
-
-
6.5
2.7
2.8
-
-
V
V
GE
=
V
CE,
I
C
= 0.5 mA
Collector-emitter saturation voltage
V
CE(sat)
-
-
-
-
V
GE
= 15 V,
I
C
= 20 A,
T
j
= 25 °C
V
GE
= 15 V,
I
C
= 20 A,
T
j
= 125 °C
V
GE
= 15 V,
I
C
= 40 A,
T
j
= 25 °C
V
GE
= 15 V,
I
C
= 40 A,
T
j
= 125 °C
Zero gate voltage collector current
I
CES
-
200
µA
nA
-
100
V
CE
= 600 V,
V
GE
= 0 V,
T
j
= 25 °C
Gate-emitter leakage current
I
GES
V
GE
= 25 V,
V
CE
= 0 V
AC Characteristics
Transconductance
g
fs
4
-
1040
115
66
-
S
pF
-
1400
175
110
V
CE
= 20 V,
I
C
= 20 A
Input capacitance
C
iss
C
oss
-
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
Output capacitance
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
Reverse transfer capacitance
C
rss
-
V
CE
= 25 V,
V
GE
= 0 V,
f
= 1 MHz
Semiconductor Group
2
Jul-31-1996
BUP 602D
Electrical Characteristics,
at T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
min.
Switching Characteristics, Inductive Load at
T
j
= 125 °C
Turn-on delay time
Values
typ.
max.
Unit
t
d(on)
-
40
60
ns
V
CC
= 300 V,
V
GE
= 15 V,
I
C
= 20 A
R
Gon
= 47
Rise time
t
r
-
70
110
V
CC
= 300 V,
V
GE
= 15 V,
I
C
= 20 A
R
Gon
= 47
Turn-off delay time
t
d(off)
-
250
330
V
CC
= 300 V,
V
GE
= -15 V,
I
C
= 20 A
R
Goff
= 47
Fall time
t
f
-
500
680
V
CC
= 300 V,
V
GE
= -15 V,
I
C
= 20 A
R
Goff
= 47
Free-Wheel Diode
Diode forward voltage
V
F
-
-
1.8
1.6
-
-
V
I
F
= 20 A,
V
GE
= 0 V,
T
j
= 25 °C
I
F
= 20 A,
V
GE
= 0 V,
T
j
= 125 °C
Reverse recovery time
t
rr
-
110
160
ns
I
F
= 20 A,
V
R
= -300 V,
V
GE
= 0 V
di
F
/dt = -300 A/µs,
T
j
= 125 °C
Reverse recovery charge
Q
rr
µC
I
F
= 20 A,
V
R
= -300 V,
V
GE
= 0 V
di
F
/dt = -300 A/µs
T
j
= 25 °C
T
j
= 125 °C
-
-
0.6
1.3
1.1
2.4
Semiconductor Group
3
Jul-31-1996
BUP 602D
Power dissipation
P
tot
=
ƒ
(T
C
)
parameter:
T
j
150 °C
160
Collector current
I
C
=
ƒ
(T
C
)
parameter:
V
GE
15 V ,
T
j
150 °C
36
A
W
P
tot
120
I
C
28
24
100
20
80
16
60
12
40
8
4
0
0
20
0
0
20
40
60
80
100
120
°C
160
20
40
60
80
100
120
°C
160
T
C
T
C
Safe operating area
I
C
=
ƒ
(V
CE
)
parameter:
D
= 0,
T
C
= 25°C ,
T
j
150 °C
10
2
tp
= 17.0µs
Transient thermal impedance
Z
th JC
=
ƒ
(t
p
)
parameter:
D = t
p
/
T
10
0
IGBT
A
K/W
I
C
100 µs
Z
thJC
10
1
10
-1
1 ms
D = 0.50
0.20
10
0
10 ms
10
-2
0.10
0.05
single pulse
0.02
0.01
DC
10
-1
0
10
10
-3
-5
10
10
1
10
2
V 10
3
10
-4
10
-3
10
-2
10
-1
s 10
0
V
CE
t
p
Semiconductor Group
4
Jul-31-1996
BUP 602D
Typ. output characteristics
Typ. output characteristics
I
C
=
f
(V
CE
)
parameter:
t
p
= 80 µs,
T
j
= 25 °C
40
I
C
=
f
(V
CE
)
parameter:
t
p
= 80 µs,
T
j
= 125 °C
40
A
I
C
30
17V
15V
13V
11V
9V
7V
A
I
C
30
17V
15V
13V
11V
9V
7V
25
25
20
20
15
15
10
10
5
0
0
5
0
0
1
2
3
V
5
1
2
3
V
5
V
CE
V
CE
Typ. transfer characteristics
I
C
=
f
(V
GE
)
parameter:
t
p
= 80 µs,
V
CE
= 20 V
40
A
I
C
30
25
20
15
10
5
0
0
2
4
6
8
10
V
14
V
GE
Semiconductor Group
5
Jul-31-1996
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参数对比
与BUP602D相近的元器件有:Q67040-A4229-A2。描述及对比如下:
型号 BUP602D Q67040-A4229-A2
描述 IGBT With Antiparallel Diode (Low forward voltage drop High switching speed Low tail current Latch-up free Including fast free-wheel diode) IGBT With Antiparallel Diode (Low forward voltage drop High switching speed Low tail current Latch-up free Including fast free-wheel diode)
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